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Fully coupled dynamic electro-thermal simulation

IEEE transactions on very large scale integration (VLSI) systems, 1997-09, Vol.5 (3), p.250-257

Digele, G.
Lindenkreuz, S.
Kasper, E.

1997

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Lithography-independent nanometer silicon MOSFETs on insulator

IEEE transactions on electron devices, 1996-10, Vol.43 (10), p.1626-1632

Dudek, V.
Appel, W.
Beer, L.
Digele, G.
Hofflinger, B.

1996

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Silicon MOSFETs on insulator with lithography-independent 100 nm channel length

Microelectronics, 1996-11, Vol.27 (8), p.795-802

Dudek, V.
Appel, W.
Beer, L.
Digele, G.
Höfflinger, B.
Schneider, H.

1996

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Electro-Thermal Interaction on Circuit Level under the Influence of Packaging

27th European Solid-State Device Research Conference, 1997, p.460-463

Digele, G.
Lindenkreuz, S.
Kasper, E.

1997

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Electro-thermal circuit simulation of analog controlled power circuitry

Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204), 1998, p.137-142

Digele, G.
Lindenkreuz, S.
Kasper, E.

1998

Volltextzugriff (PDF)

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Fully coupled dynamic electro-thermal simulation

Lithography-independent nanometer silicon MOSFETs on insulator

Silicon MOSFETs on insulator with lithography-independent 100 nm channel length

Electro-Thermal Interaction on Circuit Level under the Influence of Packaging

Electro-thermal circuit simulation of analog controlled power circuitry

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