UB Paderborn / Katalog / Suche / in CDI

Sortiert nach

Einfacher Volltextzugriff von (fast) überall

Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...

Fine-pitch bonding technology with surface-planarized solder micro-bump/polymer hybrid for 3D integration

Japanese Journal of Applied Physics, 2021-02, Vol.60 (2), p.26502

2021

Volltextzugriff (PDF)

Chemical mechanical polishing for indium bond pad damascene processing

Japanese Journal of Applied Physics, 2024-03, Vol.63 (3), p.03SP39

2024

Volltextzugriff (PDF)

Study of the effect of Sn grain boundaries on IMC morphology in solid state inter-diffusion soldering

Scientific reports, 2019-10, Vol.9 (1), p.14862-14, Article 14862

2019

Volltextzugriff (PDF)

Electrochemical deposition of indium from chloride bath for low-temperature microbump bonding

Japanese Journal of Applied Physics, 2022-04, Vol.61 (4), p.41003

2022

Volltextzugriff (PDF)

IP Session on Chiplet: Design, Assembly, and Test

2023 IEEE 41st VLSI Test Symposium (VTS), 2023, p.1-1

2023

Volltextzugriff (PDF)

A Novel Resistance Measurement Methodology for In~Situ UBM/Solder Interfacial Reaction Monitoring

IEEE transactions on components, packaging, and manufacturing technology (2011), 2020-01, Vol.10 (1), p.30-38

2020

Volltextzugriff (PDF)

A Novel Intermetallic Compound Insertion Bonding to Improve Throughput for Sequential 3-D Stacking

IEEE transactions on components, packaging, and manufacturing technology (2011), 2020-04, Vol.10 (4), p.669-678

2020

Volltextzugriff (PDF)

Cryo-FIB Solution Comparison for Characterization of Indium Microbond Structures

Microscopy and microanalysis, 2024-07, Vol.30 (Supplement_1)

2024

Volltextzugriff (PDF)

Fine Pitch Rapid Heat Self-Aligned Assembly and Liquid-Mediated Direct Bonding of Si Chips

IEEE transactions on components, packaging, and manufacturing technology (2011), 2016-06, Vol.6 (6), p.946-953

2016

Volltextzugriff (PDF)

Monolithic 3-D Integration of SRAM and Image Sensor Using Two Layers of Single-Grain Silicon

IEEE transactions on electron devices, 2011-11, Vol.58 (11), p.3954-3961

2011

Volltextzugriff (PDF)

Investigation of Co Thin Film as Buffer Layer Applied to Cu/Sn Eutectic Bonding and UBM With Sn, SnCu, and SAC Solders Joints

IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-11, Vol.7 (11), p.1899-1905

2017

Volltextzugriff (PDF)

Single-Grain Si Thin-Film Transistors for Monolithic 3D-ICs and Flexible Electronics

IEICE transactions on electronics, 2014, Vol.E97.C (4), p.227-237

2014

Volltextzugriff (PDF)

20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering

2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.1891-1895

2024

Volltextzugriff (PDF)

Wet Cu passivation for high throughput fluxless Thermal Compression Bonding of Cu-Sn μbumps for Die-to-Wafer stacking

2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.1859-1862

2024

Volltextzugriff (PDF)

Arsenic-Doped High-Resistivity-Silicon Epitaxial Layers for Integrating Low-Capacitance Diodes

Materials, 2011-12, Vol.4 (12), p.2092-2107

2011

Volltextzugriff (PDF)

Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies and Bond Pad Pitch Scaling Down to 2 µm

2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.40-44

2024

Volltextzugriff (PDF)

Plasma Cleaning and Thermal Compression Bonding of Indium Bumps as Superconducting Interconnects for Cryogenic and Quantum Computing Applications

2024 International Conference on Electronics Packaging (ICEP), 2024, p.267-268

2024

Volltextzugriff (PDF)

Developing TSV wet cleaning chemistry for quantum computing application

Microelectronic engineering, 2023-05, Vol.276, p.112010, Article 112010

2023

Volltextzugriff (PDF)

Process Development and Characterization of Ru-based UBM for In Bumps Integration for Quantum Computing Applications

2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.378-385

2024

Volltextzugriff (PDF)

High Speed Six-Transistor Static Random Access Memory Cells Using Single Grain Thin Film Transistors Fabricated at Low Temperature Process

Japanese Journal of Applied Physics, 2010-03, Vol.49 (3), p.03CA09-03CA09-6

2010

Volltextzugriff (PDF)

Stacking of Single-Grain Thin-Film Transistors

Japanese Journal of Applied Physics, 2009-03, Vol.48 (3S2), p.3

2009

Volltextzugriff (PDF)

A Novel Resistance Measurement Methodology for [Formula Omitted] UBM/Solder Interfacial Reaction Monitoring

IEEE transactions on components, packaging, and manufacturing technology (2011), 2020-01, Vol.10 (1), p.30

2020

Volltextzugriff (PDF)

3D interconnects for quantum computing

2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.821-828

2024

Volltextzugriff (PDF)

Process Challenges During CVD Oxide Deposition on the Backside of 20-\mu m Thin 300-mm Wafers Temporarily Bonded to Glass Carriers

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1584-1589

2023

Volltextzugriff (PDF)

Corrigendum to “High-ohmic resistors fabricated by PureB layer for silicon drift detectors applications” [Solid State Electron. 105 (2015) 6–11]

Solid-state electronics, 2016-05, Vol.119, p.50-50

2016

Volltextzugriff (PDF)

1 – 25 von 77

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(24)
Mit Volltextzugriff
(46)

Publikationsform

Sprache

Englisch
(77)

Erscheinungsjahr

n.n

Thema

Science & Technology
(38)
Technology
(32)
Engineering
(29)
Engineering, Electrical & Electronic
(29)
Stacking
(25)
Bonding
(23)
Three-Dimensional Displays
(17)
Nickel
(16)
Silicon
(14)
Physical Sciences
(13)
Physics
(13)
Physics, Applied
(12)
Materials Science
(11)
Electronic Components
(10)
Intermetallic Compounds
(10)
Low Temperature
(10)
Materials Science, Multidisciplinary
(9)
Copper
(8)
Intermetallic Compound
(8)
Temperature Measurement
(8)

15 weitere anzeigen...

Weniger anzeigen...

Neu hinzugefügt

... seit 30 Tagen
(2)
... seit 90 Tagen
(3)

Menü

Weitere Dienste

Einstellungen

Fine-pitch bonding technology with surface-planarized solder micro-bump/polymer hybrid for 3D integration

Chemical mechanical polishing for indium bond pad damascene processing

Study of the effect of Sn grain boundaries on IMC morphology in solid state inter-diffusion soldering

Electrochemical deposition of indium from chloride bath for low-temperature microbump bonding

IP Session on Chiplet: Design, Assembly, and Test

A Novel Resistance Measurement Methodology for In~Situ UBM/Solder Interfacial Reaction Monitoring

A Novel Intermetallic Compound Insertion Bonding to Improve Throughput for Sequential 3-D Stacking

Cryo-FIB Solution Comparison for Characterization of Indium Microbond Structures

Fine Pitch Rapid Heat Self-Aligned Assembly and Liquid-Mediated Direct Bonding of Si Chips

Monolithic 3-D Integration of SRAM and Image Sensor Using Two Layers of Single-Grain Silicon

Investigation of Co Thin Film as Buffer Layer Applied to Cu/Sn Eutectic Bonding and UBM With Sn, SnCu, and SAC Solders Joints

Single-Grain Si Thin-Film Transistors for Monolithic 3D-ICs and Flexible Electronics

20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering

Wet Cu passivation for high throughput fluxless Thermal Compression Bonding of Cu-Sn μbumps for Die-to-Wafer stacking

Arsenic-Doped High-Resistivity-Silicon Epitaxial Layers for Integrating Low-Capacitance Diodes

Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies and Bond Pad Pitch Scaling Down to 2 µm

Plasma Cleaning and Thermal Compression Bonding of Indium Bumps as Superconducting Interconnects for Cryogenic and Quantum Computing Applications

Developing TSV wet cleaning chemistry for quantum computing application

Process Development and Characterization of Ru-based UBM for In Bumps Integration for Quantum Computing Applications

High Speed Six-Transistor Static Random Access Memory Cells Using Single Grain Thin Film Transistors Fabricated at Low Temperature Process

Stacking of Single-Grain Thin-Film Transistors

A Novel Resistance Measurement Methodology for [Formula Omitted] UBM/Solder Interfacial Reaction Monitoring

3D interconnects for quantum computing

Process Challenges During CVD Oxide Deposition on the Backside of 20-\mu m Thin 300-mm Wafers Temporarily Bonded to Glass Carriers

Corrigendum to “High-ohmic resistors fabricated by PureB layer for silicon drift detectors applications” [Solid State Electron. 105 (2015) 6–11]

Suchergebnisse filtern