UB Paderborn / Katalog / Suche / in CDI

1 – 25 von 33

Sortiert nach

Development of Gated Pinned Avalanche Photodiode Pixels for High-Speed Low-Light Imaging

Sensors (Basel, Switzerland), 2016-08, Vol.16 (8), p.1294

2016

Volltextzugriff (PDF)

Quantum efficiency and dark current evaluation of a backside illuminated CMOS image sensor

Japanese Journal of Applied Physics, 2015-04, Vol.54 (4S), p.4-1-04DE09-6

2015

Volltextzugriff (PDF)

A Backside-Illuminated Charge-Focusing Silicon SPAD With Enhanced Near-Infrared Sensitivity

IEEE transactions on electron devices, 2022-03, Vol.69 (3), p.1129-1136

2022

Volltextzugriff (PDF)

A Near-Infrared Enhanced Silicon Single-Photon Avalanche Diode With a Spherically Uniform Electric Field Peak

IEEE electron device letters, 2021-06, Vol.42 (6), p.879-882

2021

Volltextzugriff (PDF)

The RELAXd project: Development of four-side tilable photon-counting imagers

Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment, 2008-06, Vol.591 (1), p.241-244

2008

Volltextzugriff (PDF)

First Demonstration of Hybrid CMOS Imagers With Simultaneous Very Low Crosstalk and High-Broadband Quantum Efficiency

IEEE transactions on electron devices, 2012-10, Vol.59 (10), p.2723-2726

2012

Volltextzugriff (PDF)

Process induced sub-surface damage in mechanically ground silicon wafers

Semiconductor science and technology, 2008-07, Vol.23 (7), p.075038

2008

Volltextzugriff (PDF)

On the processing aspects of high performance hybrid backside illuminated CMOS imagers

Journal of micromechanics and microengineering, 2011-07, Vol.21 (7), p.074006

2011

Volltextzugriff (PDF)

Influence of Extreme Thinning on 130-nm Standard CMOS Devices for 3-D Integration

IEEE electron device letters, 2008-04, Vol.29 (4), p.322-324

2008

Volltextzugriff (PDF)

High performance Hybrid and Monolithic Backside Thinned CMOS Imagers realized using a new integration process

2006 International Electron Devices Meeting, 2006, p.1-4

2006

Volltextzugriff (PDF)

Grinding and Mixed Silicon Copper CMP of Stacked Patterned Wafers for 3D Integration

MRS proceedings, 2006, Vol.970, Article 0970-Y06-03

2006

Volltextzugriff (PDF)

Enhanced time delay integration imaging using embedded CCD in CMOS technology

2014 IEEE International Electron Devices Meeting, 2014, p.4.6.1-4.6.4

2014

Volltextzugriff (PDF)

The Road towards Fully Hybrid CMOS Imager Sensors

International Symposium on Microelectronics, 2011-01, Vol.2011 (1), p.173-180

2011

Volltextzugriff (PDF)

Development of vertical and tapered via etch for 3D through wafer interconnect technology

2006 8th Electronics Packaging Technology Conference, 2006, p.22-28

2006

Volltextzugriff (PDF)

Processing aspects to achieve high-end hybrid backside illuminated imagers

International Symposium on Microelectronics, 2010-01, Vol.2010 (1), p.372-377

2010

Volltextzugriff (PDF)

Reduction of Electrical Crosstalk in Hybrid Backside Illuminated CMOS Imagers using Deep Trench Isolation

2008 International Interconnect Technology Conference, 2008, p.129-131

2008

Volltextzugriff (PDF)

3D packaging issues for ultrasmall systems-in-a-cube

Solid state technology, 2005-04, Vol.48 (4), p.S3

2005

Volltextzugriff (PDF)

Early brain magnetic resonance imaging findings and neurodevelopmental outcome in children with congenital heart disease: A systematic review

Developmental medicine and child neurology, 2023-12, Vol.65 (12), p.1557-1572

2023

Volltextzugriff (PDF)

Selecting active matter according to motility in an acoustofluidic setup: self-propelled particles and sperm cells

Soft matter, 2023-11, Vol.19 (44), p.8635-8648

2023

Volltextzugriff (PDF)

Electronic witnessing in the medically assisted reproduction laboratory: insights and considerations after 10 years of use

Human reproduction (Oxford), 2023-08, Vol.38 (8), p.1529-1537

2023

Volltextzugriff (PDF)

Loss of GPR3 reduces the amyloid plaque burden and improves memory in Alzheimer's disease mouse models

Science translational medicine, 2015-10, Vol.7 (309), p.309ra164

2015

Volltextzugriff (PDF)

Ovarian Tissue Oocyte-In Vitro Maturation for Fertility Preservation

Journal of visualized experiments, 2024-05 (207)

2024

Volltextzugriff (PDF)

Optimized sperm selection: a highly efficient device for the isolation of progressive motile sperm with low DNA fragmentation index

Journal of assisted reproduction and genetics, 2024-06, Vol.41 (8), p.2201

2024

Volltextzugriff (PDF)

The behavior of pH and osmolality by the type of embryo culture medium and the type of oil

Reproductive biomedicine online, 2022-10, Vol.45, p.e22-e22

2022

Volltextzugriff (PDF)

1 – 25 von 33

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(24)
Mit Volltextzugriff
(28)

Publikationsform

Sprache

Englisch
(33)
Japanisch
(5)

Erscheinungsjahr

n.n

Thema

Science & Technology
(23)
Technology
(13)
Engineering
(11)
Engineering, Electrical & Electronic
(10)
Physical Sciences
(9)
Humans
(8)
Life Sciences & Biomedicine
(8)
Physics
(8)
Cmos
(6)
Female
(5)
Physics, Applied
(5)
Electronics
(4)
Exact Sciences And Technology
(4)
Applied Sciences
(3)
Avalanche Diodes
(3)
Biological And Medical Sciences
(3)
Cmos Integrated Circuits
(3)
Cmos Technology
(3)
Crosstalk
(3)
Dark Current
(3)

15 weitere anzeigen...

Weniger anzeigen...

Neu hinzugefügt

... seit 90 Tagen
(2)

Menü

Weitere Dienste

Einstellungen

Development of Gated Pinned Avalanche Photodiode Pixels for High-Speed Low-Light Imaging

Quantum efficiency and dark current evaluation of a backside illuminated CMOS image sensor

A Backside-Illuminated Charge-Focusing Silicon SPAD With Enhanced Near-Infrared Sensitivity

A Near-Infrared Enhanced Silicon Single-Photon Avalanche Diode With a Spherically Uniform Electric Field Peak

The RELAXd project: Development of four-side tilable photon-counting imagers

First Demonstration of Hybrid CMOS Imagers With Simultaneous Very Low Crosstalk and High-Broadband Quantum Efficiency

Process induced sub-surface damage in mechanically ground silicon wafers

On the processing aspects of high performance hybrid backside illuminated CMOS imagers

Influence of Extreme Thinning on 130-nm Standard CMOS Devices for 3-D Integration

High performance Hybrid and Monolithic Backside Thinned CMOS Imagers realized using a new integration process

Grinding and Mixed Silicon Copper CMP of Stacked Patterned Wafers for 3D Integration

Enhanced time delay integration imaging using embedded CCD in CMOS technology

The Road towards Fully Hybrid CMOS Imager Sensors

Development of vertical and tapered via etch for 3D through wafer interconnect technology

Processing aspects to achieve high-end hybrid backside illuminated imagers

Reduction of Electrical Crosstalk in Hybrid Backside Illuminated CMOS Imagers using Deep Trench Isolation

3D packaging issues for ultrasmall systems-in-a-cube

Early brain magnetic resonance imaging findings and neurodevelopmental outcome in children with congenital heart disease: A systematic review

Selecting active matter according to motility in an acoustofluidic setup: self-propelled particles and sperm cells

De-escalation of axillary treatment in the event of a positive sentinel lymph node biopsy in cT1–2 N0 breast cancer treated with mastectomy: nationwide registry study (BOOG 2013-07)

Electronic witnessing in the medically assisted reproduction laboratory: insights and considerations after 10 years of use

Loss of GPR3 reduces the amyloid plaque burden and improves memory in Alzheimer's disease mouse models

Ovarian Tissue Oocyte-In Vitro Maturation for Fertility Preservation

Optimized sperm selection: a highly efficient device for the isolation of progressive motile sperm with low DNA fragmentation index

The behavior of pH and osmolality by the type of embryo culture medium and the type of oil

Suchergebnisse filtern