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Validation of the Langevin particle dispersion model against experiments on turbulent mixing in a T-junction

Powder technology, 2011, Vol.206 (3), p.312-321

2011

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An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization

Journal of the Electrochemical Society, 2011-01, Vol.158 (6), p.P81-P86

2011

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Mechanical and Electrical Reliability Assessment of Stacking of Ultrathin Chips on Si Interposer Using Back-to-Face Architecture

Journal of electronic materials, 2014-03, Vol.43 (3), p.685-694

2014

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Wide band frequency and in situ characterisation of high permittivity insulators (High- K) for H.F. integrated passives

Microelectronic engineering, 2006-11, Vol.83 (11), p.2184-2188

2006

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Development of a permittivity extraction method for ultra low k dielectrics integrated in advanced interconnects

Microelectronics and reliability, 2007-04, Vol.47 (4), p.769-772

2007

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Full three-dimensional characterization of 25 nm lines for chemically amplified resist simulation

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 2005-11, Vol.23 (6), p.2733-2737

2005

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Accurate global & local circuit leakage current analysis based on design of experiment method

2009 IEEE International Conference on IC Design and Technology, 2009, p.75-78

2009

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Assessment and Characterization of Stress Induced by Via-First TSV Technology

Journal of microelectronics and electronic packaging, 2011-10, Vol.8 (4), p.129-139

2011

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Validity of the effective potential approach for the simulation of quantum confinement effects: A Monte-Carlo study

Journal of computational electronics, 2006-07, Vol.5 (2-3), p.171-175

2006

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Wide band frequency and in situ characterization of high permittivity insulators (high- k) for high-speed integrated passives

Microelectronic engineering, 2005-12, Vol.82 (3), p.548-553

2005

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Investigation on TSV impact on 65nm CMOS devices and circuits

2010 International Electron Devices Meeting, 2010, p.35.1.1-35.1.4

2010

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Mechanical and Electrical Reliability Assessment of Stacking of Ultrathin Chips on Si Interposer Using Back-to-Face Architecture : MECHANICAL RELIABILITY OF ELECTRONIC COMPONENTS

Journal of electronic materials, 2014, Vol.43 (3), p.685-694

2014

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(Invited) An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization

ECS transactions, 2010, Vol.33 (4), p.3-16

2010

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Design of Computer Experiments: A powerful tool for the numerical design of BAW filters

2008 IEEE Ultrasonics Symposium, 2008, p.2185-2188

2008

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A simple and approximate analytical model for the estimation of the thermal resistances in 3D stacks of integrated circuits

18th International Workshop on THERMal INvestigation of ICs and Systems, 2012, p.1-6

de Crecy, F.

2012

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Modeling of stratified two-phase flow in pipes, pumps and other devices

International journal of multiphase flow, 1986, Vol.12 (3), p.307-323

de Crecy, F.

1986

Volltextzugriff (PDF)

Test structure for characterizing metal thickness in damascene CMP technology

2008 IEEE International Conference on Microelectronic Test Structures, 2008, p.210-213

2008

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Optimization of signal propagation performances in interconnects of the 45 nm node by exhaustive analysis of the technological parameters impact

Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005, 2005, p.74-76

2005

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The effect of grid assembly mixing vanes on critical heat flux values and azimuthal location in fuel assemblies

Nuclear engineering and design, 1994-09, Vol.149 (1), p.233-241

DE CRECY, F

1994

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Presentation of a new time domain simulation tool and application to the analysis of advanced interconnect performance dependence on design and process parameters

Proceedings. 8th IEEE Workshop on Signal Propagation on Interconnects, 2004, p.17-20

2004

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Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration

2013 IEEE International 3D Systems Integration Conference (3DIC), 2013, p.1-7

2013

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Assessment of a heat spreading solution for hot spots cooling in compact packages

20th International Workshop on Thermal Investigations of ICs and Systems, 2014, p.1-6

2014

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A comprehensive platform for thermal studies in TSV-based 3D integrated circuits

2014 IEEE International Electron Devices Meeting, 2014, p.35.4.1-35.4.4

2014

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Solder joint fatigue model for large silicon interposers

2013 Eurpoean Microelectronics Packaging Conference (EMPC), 2013, p.1-6

2013

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Reliability study for large silicon interposers report on board

2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.383-389

2013

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Validation of the Langevin particle dispersion model against experiments on turbulent mixing in a T-junction

An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization

Mechanical and Electrical Reliability Assessment of Stacking of Ultrathin Chips on Si Interposer Using Back-to-Face Architecture

Wide band frequency and in situ characterisation of high permittivity insulators (High- K) for H.F. integrated passives

Development of a permittivity extraction method for ultra low k dielectrics integrated in advanced interconnects

Full three-dimensional characterization of 25 nm lines for chemically amplified resist simulation

Accurate global & local circuit leakage current analysis based on design of experiment method

Assessment and Characterization of Stress Induced by Via-First TSV Technology

Validity of the effective potential approach for the simulation of quantum confinement effects: A Monte-Carlo study

Wide band frequency and in situ characterization of high permittivity insulators (high- k) for high-speed integrated passives

Investigation on TSV impact on 65nm CMOS devices and circuits

Mechanical and Electrical Reliability Assessment of Stacking of Ultrathin Chips on Si Interposer Using Back-to-Face Architecture : MECHANICAL RELIABILITY OF ELECTRONIC COMPONENTS

(Invited) An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization

Design of Computer Experiments: A powerful tool for the numerical design of BAW filters

A simple and approximate analytical model for the estimation of the thermal resistances in 3D stacks of integrated circuits

Modeling of stratified two-phase flow in pipes, pumps and other devices

Test structure for characterizing metal thickness in damascene CMP technology

Optimization of signal propagation performances in interconnects of the 45 nm node by exhaustive analysis of the technological parameters impact

The effect of grid assembly mixing vanes on critical heat flux values and azimuthal location in fuel assemblies

Presentation of a new time domain simulation tool and application to the analysis of advanced interconnect performance dependence on design and process parameters

Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration

Assessment of a heat spreading solution for hot spots cooling in compact packages

A comprehensive platform for thermal studies in TSV-based 3D integrated circuits

Solder joint fatigue model for large silicon interposers

Reliability study for large silicon interposers report on board

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