UB Paderborn / Katalog / Suche / in CDI

Sortiert nach

Einfacher Volltextzugriff von (fast) überall

Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...

Effect of gamma-radiation on the transmission and return losses of FC/APC connectors

Journal of instrumentation, 2024-09, Vol.19 (9), p.P09022

2024

Volltextzugriff (PDF)

Reverse selectivity – High silicon nitride and low silicon dioxide removal rates using ceria abrasive-based dispersions

Journal of colloid and interface science, 2010-07, Vol.347 (2), p.267-276

2010

Volltextzugriff (PDF)

Role of Different Additives on Silicon Dioxide Film Removal Rate during Chemical Mechanical Polishing Using Ceria-Based Dispersions

Journal of the Electrochemical Society, 2010, Vol.157 (9), p.H869

2010

Volltextzugriff (PDF)

Influence of adhesion of silica and ceria abrasive nanoparticles on Chemical–Mechanical Planarization of silica surfaces

Applied surface science, 2011-08, Vol.257 (20), p.8518-8524

2011

Volltextzugriff (PDF)

Role of Poly(diallyldimethylammonium chloride) in Selective Polishing of Polysilicon over Silicon Dioxide and Silicon Nitride Films

Langmuir, 2011-04, Vol.27 (7), p.3502-3510

2011

Volltextzugriff (PDF)

Novel phosphate-functionalized silica-based dispersions for selectively polishing silicon nitride over silicon dioxide and polysilicon films

Journal of colloid and interface science, 2010-08, Vol.348 (1), p.114-118

2010

Volltextzugriff (PDF)

Novel α-amine-functionalized silica-based dispersions for selectively polishing polysilicon and Si(1 0 0) over silicon dioxide, silicon nitride or copper during chemical mechanical polishing

Colloids and surfaces. A, Physicochemical and engineering aspects, 2010-11, Vol.371 (1), p.131-136

2010

Volltextzugriff (PDF)

Silicon Nitride Film Removal During Chemical Mechanical Polishing Using Ceria-Based Dispersions

Journal of the Electrochemical Society, 2011-01, Vol.158 (8), p.H763

2011

Volltextzugriff (PDF)

Role of amines and amino acids in enhancing the removal rates of undoped and P-doped polysilicon films during chemical mechanical polishing

Colloids and surfaces. A, Physicochemical and engineering aspects, 2010-08, Vol.366 (1), p.68-73

2010

Volltextzugriff (PDF)

Finite element modeling on electromigration of solder joints in wafer level packages

Microelectronics and reliability, 2010-04, Vol.50 (4), p.547-555

2010

Volltextzugriff (PDF)

Terminalia arjuna - A possible alternative to commercial mouthwashes, against periodontopathic bacteria: An in vitro study

Journal of Dr. NTR university of health sciences, 2020-04, Vol.9 (2), p.98-102

2020

Volltextzugriff (PDF)

Selective Chemical Mechanical Polishing of Silicon Dioxide over Silicon Nitride for Shallow Trench Isolation Using Ceria Slurries

Journal of the Electrochemical Society, 2009, Vol.156 (12), p.H936

2009

Volltextzugriff (PDF)

Role of polycation adsorption in poly-Si, SiO₂ and Si₃N₄ removal during chemical mechanical polishing: Effect of polishing pad surface chemistry

Colloids and surfaces. A, Physicochemical and engineering aspects, 2011-09, Vol.388 (1-3), p.21-28

2011

Volltextzugriff (PDF)

Selective Polishing of Polysilicon during Fabrication of Microelectromechanical Systems Devices

Journal of the Electrochemical Society, 2009, Vol.156 (6), p.H487

2009

Volltextzugriff (PDF)

Performance assessment of plasma current measurement at JET using fibre optics current sensor

Fusion engineering and design, 2021-04, Vol.165, p.112228, Article 112228

2021

Volltextzugriff (PDF)

Charge Density and pH Effects on Polycation Adsorption on Poly-Si, SiO2, and Si3N4 Films and Impact on Removal During Chemical Mechanical Polishing

ACS applied materials & interfaces, 2011-10, Vol.3 (10), p.4126-4132

2011

Volltextzugriff (PDF)

INFLUENCE OF ADHESION OF SILICA AND CERIA ABRASIVE NANOPARTICLES ON CHEMICAL-MECHANICAL PLANARISATION OF SILICA SURFACES

Applied surface science, 2011-01, Vol.257 (20), p.8518-8524

2011

Volltextzugriff (PDF)

Finite element modeling on electromigration of solder joints in wafer level packages : Advances in wafer level packaging

Microelectronics and reliability, 2010, Vol.50 (4), p.547-555

2010

Volltextzugriff (PDF)

Some remarks on finite element modeling of electromigration in solder joints

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), 2010, p.396-402

2010

Volltextzugriff (PDF)

Charge Density and pH Effects on Polycation Adsorption on Poly-Si, SiO 2 , and Si 3 N 4 Films and Impact on Removal During Chemical Mechanical Polishing

ACS applied materials & interfaces, 2011-10, Vol.3 (10), p.4126-4132

2011

Volltextzugriff (PDF)

Estimation of CCL2/MCP-1 levels in serum and gingival crevicular fluid in periodontal health, disease and after treatment - A clinico biochemical study

Journal of orofacial sciences, 2017-07, Vol.9 (2), p.85-90

2017

Volltextzugriff (PDF)

Assessment of current density singularity in electromigration of solder bumps

2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.2192-2196

2011

Volltextzugriff (PDF)

Tunable removal rates of silicon dioxide, silicon nitride and polysilicon films during chemical mechanical polishing

Dandu, Veera P. R

2010

Volltextzugriff (PDF)

Tunable Removal Rates of Silicon Dioxide, Silicon Nitride, and Polysilicon Films

Meeting abstracts (Electrochemical Society), 2010-07, Vol.MA2010-02 (21), p.1458-1458

2010

Volltextzugriff (PDF)

Diversity in HIV epidemic transitions in India: An application of HIV epidemiological metrices and benchmarks

PloS one, 2022-07, Vol.17 (7), p.e0270886-e0270886

2022

Volltextzugriff (PDF)

1 – 25 von 98

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(78)
Mit Volltextzugriff
(74)

Publikationsform

Sprache

Englisch
(98)

Erscheinungsjahr

n.n

Thema

15 weitere anzeigen...

Weniger anzeigen...

Neu hinzugefügt

... seit 30 Tagen
(4)
... seit 90 Tagen
(7)

Menü

Weitere Dienste

Einstellungen

Effect of gamma-radiation on the transmission and return losses of FC/APC connectors

Reverse selectivity – High silicon nitride and low silicon dioxide removal rates using ceria abrasive-based dispersions

Role of Different Additives on Silicon Dioxide Film Removal Rate during Chemical Mechanical Polishing Using Ceria-Based Dispersions

Influence of adhesion of silica and ceria abrasive nanoparticles on Chemical–Mechanical Planarization of silica surfaces

Role of Poly(diallyldimethylammonium chloride) in Selective Polishing of Polysilicon over Silicon Dioxide and Silicon Nitride Films

Novel phosphate-functionalized silica-based dispersions for selectively polishing silicon nitride over silicon dioxide and polysilicon films

Novel α-amine-functionalized silica-based dispersions for selectively polishing polysilicon and Si(1 0 0) over silicon dioxide, silicon nitride or copper during chemical mechanical polishing

Silicon Nitride Film Removal During Chemical Mechanical Polishing Using Ceria-Based Dispersions

Role of amines and amino acids in enhancing the removal rates of undoped and P-doped polysilicon films during chemical mechanical polishing

Finite element modeling on electromigration of solder joints in wafer level packages

Terminalia arjuna - A possible alternative to commercial mouthwashes, against periodontopathic bacteria: An in vitro study

Selective Chemical Mechanical Polishing of Silicon Dioxide over Silicon Nitride for Shallow Trench Isolation Using Ceria Slurries

Role of polycation adsorption in poly-Si, SiO₂ and Si₃N₄ removal during chemical mechanical polishing: Effect of polishing pad surface chemistry

Selective Polishing of Polysilicon during Fabrication of Microelectromechanical Systems Devices

Performance assessment of plasma current measurement at JET using fibre optics current sensor

Charge Density and pH Effects on Polycation Adsorption on Poly-Si, SiO2, and Si3N4 Films and Impact on Removal During Chemical Mechanical Polishing

INFLUENCE OF ADHESION OF SILICA AND CERIA ABRASIVE NANOPARTICLES ON CHEMICAL-MECHANICAL PLANARISATION OF SILICA SURFACES

Finite element modeling on electromigration of solder joints in wafer level packages : Advances in wafer level packaging

Some remarks on finite element modeling of electromigration in solder joints

Charge Density and pH Effects on Polycation Adsorption on Poly-Si, SiO 2 , and Si 3 N 4 Films and Impact on Removal During Chemical Mechanical Polishing

Estimation of CCL2/MCP-1 levels in serum and gingival crevicular fluid in periodontal health, disease and after treatment - A clinico biochemical study

Assessment of current density singularity in electromigration of solder bumps

Tunable removal rates of silicon dioxide, silicon nitride and polysilicon films during chemical mechanical polishing

Tunable Removal Rates of Silicon Dioxide, Silicon Nitride, and Polysilicon Films

Diversity in HIV epidemic transitions in India: An application of HIV epidemiological metrices and benchmarks

Suchergebnisse filtern