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Investigating High Opacity and Increased Activation Energy in the Multi-Trigger Resist

Journal of Photopolymer Science and Technology, 2021/06/11, Vol.34(1), pp.75-80

2021

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Cost-Effective Sub-20 nm Lithography: Smart Chemicals to the Rescue

Journal of Photopolymer Science and Technology, 2011/06/21, Vol.24(1), pp.33-42

Dammel, Ralph R.

2011

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A Novel Resist Freeze Process for Double Imaging

Journal of Photopolymer Science and Technology, 2008/06/24, Vol.21(5), pp.655-663

2008

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The Photopolymer Science and Technology Award

Journal of Photopolymer Science and Technology, 2011/06/21, Vol.24(1), pp.3-4

Dammel, Ralph R.

2011

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Spin-on Trilayer Approaches to High NA 193nm Lithography

Journal of Photopolymer Science and Technology, 2007, Vol.20(5), pp.697-705

2007

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Possible Origins and Some Methods to Minimize LER

Journal of Photopolymer Science and Technology, 2005, Vol.18(4), pp.451-456

2005

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Effect of Amine Additives on LWR and LER as Studied by Extraction Parameters

Journal of Photopolymer Science and Technology, 2006, Vol.19(3), pp.327-334

2006

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Cost-Effective Sub-20 nm Lithography

Journal of photopolymer science and technology, 2011-01, Vol.24 (1), p.33

R. Dammel, Ralph

2011

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Leaching Phenomena and their Suppresion in 193 nm Immersion Lithography

Journal of Photopolymer Science and Technology, 2005, Vol.18(5), pp.593-602

2005

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Carborane-Based Photoacid Generators: New Superacids For 193nm and EUV Lithography

Journal of photopolymer science and technology, 2007, Vol.20 (5), p.627-635

2007

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New Fluorinated Resins for 157 nm Lithography Application

Journal of Photopolymer Science and Technology, 2003, Vol.16(4), pp.581-590

2003

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New Developments In High-Performance Resist Materials

Journal of Photopolymer Science and Technology, 1998, Vol.11(4), pp.687-703

Dammel, Ralph R.

1998

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193 nm Resist Line Collapse Study by Modifying the Resist Polymer and Process Conditions with Utilizing FIRM Process

Journal of Photopolymer Science and Technology, 2004, Vol.17(4), pp.527-534

2004

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Responding to the Challenge: Materials Design for Immersion Lithography

Journal of Photopolymer Science and Technology, 2006, Vol.19(4), pp.555-563

2006

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A percolation view of novolak dissolution. 2. The statistics of a three-dimensional cubic percolation field and a generalized scaling law

Macromolecules, 1993-07, Vol.26 (15), p.3862-3869

1993

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193 nm Immersion Lithography - Taking The Plunge

Journal of Photopolymer Science and Technology, 2004, Vol.17(4), pp.587-601

2004

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Theoretical Basis For A New Development Rate Model For Positive Photoresists

Journal of Photopolymer Science and Technology, 1997, Vol.10(3), pp.379-385

Dammel, Ralph R.

1997

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A Percolation View of Novolak Dissolution. 3. Dissolution Inhibition

Macromolecules, 1994-06, Vol.27 (12), p.3330-3336

1994

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Layer-Specific Resists for 193nm Lithography

Journal of Photopolymer Science and Technology, 2000, Vol.13(4), pp.607-615

2000

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Optimization of 193nm Contact Hole Resists for 100nm Node

Journal of Photopolymer Science and Technology, 2002, Vol.15(4), pp.549-558

2002

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Contact precautions for methicillin-resistant Staphylococcus aureus colonization: Costly and unnecessary?

American journal of infection control, 2012-08, Vol.40 (6), p.535-538

2012

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New Resin Systems for 157nm Lithography

Journal of Photopolymer Science and Technology, 2001, Vol.14(4), pp.603-611

2001

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Carborane-Based Photoacid Generators: New Superacids For 193 nm And EUV Lithography

Journal of Photopolymer Science and Technology, 2007, Vol.20(5), pp.627-635

2007

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Mechanistic Studies on the CD Degradation of 193nm Resists during SEM Inspection

Journal of Photopolymer Science and Technology, 2001, Vol.14(3), pp.407-417

2001

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Optimization of 193 nm Contact Hole Resists for 100 nm Node

Journal of photopolymer science and technology, 2002, Vol.15 (4), p.549-558

2002

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Investigating High Opacity and Increased Activation Energy in the Multi-Trigger Resist

Cost-Effective Sub-20 nm Lithography: Smart Chemicals to the Rescue

A Novel Resist Freeze Process for Double Imaging

The Photopolymer Science and Technology Award

Spin-on Trilayer Approaches to High NA 193nm Lithography

Possible Origins and Some Methods to Minimize LER

Effect of Amine Additives on LWR and LER as Studied by Extraction Parameters

Cost-Effective Sub-20 nm Lithography

Leaching Phenomena and their Suppresion in 193 nm Immersion Lithography

Carborane-Based Photoacid Generators: New Superacids For 193nm and EUV Lithography

New Fluorinated Resins for 157 nm Lithography Application

New Developments In High-Performance Resist Materials

193 nm Resist Line Collapse Study by Modifying the Resist Polymer and Process Conditions with Utilizing FIRM Process

Responding to the Challenge: Materials Design for Immersion Lithography

A percolation view of novolak dissolution. 2. The statistics of a three-dimensional cubic percolation field and a generalized scaling law

193 nm Immersion Lithography - Taking The Plunge

Theoretical Basis For A New Development Rate Model For Positive Photoresists

A Percolation View of Novolak Dissolution. 3. Dissolution Inhibition

Layer-Specific Resists for 193nm Lithography

Optimization of 193nm Contact Hole Resists for 100nm Node

Contact precautions for methicillin-resistant Staphylococcus aureus colonization: Costly and unnecessary?

New Resin Systems for 157nm Lithography

Carborane-Based Photoacid Generators: New Superacids For 193 nm And EUV Lithography

Mechanistic Studies on the CD Degradation of 193nm Resists during SEM Inspection

Optimization of 193 nm Contact Hole Resists for 100 nm Node

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