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Vibration lifetime modelling of PCB assemblies using steinberg model

Microelectronics and reliability, 2005-09, Vol.45 (9), p.1658-1661

2005

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Long-term Reliability Prediction of 935 nm LEDs Using Failure Laws and Low Acceleration Factor Ageing Tests

Quality and reliability engineering international, 2005-10, Vol.21 (6), p.571-594

2005

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Improved physical understanding of intermittent failure in continuous monitoring method

Microelectronics and reliability, 2006-09, Vol.46 (9), p.1886-1891

2006

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Torsion test applied for reballing and solder paste volume evaluation

Microelectronics and reliability, 2007-09, Vol.47 (9), p.1663-1667

2007

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High temperature reliability testing of aluminum and tantalum electrolytic capacitors

Microelectronics and reliability, 2002-06, Vol.42 (6), p.835-840

2002

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Reliability estimation of BGA and CSP assemblies using degradation law model and technological parameters deviations

Microelectronics and reliability, 2003-07, Vol.43 (7), p.1137-1144

2003

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Early failure signatures of 1310 nm laser modules using electrical, optical and spectral measurements

Measurement : journal of the International Measurement Confederation, 2003-09, Vol.34 (2), p.157-178

2003

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Reliability evaluation of adhesive bonded SMT components in industrial applications

Microelectronics and reliability, 2000-07, Vol.40 (7), p.1227-1234

2000

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A physical approach on SCOBIC investigation in VLSI

Microelectronics and reliability, 2003, Vol.43 (1), p.173-177

2003

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An improved method for automatic detection and location of defects in electronic components using scanning ultrasonic microscopy

IEEE transactions on instrumentation and measurement, 2003-02, Vol.52 (1), p.135-142

2003

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Reliability of Low-Cost PCB Interconnections for Telecommunication Applications

Microelectronics and reliability, 2004-09, Vol.44 (9), p.1299-1304

2004

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Moisture diffusion in BCB resins used for MEMS packaging

Microelectronics and reliability, 2003, Vol.43 (9), p.1939-1944

2003

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Study of influence of failure modes on lifetime distribution prediction of 1.55 μm DFB Laser diodes using weak drift of monitored parameters during ageing tests

Microelectronics and reliability, 2004-09, Vol.44 (9), p.1337-1342

2004

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Acoustic analysis of an assembly: Structural identification by signal processing (wavelets)

Microelectronics and reliability, 2002-09, Vol.42 (9), p.1517-1522

2002

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Three-dimensional FEM simulations of thermomechanical stresses in 1.55 μm Laser modules

Microelectronics and reliability, 2003-07, Vol.43 (7), p.1125-1136

2003

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Ageing simulation of MOSFET circuit using a VHDL-AMS behavioural modelling: an experimental case study

Microelectronics and reliability, 2003, Vol.43 (9), p.1513-1518

2003

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Behavioral study of passive components and coating materials under isostatic pressure and temperature stress conditions

Microelectronics and reliability, 2002-07, Vol.42 (7), p.1113-1120, Article 1113

2002

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Electroluminescence spectroscopy for reliability investigations of 1.55 μm bulk semiconductor optical amplifier

Microelectronics and reliability, 2005-09, Vol.45 (9), p.1593-1599

2005

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Contribution to ageing simulation of complex analogue circuit using VHDL-AMS behavioural modelling language

Microelectronics and reliability, 2002, Vol.42 (9), p.1353-1358

2002

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First steps toward ageing simulation of complex analogue circuits with behavioural modelling

2005 IEEE International Integrated Reliability Workshop, 2005, p.4 pp.

2005

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Impact of 1.55 μm laser diode degradation laws on fibre optic system performances using a system simulator

Microelectronics and reliability, 2003-09, Vol.43 (9), p.1743-1749

2003

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Application of Picosecond Ultrasonics to Non-Destructive Analysis in VLSI circuits

Microelectronics and reliability, 2003-09, Vol.43 (9), p.1803-1807

2003

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Localization of defects in die-attach assembly by continuous wavelet transform using scanning acoustic microscopy

Microelectronics and reliability, 1999, Vol.39 (6), p.1095-1101

1999

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Thermoreflectance optical test probe for the measurement of current-induced temperature changes in microelectronic components

Quality and reliability engineering international, 1993-07, Vol.9 (4), p.303-308

1993

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Structural analysis of integrated circuits using scanning laser ultrasonics

2004 IEEE International Reliability Physics Symposium. Proceedings, 2004, p.375-380

2004

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Vibration lifetime modelling of PCB assemblies using steinberg model

Long-term Reliability Prediction of 935 nm LEDs Using Failure Laws and Low Acceleration Factor Ageing Tests

Improved physical understanding of intermittent failure in continuous monitoring method

Torsion test applied for reballing and solder paste volume evaluation

High temperature reliability testing of aluminum and tantalum electrolytic capacitors

Reliability estimation of BGA and CSP assemblies using degradation law model and technological parameters deviations

Early failure signatures of 1310 nm laser modules using electrical, optical and spectral measurements

Reliability evaluation of adhesive bonded SMT components in industrial applications

A physical approach on SCOBIC investigation in VLSI

An improved method for automatic detection and location of defects in electronic components using scanning ultrasonic microscopy

Reliability of Low-Cost PCB Interconnections for Telecommunication Applications

Moisture diffusion in BCB resins used for MEMS packaging

Study of influence of failure modes on lifetime distribution prediction of 1.55 μm DFB Laser diodes using weak drift of monitored parameters during ageing tests

Acoustic analysis of an assembly: Structural identification by signal processing (wavelets)

Three-dimensional FEM simulations of thermomechanical stresses in 1.55 μm Laser modules

Ageing simulation of MOSFET circuit using a VHDL-AMS behavioural modelling: an experimental case study

Behavioral study of passive components and coating materials under isostatic pressure and temperature stress conditions

Electroluminescence spectroscopy for reliability investigations of 1.55 μm bulk semiconductor optical amplifier

Contribution to ageing simulation of complex analogue circuit using VHDL-AMS behavioural modelling language

First steps toward ageing simulation of complex analogue circuits with behavioural modelling

Impact of 1.55 μm laser diode degradation laws on fibre optic system performances using a system simulator

Application of Picosecond Ultrasonics to Non-Destructive Analysis in VLSI circuits

Localization of defects in die-attach assembly by continuous wavelet transform using scanning acoustic microscopy

Thermoreflectance optical test probe for the measurement of current-induced temperature changes in microelectronic components

Structural analysis of integrated circuits using scanning laser ultrasonics

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