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The study of constructing evaluation indicators for the implementation of employee assistance programs in public sectors

Frontiers in psychology, 2024-04, Vol.15, p.1339291-1339291

2024

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In planta biocontrol of soilborne Fusarium wilt of banana through a plant endophytic bacterium, Burkholderia cenocepacia 869T2

Plant and soil, 2015-02, Vol.387 (1-2), p.295-306

2015

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A molecular diagnosis method using real-time PCR for quantification and detection of Fusarium oxysporum f. sp. cubense race 4

European journal of plant pathology, 2013-02, Vol.135 (2), p.395-405

2013

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Fuzzy dynamic programming: an application to unit commitment

IEEE transactions on power systems, 1991-08, Vol.6 (3), p.1231-1237

1991

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Dispatch of direct load control using dynamic programming

IEEE transactions on power systems, 1991-08, Vol.6 (3), p.1056-1061

1991

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Reliability test for integrated Glass interposer

2016 International Conference on Electronics Packaging (ICEP), 2016, p.48-51

2016

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Reliability behaviors of an exposed die FCCSP on a substrate with ultra-low CTE laminate material

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2015, p.241-244

2015

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Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.548-554

2012

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Dynamic security constrained multi-area unit commitment

IEEE transactions on power systems, 1991-08, Vol.6 (3), p.1049-1055

1991

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Effects of UBM structure/material on the reliability performance of 3D chip stacking with 30μm-pitch solder micro bump interconnections

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.1287-1292

2012

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Assembly of 3D chip stack with 30μm-pitch micro interconnects using novel arrayed-particles anisotropic conductive film

2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.71-76

2013

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The development of high through-put micro-bump-bonded process with non-conductive paste (NCP)

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012, p.114-118

2012

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Low Frequency Oscillations in Longitudinal Power Systems: Experience with Dynamic Stability of Taiwan Power System

IEEE transactions on power systems, 1987-02, Vol.2 (1), p.92-98

1987

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Low temperature bonding using non-conductive adhesive for 3D chip stacking with 30μm-pitch micro solder bump interconnections

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.1656-1661

2012

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Evaluation of fine-pitch chip-to-chip interconnects using ACF material with arrayed particles

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012, p.171-174

2012

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Reliability performance of 30μm-pitch solder micro bump fluxless bonding interconnections

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018, p.419-422

2018

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A personal computer based interactive software for power system operation education

IEEE transactions on power systems, 1992-11, Vol.7 (4), p.1591-1597

1992

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Utilization of Zn alloy for the manufacture of automotive power device modules

2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2015, p.546-549

2015

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Effect of metal finishing fabricated by electro and Electroless plating process on reliability performance of 30μm-pitch solder micro bump interconnection

2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.653-659

2013

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The electrical characterizations of glass interposer for integrated reliability test

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2015, p.336-339

2015

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Development of 30 μm pitch Cu/Ni/SnAg micro-bump-bonded chip-on-chip (COC) interconnects

2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, 2010, p.1-4

2010

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Bonding and reliability assessment of 30 μm pitch solder micro bump interconnection with various UBM structure for 3D chip stacking

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011, p.454-457

2011

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Development of micro-bump-bonded processes for 3DIC stacking with high throughput

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011, p.366-369

2011

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Low temperature bonding of 30um pitch micro bump interconnection for 3D IC stacking using non-conductive adhesive

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011, p.478-481

2011

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A rule-based expert system for steady-state stability analysis (of power systems)

IEEE transactions on power systems, 1991-05, Vol.6 (2), p.771-777

1991

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The study of constructing evaluation indicators for the implementation of employee assistance programs in public sectors

In planta biocontrol of soilborne Fusarium wilt of banana through a plant endophytic bacterium, Burkholderia cenocepacia 869T2

A molecular diagnosis method using real-time PCR for quantification and detection of Fusarium oxysporum f. sp. cubense race 4

Fuzzy dynamic programming: an application to unit commitment

Dispatch of direct load control using dynamic programming

Reliability test for integrated Glass interposer

Reliability behaviors of an exposed die FCCSP on a substrate with ultra-low CTE laminate material

Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP

Dynamic security constrained multi-area unit commitment

Effects of UBM structure/material on the reliability performance of 3D chip stacking with 30μm-pitch solder micro bump interconnections

Assembly of 3D chip stack with 30μm-pitch micro interconnects using novel arrayed-particles anisotropic conductive film

The development of high through-put micro-bump-bonded process with non-conductive paste (NCP)

Low Frequency Oscillations in Longitudinal Power Systems: Experience with Dynamic Stability of Taiwan Power System

Low temperature bonding using non-conductive adhesive for 3D chip stacking with 30μm-pitch micro solder bump interconnections

Evaluation of fine-pitch chip-to-chip interconnects using ACF material with arrayed particles

Reliability performance of 30μm-pitch solder micro bump fluxless bonding interconnections

A personal computer based interactive software for power system operation education

Utilization of Zn alloy for the manufacture of automotive power device modules

Effect of metal finishing fabricated by electro and Electroless plating process on reliability performance of 30μm-pitch solder micro bump interconnection

The electrical characterizations of glass interposer for integrated reliability test

Development of 30 μm pitch Cu/Ni/SnAg micro-bump-bonded chip-on-chip (COC) interconnects

Bonding and reliability assessment of 30 μm pitch solder micro bump interconnection with various UBM structure for 3D chip stacking

Development of micro-bump-bonded processes for 3DIC stacking with high throughput

Low temperature bonding of 30um pitch micro bump interconnection for 3D IC stacking using non-conductive adhesive

A rule-based expert system for steady-state stability analysis (of power systems)

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