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The JAK2/STAT3/CCND2 Axis promotes colorectal Cancer stem cell persistence and radioresistance

Journal of experimental & clinical cancer research, 2019-09, Vol.38 (1), p.399-399, Article 399

2019

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Inhibition of LEF1-Mediated DCLK1 by Niclosamide Attenuates Colorectal Cancer Stemness

Clinical cancer research, 2019-02, Vol.25 (4), p.1415-1429

2019

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Machine learning with in silico analysis markedly improves survival prediction modeling in colon cancer patients

Cancer medicine (Malden, MA), 2023-03, Vol.12 (6), p.7603-7615

2023

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Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages

Applied surface science, 2019-11, Vol.495, p.143487, Article 143487

2019

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The Small-Molecule Wnt Inhibitor ICG-001 Efficiently Inhibits Colorectal Cancer Stemness and Metastasis by Suppressing MEIS1 Expression

International journal of molecular sciences, 2021-12, Vol.22 (24), p.13413

2021

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Microstructures and Mechanical Properties of the Sn58wt.%Bi Composite Solders with Sn Decorated MWCNT Particles

Journal of electronic materials, 2019-03, Vol.48 (3), p.1746-1753

2019

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DCLK1 promotes colorectal cancer stemness and aggressiveness via the XRCC5/COX2 axis

Theranostics, 2022-01, Vol.12 (12), p.5258-5271

2022

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Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bonding

Journal of materials science. Materials in electronics, 2020-12, Vol.31 (24), p.22926-22932

2020

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Effect of Ag-decorated MWCNT on the mechanical and thermal property of Sn58Bi solder joints for FCLED package

Journal of materials science. Materials in electronics, 2020-07, Vol.31 (13), p.10170-10176

2020

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Microstructures and Mechanical Properties of Sn-58 wt.% Bi Solder with Ag-Decorated Multiwalled Carbon Nanotubes Under 85°C/85% Relative Humidity Environmental Conditions

Journal of electronic materials, 2020-02, Vol.49 (2), p.1527-1533

2020

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Mechanical Properties of Cu-Core Solder Balls with ENEPIG Surface Finish

Journal of electronic materials, 2020-10, Vol.49 (10), p.6073-6079

2020

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Electromigration Behavior of Cu Core Solder Joints Under High Current Density

Electronic Materials Letters, 2020, 16(6), , pp.513-519

2020

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Effect of SDBS on the oxidation reliability of screen-printed Cu circuits

Journal of materials science. Materials in electronics, 2020-02, Vol.31 (4), p.3035-3041

2020

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Aberrant activation of the CD45-Wnt signaling axis promotes stemness and therapy resistance in colorectal cancer cells

Theranostics, 2021-01, Vol.11 (18), p.8755-8770

2021

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Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package

Journal of materials science. Materials in electronics, 2020-05, Vol.31 (9), p.6835-6842

2020

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Effect of Sn-Decorated MWCNTs on the Mechanical Reliability of Sn–58Bi Solder

Electronic Materials Letters, 2019, 15(6), , pp.693-701

2019

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Pressureless transient liquid phase sintering bonding in air using Ni and Sn–58Bi for high-temperature packaging applications

Journal of materials science. Materials in electronics, 2019-10, Vol.30 (20), p.18848-18857

2019

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Pressureless Cu–Cu bonding using hybrid Cu–epoxy paste and its reliability

Journal of materials science. Materials in electronics, 2021-02, Vol.32 (3), p.3054-3065

2021

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Lipid raft‐disrupting miltefosine preferentially induces the death of colorectal cancer stem‐like cells

Clinical and translational medicine, 2021-11, Vol.11 (11), p.e552-n/a

2021

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Thermal and mechanical property of FCLED package component interconnected with Sn–MWCNT composite solder

Journal of materials science. Materials in electronics, 2019-07, Vol.30 (14), p.12869-12875

2019

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Fabrication of Novel Ag Flake Composite Films Using a CMC/PEI Cross-Linking Process

Electronic Materials Letters, 2020, 16(4), , pp.332-339

2020

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Thermal and Thermomechanical Behaviors of the Fan-Out Package With Embedded Ag Patterns

IEEE transactions on components, packaging, and manufacturing technology (2011), 2020-09, Vol.10 (9), p.1432-1437

2020

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Transient Liquid Phase Sintering of Ni and Sn-58Bi on Microstructures and Mechanical Properties for Ni–Ni Bonding

Electronic Materials Letters, 2020, 16(4), , pp.347-354

2020

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Effect of PVP on fabrication of Cu nanoparticles using an electrical wire explosion method

Journal of materials science. Materials in electronics, 2019-02, Vol.30 (4), p.4079-4084

2019

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Mechanical properties of Sn-58 wt%Bi solder containing Ag-decorated MWCNT with thermal aging tests

Journal of alloys and compounds, 2020-04, Vol.820, p.153077, Article 153077

2020

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The JAK2/STAT3/CCND2 Axis promotes colorectal Cancer stem cell persistence and radioresistance

Inhibition of LEF1-Mediated DCLK1 by Niclosamide Attenuates Colorectal Cancer Stemness

Machine learning with in silico analysis markedly improves survival prediction modeling in colon cancer patients

Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages

The Small-Molecule Wnt Inhibitor ICG-001 Efficiently Inhibits Colorectal Cancer Stemness and Metastasis by Suppressing MEIS1 Expression

Microstructures and Mechanical Properties of the Sn58wt.%Bi Composite Solders with Sn Decorated MWCNT Particles

DCLK1 promotes colorectal cancer stemness and aggressiveness via the XRCC5/COX2 axis

Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bonding

Effect of Ag-decorated MWCNT on the mechanical and thermal property of Sn58Bi solder joints for FCLED package

Microstructures and Mechanical Properties of Sn-58 wt.% Bi Solder with Ag-Decorated Multiwalled Carbon Nanotubes Under 85°C/85% Relative Humidity Environmental Conditions

Mechanical Properties of Cu-Core Solder Balls with ENEPIG Surface Finish

Electromigration Behavior of Cu Core Solder Joints Under High Current Density

Effect of SDBS on the oxidation reliability of screen-printed Cu circuits

Aberrant activation of the CD45-Wnt signaling axis promotes stemness and therapy resistance in colorectal cancer cells

Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package

Effect of Sn-Decorated MWCNTs on the Mechanical Reliability of Sn–58Bi Solder

Pressureless transient liquid phase sintering bonding in air using Ni and Sn–58Bi for high-temperature packaging applications

Pressureless Cu–Cu bonding using hybrid Cu–epoxy paste and its reliability

Lipid raft‐disrupting miltefosine preferentially induces the death of colorectal cancer stem‐like cells

Thermal and mechanical property of FCLED package component interconnected with Sn–MWCNT composite solder

Fabrication of Novel Ag Flake Composite Films Using a CMC/PEI Cross-Linking Process

Thermal and Thermomechanical Behaviors of the Fan-Out Package With Embedded Ag Patterns

Transient Liquid Phase Sintering of Ni and Sn-58Bi on Microstructures and Mechanical Properties for Ni–Ni Bonding

Effect of PVP on fabrication of Cu nanoparticles using an electrical wire explosion method

Mechanical properties of Sn-58 wt%Bi solder containing Ag-decorated MWCNT with thermal aging tests

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