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Assessment of Thermal Impact on Performance of Metamorphic High-Electron-Mobility Transistors on Polymer Substrates Using Flip-Chip-on-Board Technology

Applied physics express, 2013-12, Vol.6 (12), p.126701

2013

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Design of Flip-Chip Interconnect Using Epoxy-Based Underfill Up to V -Band Frequencies With Excellent Reliability

IEEE transactions on microwave theory and techniques, 2010-08, Vol.58 (8), p.2244-2250

2010

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Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate

Japanese Journal of Applied Physics, 2011-09, Vol.50 (9), p.096503-096503-5

2011

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Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHz

IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-03, Vol.2 (3), p.402-409

2012

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An 80 nm In0.7Ga0.3As MHEMT with flip-chip packaging for W-band low noise applications

2010 22nd International Conference on Indium Phosphide and Related Materials (IPRM), 2010, p.1-4

2010

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InGaP/GaAs Dual-Junction Solar Cell with AlGaAs/GaAs Tunnel Diode Grown on 10° off Misoriented GaAs Substrate

Japanese Journal of Applied Physics, 2012-08, Vol.51 (8), p.080208-080208-3

2012

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Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications

IEEE microwave and wireless components letters, 2014-01, Vol.24 (1), p.11-13

2014

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A flip-chip packaged 80-nm In0.7Ga0.3As MHEMT for millimeter-wave low-noise applications

Microelectronic engineering, 2011-02, Vol.88 (2), p.183-186

2011

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Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate

Japanese Journal of Applied Physics, 2011-09, Vol.50 (9R), p.96503

2011

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Design and Fabrication of 0/1-Level RF-Via Interconnect for RF-MEMS Packaging Applications

IEEE transactions on advanced packaging, 2010-02, Vol.33 (1), p.30-36

2010

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Design of Flip-Chip Interconnect Using Epoxy-Based Underfill Up to [Formula Omitted]-Band Frequencies With Excellent Reliability

IEEE transactions on microwave theory and techniques, 2010-08, Vol.58 (8), p.2244-2250

2010

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V-Band Flip-Chip Assembled Gain Block Using In$_{0.6}$Ga$_{0.4}$As Metamorphic High-Electron-Mobility Transistor Technology

Applied physics express, 2011-10, Vol.4 (10), p.104105

2011

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Bonding temperature effect on the performance of flip chip assembled 150nm mHEMT device on organic substrate

2010 International Conference on Enabling Science and Nanotechnology (ESciNano), 2010, p.1-2

2010

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InGaP/GaAs Dual-Junction Solar Cell with AlGaAs/GaAs Tunnel Diode Grown on 10° off Misoriented GaAs Substrate

Japanese Journal of Applied Physics, 2012-08, Vol.51 (8R), p.80208

2012

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A flip-chip packaged 80-nm In sub(0.7)Ga sub(0.3)As MHEMT for millimeter-wave low-noise applications

Microelectronic engineering, 2011-02, Vol.88 (2), p.183-186

2011

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A flip-chip packaged 80-nm In 0.7Ga 0.3As MHEMT for millimeter-wave low-noise applications

Microelectronic engineering, 2011, Vol.88 (2), p.183-186

2011

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Flip-Chip Packaging of In 0.6 Ga 0.4 As MHEMT Device on Low-Cost Organic Substrate for W-Band Applications

ECS transactions, 2010-10, Vol.33 (13), p.171-176

2010

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An experimental study on fuzzy control for indoor air quality and the energy consumption in a building

2015 International Conference on Machine Learning and Cybernetics (ICMLC), 2015, Vol.1, p.452-455

2015

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Unusual Mesoporous Titanium Niobium Oxides Realizing Sodium‐Ion Batteries Operated at −40 °C

Advanced materials (Weinheim), 2022-07, Vol.34 (28), p.e2202873-n/a

2022

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Versatile Nanoemulsion Assembly Approach to Synthesize Functional Mesoporous Carbon Nanospheres with Tunable Pore Sizes and Architectures

Journal of the American Chemical Society, 2019-05, Vol.141 (17), p.7073-7080

2019

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Synthesis of Fully Exposed Single‐Atom‐Layer Metal Clusters on 2D Ordered Mesoporous TiO2 Nanosheets

Angewandte Chemie International Edition, 2022-10, Vol.61 (43), p.e202211307-n/a

International ed. in English, 2022

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Inorganic-organic competitive coating strategy derived uniform hollow gradient-structured ferroferric oxide-carbon nanospheres for ultra-fast and long-term lithium-ion battery

Nature communications, 2021-05, Vol.12 (1), p.2973-10, Article 2973

2021

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Sequential Chemistry Toward Core–Shell Structured Metal Sulfides as Stable and Highly Efficient Visible‐Light Photocatalysts

Angewandte Chemie International Edition, 2020-02, Vol.59 (8), p.3287-3293

International ed. in English, 2020

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Ultrahigh Adsorption Capacity and Kinetics of Vertically Oriented Mesoporous Coatings for Removal of Organic Pollutants

Small (Weinheim an der Bergstrasse, Germany), 2021-08, Vol.17 (32), p.e2101363-n/a

2021

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Micelles Cascade Assembly to Tandem Porous Catalyst for Waste Plastics Upcycling

Angewandte Chemie International Edition, 2024-06, Vol.63 (26), p.e202405252-n/a

International ed. in English, 2024

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Assessment of Thermal Impact on Performance of Metamorphic High-Electron-Mobility Transistors on Polymer Substrates Using Flip-Chip-on-Board Technology

Design of Flip-Chip Interconnect Using Epoxy-Based Underfill Up to V -Band Frequencies With Excellent Reliability

Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate

Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHz

An 80 nm In0.7Ga0.3As MHEMT with flip-chip packaging for W-band low noise applications

InGaP/GaAs Dual-Junction Solar Cell with AlGaAs/GaAs Tunnel Diode Grown on 10° off Misoriented GaAs Substrate

Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications

A flip-chip packaged 80-nm In0.7Ga0.3As MHEMT for millimeter-wave low-noise applications

Flip-Chip Packaging of Low-Noise Metamorphic High Electron Mobility Transistors on Low-Cost Organic Substrate

Design and Fabrication of 0/1-Level RF-Via Interconnect for RF-MEMS Packaging Applications

Design of Flip-Chip Interconnect Using Epoxy-Based Underfill Up to [Formula Omitted]-Band Frequencies With Excellent Reliability

V-Band Flip-Chip Assembled Gain Block Using In$_{0.6}$Ga$_{0.4}$As Metamorphic High-Electron-Mobility Transistor Technology

Bonding temperature effect on the performance of flip chip assembled 150nm mHEMT device on organic substrate

InGaP/GaAs Dual-Junction Solar Cell with AlGaAs/GaAs Tunnel Diode Grown on 10° off Misoriented GaAs Substrate

A flip-chip packaged 80-nm In sub(0.7)Ga sub(0.3)As MHEMT for millimeter-wave low-noise applications

A flip-chip packaged 80-nm In 0.7Ga 0.3As MHEMT for millimeter-wave low-noise applications

Flip-Chip Packaging of In 0.6 Ga 0.4 As MHEMT Device on Low-Cost Organic Substrate for W-Band Applications

An experimental study on fuzzy control for indoor air quality and the energy consumption in a building

Unusual Mesoporous Titanium Niobium Oxides Realizing Sodium‐Ion Batteries Operated at −40 °C

Versatile Nanoemulsion Assembly Approach to Synthesize Functional Mesoporous Carbon Nanospheres with Tunable Pore Sizes and Architectures

Synthesis of Fully Exposed Single‐Atom‐Layer Metal Clusters on 2D Ordered Mesoporous TiO2 Nanosheets

Inorganic-organic competitive coating strategy derived uniform hollow gradient-structured ferroferric oxide-carbon nanospheres for ultra-fast and long-term lithium-ion battery

Sequential Chemistry Toward Core–Shell Structured Metal Sulfides as Stable and Highly Efficient Visible‐Light Photocatalysts

Ultrahigh Adsorption Capacity and Kinetics of Vertically Oriented Mesoporous Coatings for Removal of Organic Pollutants

Micelles Cascade Assembly to Tandem Porous Catalyst for Waste Plastics Upcycling

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