UB Paderborn / Katalog / Suche / in CDI

Wavelength-selective 1 × K switches using free-space optics and MEMS micromirrors : Theory, design, and implementation

Journal of lightwave technology, 2005-04, Vol.23 (4), p.1620-1630

2005

Link zum Volltext

Verfügbarkeit prüfen

Scalable ion–photon quantum interface based on integrated diffractive mirrors

npj quantum information, 2017-01, Vol.3 (1), p.1-4, Article 4

2017

Link zum Volltext

Verfügbarkeit prüfen

Nanoporous Ultralow Dielectric Constant Organosilicates Templated by Triblock Copolymers

Chemistry of materials, 2002-01, Vol.14 (1), p.369-374

2002

Link zum Volltext

Verfügbarkeit prüfen

Interconnect technology trend for microelectronics

Solid-state electronics, 1999-06, Vol.43 (6), p.1003-1009

1999

Link zum Volltext

Verfügbarkeit prüfen

Monolithic fringe-field-activated crystalline silicon tilting-mirror devices

Journal of microelectromechanical systems, 2003-10, Vol.12 (5), p.702-707

2003

Link zum Volltext
IEEE_Xplore

Transmission enhancement in an array of subwavelength slits in aluminum due to surface plasmon resonances

Bell Labs technical journal, 2005, Vol.10 (3), p.143-150

2005

Link zum Volltext
IEEE_Xplore

Molecular Templating of Nanoporous Ultralow Dielectric Constant (≈1.5) Organosilicates by Tailoring the Microphase Separation of Triblock Copolymers

Chemistry of materials, 2001-09, Vol.13 (9), p.2762-2764

2001

Link zum Volltext

Verfügbarkeit prüfen

High-Density Solder Bump Interconnect for MEMS Hybrid Integration

IEEE transactions on advanced packaging, 2007-11, Vol.30 (4), p.622-628

2007

Link zum Volltext
IEEE_Xplore

Polydimethylsiloxane (PDMS) Bonding Strength Characterization by a Line Force Model in Blister Tests

TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference, 2007, p.2095-2098

2007

Link zum Volltext
IEEE_Xplore

Processing and characterization of ultralow-dielectric constant organosilicate

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 2001-11, Vol.19 (6), p.2155-2161

2001

Link zum Volltext

Verfügbarkeit prüfen

Wavelength-selective 1/spl times/K switches using free-space optics and MEMS micromirrors: theory, design, and implementation

Journal of lightwave technology, 2005-04, Vol.23 (4), p.1620-1630

2005

Link zum Volltext
IEEE_Xplore

Wavelength-selective 1xK switches using free-space optics and MEMS micromirrors: theory, design, and implementation

Journal of lightwave technology, 2005-04, Vol.23 (4), p.1620-1630

2005

Link zum Volltext

Verfügbarkeit prüfen

Wavelength-selective 1K switches using free-space optics and MEMS micromirrors: theory, design, and implementation

Journal of lightwave technology, 2005-01, Vol.23 (4)

2005

Link zum Volltext

Verfügbarkeit prüfen

Fringe-field-activated SOI tilting mirrors

2003 IEEE/LEOS International Conference on Optical MEMS (Cat. No.03EX682), 2003, p.91-92

2003

Link zum Volltext
IEEE_Xplore

Downstream microwave plasma-enhanced chemical vapor deposition of oxide using tetraethoxysilane

Journal of applied physics, 1990-07, Vol.68 (2), p.793-801

1990

Link zum Volltext

Verfügbarkeit prüfen

Dielectric materials for advanced VLSI and ULSI technologies

AT&T Technical Journal, 1994-05, Vol.73 (3), p.94-111

1994

Link zum Volltext
IEEE_Xplore

SOLID PHASE CRYSTALLIZATION OF AMORPHOUS SEMICONDUCTORS AND ION MIXING EFFECTS IN METAL/SILICON SYSTEMS

PAI, CHIEN-SHING

1985

Link zum Volltext

Verfügbarkeit prüfen

Suppression of hot-carrier degradation in Si MOSFETs by germanium doping

IEEE electron device letters, 1990-01, Vol.11 (1), p.45-47

1990

Link zum Volltext
IEEE_Xplore

Material properties of plasma-enhanced chemical vapor deposition fluorinated silicon nitride

Journal of applied physics, 1990, Vol.68 (5), p.2442-2449

1990

Link zum Volltext

Verfügbarkeit prüfen

High-density solder bump interconnect for MEMS hybrid in tegration

IEEE transactions on advanced packaging, 2007, Vol.30 (4), p.622-628

2007

Link zum Volltext

Verfügbarkeit prüfen

Interconnect technology for giga-scale integration

1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105), 1998, p.17-20

1998

Link zum Volltext
IEEE_Xplore

Impact of interconnect architecture on chip size and die yield

Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247), 1999, p.21-23

1999

Link zum Volltext
IEEE_Xplore

Single mask metal-insulator-metal (MIM) capacitor with copper damascene metallization for sub-0.18 /spl mu/m mixed mode signal and system-on-a-chip (SoC) applications

Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407), 2000, p.111-113

2000

Link zum Volltext
IEEE_Xplore

Menü

Weitere Dienste

Einstellungen

Wavelength-selective 1 × K switches using free-space optics and MEMS micromirrors : Theory, design, and implementation

Scalable ion–photon quantum interface based on integrated diffractive mirrors

Nanoporous Ultralow Dielectric Constant Organosilicates Templated by Triblock Copolymers

Interconnect technology trend for microelectronics

Monolithic fringe-field-activated crystalline silicon tilting-mirror devices

Transmission enhancement in an array of subwavelength slits in aluminum due to surface plasmon resonances

Molecular Templating of Nanoporous Ultralow Dielectric Constant (≈1.5) Organosilicates by Tailoring the Microphase Separation of Triblock Copolymers

High-Density Solder Bump Interconnect for MEMS Hybrid Integration

Polydimethylsiloxane (PDMS) Bonding Strength Characterization by a Line Force Model in Blister Tests

Processing and characterization of ultralow-dielectric constant organosilicate

Wavelength-selective 1/spl times/K switches using free-space optics and MEMS micromirrors: theory, design, and implementation

Wavelength-selective 1xK switches using free-space optics and MEMS micromirrors: theory, design, and implementation

Wavelength-selective 1K switches using free-space optics and MEMS micromirrors: theory, design, and implementation

Fringe-field-activated SOI tilting mirrors

Downstream microwave plasma-enhanced chemical vapor deposition of oxide using tetraethoxysilane

Dielectric materials for advanced VLSI and ULSI technologies

SOLID PHASE CRYSTALLIZATION OF AMORPHOUS SEMICONDUCTORS AND ION MIXING EFFECTS IN METAL/SILICON SYSTEMS

Suppression of hot-carrier degradation in Si MOSFETs by germanium doping

Material properties of plasma-enhanced chemical vapor deposition fluorinated silicon nitride

High-density solder bump interconnect for MEMS hybrid in tegration

Interconnect technology for giga-scale integration

Impact of interconnect architecture on chip size and die yield

Single mask metal-insulator-metal (MIM) capacitor with copper damascene metallization for sub-0.18 /spl mu/m mixed mode signal and system-on-a-chip (SoC) applications

Suchergebnisse filtern