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Reliability evaluation of glass interposer module

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2016, p.337-340

2016

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Reliability test for integrated Glass interposer

2016 International Conference on Electronics Packaging (ICEP), 2016, p.48-51

2016

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Reliability behaviors of an exposed die FCCSP on a substrate with ultra-low CTE laminate material

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2015, p.241-244

2015

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Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.548-554

2012

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Effects of UBM structure/material on the reliability performance of 3D chip stacking with 30μm-pitch solder micro bump interconnections

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.1287-1292

2012

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Failure mechanism of 20 μm pitch microjoint within a chip stacking architecture

2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.886-892

2011

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Assembly of 3D chip stack with 30μm-pitch micro interconnects using novel arrayed-particles anisotropic conductive film

2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.71-76

2013

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The development of high through-put micro-bump-bonded process with non-conductive paste (NCP)

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012, p.114-118

2012

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Low temperature bonding using non-conductive adhesive for 3D chip stacking with 30μm-pitch micro solder bump interconnections

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.1656-1661

2012

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Evaluation of fine-pitch chip-to-chip interconnects using ACF material with arrayed particles

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012, p.171-174

2012

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Wafer bumping, assembly, and reliability assessment of μbumps with 5μm pads on 10μm pitch for 3D IC integration

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.636-640

2012

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The electrical characterizations of glass interposer for integrated reliability test

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2015, p.336-339

2015

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Utilization of Zn alloy for the manufacture of automotive power device modules

2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2015, p.546-549

2015

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Effect of metal finishing fabricated by electro and Electroless plating process on reliability performance of 30μm-pitch solder micro bump interconnection

2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.653-659

2013

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Development of 30 μm pitch Cu/Ni/SnAg micro-bump-bonded chip-on-chip (COC) interconnects

2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, 2010, p.1-4

2010

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Bonding and reliability assessment of 30 μm pitch solder micro bump interconnection with various UBM structure for 3D chip stacking

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011, p.454-457

2011

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Low temperature micro-bumping assembly technology for 3D integration

2012 4th Electronic System-Integration Technology Conference, 2012, p.1-5

2012

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Reliable microjoints for chip stacking formed by solid-liquid interdiffusion (SLID) bonding

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011, p.419-422

2011

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Low temperature bonding of 30um pitch micro bump interconnection for 3D IC stacking using non-conductive adhesive

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011, p.478-481

2011

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Development of high throughput adhesive bonding scheme by wafer-level underfill for 3D die-to-interposer stacking with 30µm-pitch micro interconnections

2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, p.490-495

2015

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Effect of joint shape controlled by thermocompression bonding on the reliability performance of 60цm-pitch solder micro bump interconnections

2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, p.1908-1914

2014

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Effects of bump height and UBM structure on the reliability performance of 60µm-pitch solder micro bump interconections

2014 International Conference on Electronics Packaging (ICEP), 2014, p.612-617

2014

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Assembly and reliability assessment of 50µm-thick chip stacking by wafer-level underfill film

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012, p.307-310

2012

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Use of HLA-B58:01 genotyping to prevent allopurinol induced severe cutaneous adverse reactions in Taiwan: national prospective cohort study

BMJ (Online), 2015-09, Vol.351, p.h4848

2015

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Depression and Catechol-O-methyltransferase (COMT) genetic variants are associated with pain in Parkinson's disease

Scientific reports, 2017-07, Vol.7 (1), p.6306-10, Article 6306

2017

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Reliability evaluation of glass interposer module

Reliability test for integrated Glass interposer

Reliability behaviors of an exposed die FCCSP on a substrate with ultra-low CTE laminate material

Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP

Effects of UBM structure/material on the reliability performance of 3D chip stacking with 30μm-pitch solder micro bump interconnections

Failure mechanism of 20 μm pitch microjoint within a chip stacking architecture

Assembly of 3D chip stack with 30μm-pitch micro interconnects using novel arrayed-particles anisotropic conductive film

The development of high through-put micro-bump-bonded process with non-conductive paste (NCP)

Low temperature bonding using non-conductive adhesive for 3D chip stacking with 30μm-pitch micro solder bump interconnections

Evaluation of fine-pitch chip-to-chip interconnects using ACF material with arrayed particles

Wafer bumping, assembly, and reliability assessment of μbumps with 5μm pads on 10μm pitch for 3D IC integration

The electrical characterizations of glass interposer for integrated reliability test

Utilization of Zn alloy for the manufacture of automotive power device modules

Effect of metal finishing fabricated by electro and Electroless plating process on reliability performance of 30μm-pitch solder micro bump interconnection

Development of 30 μm pitch Cu/Ni/SnAg micro-bump-bonded chip-on-chip (COC) interconnects

Bonding and reliability assessment of 30 μm pitch solder micro bump interconnection with various UBM structure for 3D chip stacking

Low temperature micro-bumping assembly technology for 3D integration

Reliable microjoints for chip stacking formed by solid-liquid interdiffusion (SLID) bonding

Low temperature bonding of 30um pitch micro bump interconnection for 3D IC stacking using non-conductive adhesive

Development of high throughput adhesive bonding scheme by wafer-level underfill for 3D die-to-interposer stacking with 30µm-pitch micro interconnections

Effect of joint shape controlled by thermocompression bonding on the reliability performance of 60цm-pitch solder micro bump interconnections

Effects of bump height and UBM structure on the reliability performance of 60µm-pitch solder micro bump interconections

Assembly and reliability assessment of 50µm-thick chip stacking by wafer-level underfill film

Use of HLA-B58:01 genotyping to prevent allopurinol induced severe cutaneous adverse reactions in Taiwan: national prospective cohort study

Depression and Catechol-O-methyltransferase (COMT) genetic variants are associated with pain in Parkinson's disease

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