UB Paderborn / Katalog / Suche / in CDI

1 – 25 von 121

Sortiert nach

Effective Macroscopic Thermomechanical Characterization of Multilayer Circuit Laminates for Advanced Electronic Packaging

Materials, 2023-12, Vol.16 (23), p.7491

2023

Volltextzugriff (PDF)

Theoretical and Experimental Investigation of Warpage Evolution of Flip Chip Package on Packaging during Fabrication

Materials, 2021-08, Vol.14 (17), p.4816

2021

Volltextzugriff (PDF)

Transient Electro-Thermal Coupled Modeling of Three-Phase Power MOSFET Inverter during Load Cycles

Materials, 2021-09, Vol.14 (18), p.5427

2021

Volltextzugriff (PDF)

Development of ANN-Based Warpage Prediction Model for FCCSP via Subdomain Sampling and Taguchi Hyperparameter Optimization

Micromachines (Basel), 2023-06, Vol.14 (7), p.1325

2023

Volltextzugriff (PDF)

A DFT Characterization of Structural, Mechanical, and Thermodynamic Properties of Ag9In4 Binary Intermetallic Compound

Metals (Basel ), 2022-11, Vol.12 (11), p.1852

2022

Volltextzugriff (PDF)

Development and Performance Evaluation of Integrated Hybrid Power Module for Three-Phase Servo Motor Applications

Micromachines (Basel), 2023-06, Vol.14 (7), p.1356

2023

Volltextzugriff (PDF)

IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging

Microelectronics and reliability, 2013-01, Vol.53 (1), p.30-40

2013

Volltextzugriff (PDF)

Assessing Ink Transfer Performance of Gravure-Offset Fine-Line Circuitry Printing

Journal of electronic materials, 2018-03, Vol.47 (3), p.1832-1846

2018

Volltextzugriff (PDF)

Development of three-dimensional chip stacking technology using a clamped through-silicon via interconnection

Microelectronics and reliability, 2010-04, Vol.50 (4), p.489-497

2010

Volltextzugriff (PDF)

Board-Level Drop Impact Reliability of Silicon Interposer-Based 2.5-D IC Integration

IEEE transactions on components, packaging, and manufacturing technology (2011), 2016-10, Vol.6 (10), p.1493-1504

2016

Volltextzugriff (PDF)

First-principles density functional calculation of mechanical, thermodynamic and electronic properties of CuIn and Cu2In crystals

Journal of alloys and compounds, 2013-01, Vol.546, p.286-295

2013

Volltextzugriff (PDF)

The mechanical, thermodynamic, and electronic properties of cubic Au4Al crystal via first-principles calculations

Journal of alloys and compounds, 2016-12, Vol.689, p.857-864

2016

Volltextzugriff (PDF)

Solder die attach lifetime characterization of SOT-227 power MOSFET module in a 3-phase inverter under power cycling

Journal of mechanics, 2023-01, Vol.39, p.518-528

2023

Volltextzugriff (PDF)

Macroscopic Mechanical Constitutive Characterization of Through-Silicon-via-Based 3-D Integration

IEEE transactions on components, packaging, and manufacturing technology (2011), 2016-03, Vol.6 (3), p.432-446

2016

Volltextzugriff (PDF)

Heat dissipation analysis and design of a board-level phased-array transmitter module for 60-GHz communication

Applied thermal engineering, 2013-04, Vol.53 (1), p.78-88

2013

Volltextzugriff (PDF)

Interconnect Reliability Characterization of a High-Density 3-D Chip-on-Chip Interconnect Technology

IEEE transactions on components, packaging, and manufacturing technology (2011), 2013-12, Vol.3 (12), p.2037-2047

2013

Volltextzugriff (PDF)

Viscoelastic Warpage Modeling of Fan-Out Wafer-Level Packaging During Wafer-Level Mold Cure Process

IEEE transactions on components, packaging, and manufacturing technology (2011), 2020-07, Vol.10 (7), p.1240-1250

2020

Volltextzugriff (PDF)

Topological design for vibrating structures

Computer methods in applied mechanics and engineering, 1995-03, Vol.121 (1), p.259-280

1995

Volltextzugriff (PDF)

Influence of structural defect on thermal–mechanical properties of phosphorene sheets

Journal of materials science, 2017-03, Vol.52 (6), p.3225-3232

2017

Volltextzugriff (PDF)

An Ab-initio study of structural, elastic, electronic and thermodynamic properties of triclinic Cu7In3

Materials chemistry and physics, 2016-05, Vol.174, p.70-80

2016

Volltextzugriff (PDF)

Thermal Chip Placement in MCMs Using a Novel Hybrid Optimization Algorithm

IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-05, Vol.2 (5), p.764-774

2012

Volltextzugriff (PDF)

Mechanical property assessment of black phosphorene nanotube using molecular dynamics simulation

Computational materials science, 2017-06, Vol.133, p.35-44

2017

Volltextzugriff (PDF)

Bending Characteristics of Foldable Touch Display Panel with a Protection Structure Design

Advances in materials science and engineering, 2015-01, Vol.2015, p.1-16

2015

Volltextzugriff (PDF)

First-principles density functional calculations of physical properties of orthorhombic Au2Al crystal

Intermetallics, 2015-07, Vol.62, p.60-68

2015

Volltextzugriff (PDF)

Atomistic-continuum modeling for mechanical properties of single-walled carbon nanotubes

International journal of solids and structures, 2009-04, Vol.46 (7), p.1695-1704

2009

Volltextzugriff (PDF)

1 – 25 von 121

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(78)
Mit Volltextzugriff
(111)

Publikationsform

Sprache

Erscheinungsjahr

n.n

Thema

Science & Technology
(82)
Technology
(80)
Materials Science
(52)
Engineering
(49)
Materials Science, Multidisciplinary
(46)
Engineering, Electrical & Electronic
(37)
Physical Sciences
(36)
Physics
(31)
Mathematical Models
(30)
Exact Sciences And Technology
(24)
Physics, Applied
(22)
Finite Element Method
(20)
Engineering, Manufacturing
(18)
Electronics
(17)
Applied Sciences
(16)
Computer Simulation
(16)
Mechanical Properties
(16)
Finite Element Modeling
(13)
Molecular Dynamics
(13)
Packaging
(13)

15 weitere anzeigen...

Weniger anzeigen...

Neu hinzugefügt

... seit 90 Tagen
(1)

Menü

Weitere Dienste

Einstellungen

Effective Macroscopic Thermomechanical Characterization of Multilayer Circuit Laminates for Advanced Electronic Packaging

Theoretical and Experimental Investigation of Warpage Evolution of Flip Chip Package on Packaging during Fabrication

Transient Electro-Thermal Coupled Modeling of Three-Phase Power MOSFET Inverter during Load Cycles

Development of ANN-Based Warpage Prediction Model for FCCSP via Subdomain Sampling and Taguchi Hyperparameter Optimization

A DFT Characterization of Structural, Mechanical, and Thermodynamic Properties of Ag9In4 Binary Intermetallic Compound

Development and Performance Evaluation of Integrated Hybrid Power Module for Three-Phase Servo Motor Applications

IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging

Assessing Ink Transfer Performance of Gravure-Offset Fine-Line Circuitry Printing

Development of three-dimensional chip stacking technology using a clamped through-silicon via interconnection

Board-Level Drop Impact Reliability of Silicon Interposer-Based 2.5-D IC Integration

First-principles density functional calculation of mechanical, thermodynamic and electronic properties of CuIn and Cu2In crystals

The mechanical, thermodynamic, and electronic properties of cubic Au4Al crystal via first-principles calculations

Solder die attach lifetime characterization of SOT-227 power MOSFET module in a 3-phase inverter under power cycling

Macroscopic Mechanical Constitutive Characterization of Through-Silicon-via-Based 3-D Integration

Heat dissipation analysis and design of a board-level phased-array transmitter module for 60-GHz communication

Interconnect Reliability Characterization of a High-Density 3-D Chip-on-Chip Interconnect Technology

Viscoelastic Warpage Modeling of Fan-Out Wafer-Level Packaging During Wafer-Level Mold Cure Process

Topological design for vibrating structures

Influence of structural defect on thermal–mechanical properties of phosphorene sheets

An Ab-initio study of structural, elastic, electronic and thermodynamic properties of triclinic Cu7In3

Thermal Chip Placement in MCMs Using a Novel Hybrid Optimization Algorithm

Mechanical property assessment of black phosphorene nanotube using molecular dynamics simulation

Bending Characteristics of Foldable Touch Display Panel with a Protection Structure Design

First-principles density functional calculations of physical properties of orthorhombic Au2Al crystal

Atomistic-continuum modeling for mechanical properties of single-walled carbon nanotubes

Suchergebnisse filtern