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A 975-mW Fully Integrated Genetic Variant Discovery System-on-Chip in 28 nm for Next-Generation Sequencing

IEEE journal of solid-state circuits, 2021-01, Vol.56 (1), p.123-135

2021

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A Novel Flexible 3-D Heterogeneous Integration Scheme Using Electroless Plating on Chips With Advanced Technology Node

IEEE transactions on electron devices, 2015-12, Vol.62 (12), p.4148-4153

2015

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2.5 A 28nm 142mW Motion-Control SoC for Autonomous Mobile Robots

2023 IEEE International Solid- State Circuits Conference (ISSCC), 2023, p.1-3

2023

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A 28nm 11.2TOPS/W Hardware-Utilization-Aware Neural-Network Accelerator with Dynamic Dataflow

2023 IEEE International Solid- State Circuits Conference (ISSCC), 2023, p.1-3

2023

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A Fully Integrated End-to-End Genome Analysis Accelerator for Next-Generation Sequencing

2023 IEEE International Solid- State Circuits Conference (ISSCC), 2023, p.44-46

2023

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A 1.625 TOPS/W SOC for Deep CNN Training and Inference in 28nm CMOS

ESSCIRC 2021 - IEEE 47th European Solid State Circuits Conference (ESSCIRC), 2021, p.107-110

2021

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A 28-nm 1.3-mW Speech-to-Text Accelerator for Edge AI Devices

IEEE journal of solid-state circuits, 2024, p.1-11

2024

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A 25.1-TOPS/W Sparsity-Aware Hybrid CNN-GCN Deep Learning SoC for Mobile Augmented Reality

IEEE journal of solid-state circuits, 2024, p.1-13

2024

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Programmable System-on-Chip for Silicon Prototyping

IEEE transactions on industrial electronics (1982), 2011-03, Vol.58 (3), p.830-838

2011

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A proposed prognostic 7-day survival formula for patients with terminal cancer

BMC public health, 2009-09, Vol.9 (1), p.365-365, Article 365

2009

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An implantable 128-channel wireless neural-sensing microsystem using TSV-embedded dissolvable μ-needle array and flexible interposer

2017 IEEE International Symposium on Circuits and Systems (ISCAS), 2017, p.1-4

2017

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A 28-nm 25.1 TOPS/W Sparsity-Aware CNN-GCN Deep Learning SoC for Mobile Augmented Reality

2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2022, p.42-43

2022

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A 1.625 TOPS/W SOC for Deep CNN Training and Inference in 28nm CMOS

ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC), 2021, p.107-110

2021

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Implementation and prototyping of a complex multi-project system-on-a-chip

2009 IEEE International Symposium on Circuits and Systems (ISCAS), 2009, p.2321-2324

2009

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A 1.3TOPS H.264/AVC single-chip encoder for HDTV applications

ISSCC. 2005 IEEE International Digest of Technical Papers. Solid-State Circuits Conference, 2005, 2005, p.128-588 Vol. 1

2005

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Calibration Transfer from Sample Cell to Fiber-Optic Probe

Applied spectroscopy, 1997-05, Vol.51 (5), p.744-748

1997

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Simultaneous determination of chromium(III) and chromium(VI) with reversed-phase ion-pair high-performance liquid chromatography

Analyst (London), 1993, Vol.118 (10), p.1281-1284

1993

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A 1.3mW Speech-to-Text Accelerator with Bidirectional Light Gated Recurrent Units for Edge AI

2022 IEEE Asian Solid-State Circuits Conference (A-SSCC), 2022, p.1-3

2022

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High-Efficiency Step-Down Multi-Mode Switching DC-DC Converter for IoT Devices

2019 32nd IEEE International System-on-Chip Conference (SOCC), 2019, p.449-454

2019

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Live Demo: An 176.3 GOPs Object Detection CNN Accelerator Emulated in a 28nm CMOS Technology

2021 IEEE 3rd International Conference on Artificial Intelligence Circuits and Systems (AICAS), 2021, p.1-1

2021

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Universal CMOS Diamond-Graph Circuit for Embedded Computing

2018 31st IEEE International System-on-Chip Conference (SOCC), 2018, p.206-212

2018

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A novel methodology for Multi-Project System-on-a-Chip

2011 IEEE International SOC Conference, 2011, p.308-311

2011

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An advanced 3D/2.5D integration packaging approach using double-self-assembly method with complex topography, and micropin-fin heat sink interposer for pressure sensing system

2016 IEEE International Electron Devices Meeting (IEDM), 2016, p.9.2.1-9.2.4

2016

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Non-destructive near-infra-red analysis for the identification of dyes on textiles

Journal of the Society of Dyers and Colourists, 1997-02, Vol.113 (2), p.51-56

1997

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A drug dissolution monitor employing multiple fiber optic probes and a UV/visible diode array spectrophotometer

Pharmaceutical research, 1994-07, Vol.11 (7), p.979-983

1994

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A 975-mW Fully Integrated Genetic Variant Discovery System-on-Chip in 28 nm for Next-Generation Sequencing

A Novel Flexible 3-D Heterogeneous Integration Scheme Using Electroless Plating on Chips With Advanced Technology Node

2.5 A 28nm 142mW Motion-Control SoC for Autonomous Mobile Robots

A 28nm 11.2TOPS/W Hardware-Utilization-Aware Neural-Network Accelerator with Dynamic Dataflow

A Fully Integrated End-to-End Genome Analysis Accelerator for Next-Generation Sequencing

A 1.625 TOPS/W SOC for Deep CNN Training and Inference in 28nm CMOS

A 28-nm 1.3-mW Speech-to-Text Accelerator for Edge AI Devices

A 25.1-TOPS/W Sparsity-Aware Hybrid CNN-GCN Deep Learning SoC for Mobile Augmented Reality

Programmable System-on-Chip for Silicon Prototyping

A proposed prognostic 7-day survival formula for patients with terminal cancer

An implantable 128-channel wireless neural-sensing microsystem using TSV-embedded dissolvable μ-needle array and flexible interposer

A 28-nm 25.1 TOPS/W Sparsity-Aware CNN-GCN Deep Learning SoC for Mobile Augmented Reality

A 1.625 TOPS/W SOC for Deep CNN Training and Inference in 28nm CMOS

Implementation and prototyping of a complex multi-project system-on-a-chip

A 1.3TOPS H.264/AVC single-chip encoder for HDTV applications

Calibration Transfer from Sample Cell to Fiber-Optic Probe

Simultaneous determination of chromium(III) and chromium(VI) with reversed-phase ion-pair high-performance liquid chromatography

A 1.3mW Speech-to-Text Accelerator with Bidirectional Light Gated Recurrent Units for Edge AI

High-Efficiency Step-Down Multi-Mode Switching DC-DC Converter for IoT Devices

Live Demo: An 176.3 GOPs Object Detection CNN Accelerator Emulated in a 28nm CMOS Technology

Universal CMOS Diamond-Graph Circuit for Embedded Computing

A novel methodology for Multi-Project System-on-a-Chip

An advanced 3D/2.5D integration packaging approach using double-self-assembly method with complex topography, and micropin-fin heat sink interposer for pressure sensing system

Non-destructive near-infra-red analysis for the identification of dyes on textiles

A drug dissolution monitor employing multiple fiber optic probes and a UV/visible diode array spectrophotometer

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