UB Paderborn / Katalog / Suche / in CDI

Sortiert nach

Einfacher Volltextzugriff von (fast) überall

Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...

Study on high efficient sapphire wafer processing by coupling SG-mechanical polishing and GLA-CMP

International journal of machine tools & manufacture, 2018-08, Vol.130-131, p.12-19

2018

Volltextzugriff (PDF)

Study on diamond wire wear, surface quality, and subsurface damage during multi-wire slicing of c-plane sapphire wafer

International journal of advanced manufacturing technology, 2019-02, Vol.100 (5-8), p.1801-1814

2019

Volltextzugriff (PDF)

Recent Advances In Silicon Carbide Chemical Mechanical Polishing Technologies

Micromachines (Basel), 2022-10, Vol.13 (10), p.1752

2022

Volltextzugriff (PDF)

Contamination reduction for 150 mm SiC substrates by integrating CMP and Post-CMP cleaning

Materials research express, 2023-10, Vol.10 (10), p.105903

2023

Volltextzugriff (PDF)

Modeling of material removal in copper blanket wafer polishing based on the hard polishing pad microstructure

International journal of advanced manufacturing technology, 2023-10, Vol.128 (9-10), p.4455-4468

2023

Volltextzugriff (PDF)

Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient

Scientific reports, 2018-09, Vol.8 (1), p.13910-11, Article 13910

2018

Volltextzugriff (PDF)

Study on pad cutting rate and surface roughness in diamond dressing process

International journal of precision engineering and manufacturing, 2017-12, Vol.18 (12), p.1683-1691

2017

Volltextzugriff (PDF)

Modeling and analysis of wire motion during rocking mode diamond wire sawing of mono-crystalline alumina oxide wafer

International journal of advanced manufacturing technology, 2018-04, Vol.95 (9-12), p.3453-3463

2018

Volltextzugriff (PDF)

Analyzing the effects of pad asperity on chemical mechanical polishing of copper thin film wafer

Japanese Journal of Applied Physics, 2022-07, Vol.61 (7), p.71005

2022

Volltextzugriff (PDF)

Effects of compound diamond slurry with graphene for lapping of sapphire wafers

International journal of advanced manufacturing technology, 2020-02, Vol.106 (11-12), p.4755-4768

2020

Volltextzugriff (PDF)

Optical design of soft multifocal contact lens with uniform optical power in center-distance zone with optimized NURBS

Optics express, 2018-02, Vol.26 (3), p.3544-3556

2018

Volltextzugriff (PDF)

Development of modeling to investigate polyurethane pad hardness in chemical mechanical planarization/polishing (CMP) process

Japanese Journal of Applied Physics, 2022-08, Vol.61 (SJ), p.SJ1002

2022

Volltextzugriff (PDF)

Analysis on multifocal contact lens design based on optical power distribution with NURBS

Applied optics (2004), 2017-10, Vol.56 (28), p.7990

2017

Volltextzugriff (PDF)

Study on diamond dressing for non-uniformity of pad surface topography in CMP process

International journal of advanced manufacturing technology, 2017-08, Vol.91 (9-12), p.3573-3582

2017

Volltextzugriff (PDF)

Effect of graphene additions on polishing of silicon carbide wafer with functional PU/silica particles in CMP slurry

Functional materials letters, 2019-10, Vol.12 (5), p.1950066

2019

Volltextzugriff (PDF)

Compensating additional optical power in the central zone of a multifocal contact lens forminimization of the shrinkage error of the shell mold in the injection molding process

Applied optics (2004), 2018-04, Vol.57 (12), p.2981

2018

Volltextzugriff (PDF)

Dynamic Pad Surface Metrology Monitoring by Swing-Arm Chromatic Confocal System

Applied sciences, 2021-01, Vol.11 (1), p.179

2021

Volltextzugriff (PDF)

Study on liquid crystal polymer molding for off-axial aspherical reflective grating optical element by injection molding process

AIP Conference Proceedings, 2019, Vol.2065 (1)

2019

Volltextzugriff (PDF)

Study on quasi-orthogonal machining of elastomer pad by single-point diamond tool

International journal of advanced manufacturing technology, 2018-03, Vol.95 (5-8), p.2555-2565

2018

Volltextzugriff (PDF)

Material removal mechanism of Cu-CMP studied by nano-scratching under various environmental conditions

Wear, 2012-03, Vol.278-279, p.87-93

2012

Volltextzugriff (PDF)

A process model of wafer thinning by diamond grinding

Journal of materials processing technology, 2008-05, Vol.201 (1), p.606-611

2008

Volltextzugriff (PDF)

Nano-scratch evaluations of copper chemical mechanical polishing

Thin solid films, 2013-02, Vol.529, p.306-311

2013

Volltextzugriff (PDF)

Chemically grafted polyurethane/graphene ternary slurry for advanced chemical–mechanical polishing of single-crystalline SiC wafers

International journal of advanced manufacturing technology, 2022-06, Vol.120 (11-12), p.7157-7169

2022

Volltextzugriff (PDF)

Analysis of mechanical properties of copper thin film in ambient, DI water and slurry environment by nanoindentation

Advances in materials and processing technologies (Abingdon, England), 2022-07, Vol.8 (3), p.2551-2560

2022

Volltextzugriff (PDF)

Toolpath generation for diamond shaping of aspheric lens array

Journal of materials processing technology, 2007-10, Vol.192, p.194-199

2007

Volltextzugriff (PDF)

1 – 25 von 1.475

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(1.240)
Mit Volltextzugriff
(1.261)

Publikationsform

Sprache

Erscheinungsjahr

n.n

Thema

Science & Technology
(1.069)
Life Sciences & Biomedicine
(715)
Humans
(421)
Male
(274)
Female
(245)
Technology
(233)
Physical Sciences
(219)
Middle Aged
(172)
Adult
(151)
Animals
(151)
Engineering
(129)
Aged
(124)
Oncology
(119)
Physics
(116)
Biological And Medical Sciences
(101)
Materials Science
(93)
Chemistry
(83)
Medical Sciences
(80)
Materials Science, Multidisciplinary
(76)
Mice
(76)

15 weitere anzeigen...

Weniger anzeigen...

Kollektion

15 weitere anzeigen...

Weniger anzeigen...

Neu hinzugefügt

... seit 30 Tagen
(6)
... seit 90 Tagen
(26)

Menü

Weitere Dienste

Einstellungen

Study on high efficient sapphire wafer processing by coupling SG-mechanical polishing and GLA-CMP

Study on diamond wire wear, surface quality, and subsurface damage during multi-wire slicing of c-plane sapphire wafer

Recent Advances In Silicon Carbide Chemical Mechanical Polishing Technologies

Contamination reduction for 150 mm SiC substrates by integrating CMP and Post-CMP cleaning

Modeling of material removal in copper blanket wafer polishing based on the hard polishing pad microstructure

Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient

Study on pad cutting rate and surface roughness in diamond dressing process

Modeling and analysis of wire motion during rocking mode diamond wire sawing of mono-crystalline alumina oxide wafer

Analyzing the effects of pad asperity on chemical mechanical polishing of copper thin film wafer

Effects of compound diamond slurry with graphene for lapping of sapphire wafers

Optical design of soft multifocal contact lens with uniform optical power in center-distance zone with optimized NURBS

Development of modeling to investigate polyurethane pad hardness in chemical mechanical planarization/polishing (CMP) process

Analysis on multifocal contact lens design based on optical power distribution with NURBS

Study on diamond dressing for non-uniformity of pad surface topography in CMP process

Effect of graphene additions on polishing of silicon carbide wafer with functional PU/silica particles in CMP slurry

Compensating additional optical power in the central zone of a multifocal contact lens forminimization of the shrinkage error of the shell mold in the injection molding process

Dynamic Pad Surface Metrology Monitoring by Swing-Arm Chromatic Confocal System

Study on liquid crystal polymer molding for off-axial aspherical reflective grating optical element by injection molding process

Study on quasi-orthogonal machining of elastomer pad by single-point diamond tool

Material removal mechanism of Cu-CMP studied by nano-scratching under various environmental conditions

A process model of wafer thinning by diamond grinding

Nano-scratch evaluations of copper chemical mechanical polishing

Chemically grafted polyurethane/graphene ternary slurry for advanced chemical–mechanical polishing of single-crystalline SiC wafers

Analysis of mechanical properties of copper thin film in ambient, DI water and slurry environment by nanoindentation

Toolpath generation for diamond shaping of aspheric lens array

Suchergebnisse filtern