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Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn–3.8Ag–0.7Cu solder joints

Journal of alloys and compounds, 2012-11, Vol.541, p.6-13

2012

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The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures

Journal of alloys and compounds, 2010-09, Vol.507 (1), p.215-224

2010

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Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication

Journal of electronic materials, 2012-09, Vol.41 (9), p.2533-2542

2012

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Study on Cu Protrusion of Through-Silicon Via

IEEE transactions on components, packaging, and manufacturing technology (2011), 2013-05, Vol.3 (5), p.732-739

2013

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Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition

Journal of electronic materials, 2011-03, Vol.40 (3), p.344-354

2011

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Vibration reliability test and finite element analysis for flip chip solder joints

Microelectronics and reliability, 2009-07, Vol.49 (7), p.754-760

2009

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Characterization and Modeling of Fine-Pitch Copper Ball Bonding on a Cu/Low-k Chip

Journal of electronic materials, 2015-02, Vol.44 (2), p.688-698

2015

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Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards

Microelectronics and reliability, 2006-02, Vol.46 (2), p.558-573

2006

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Drop impact reliability testing for lead-free and lead-based soldered IC packages

Microelectronics and reliability, 2006-07, Vol.46 (7), p.1160-1171

2006

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Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods

Microelectronics and reliability, 2012-09, Vol.52 (9-10), p.1870-1875

2012

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Development of a Cu/Low- k Stack Die Fine Pitch Ball Grid Array (FBGA) Package for System in Package Applications

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-03, Vol.1 (3), p.299-309

2011

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Study on Process Induced Wafer Level Warpage of Fan-Out Wafer Level Packaging

2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.1879-1885

2016

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Study on reliability of PQFP assembly with lead free solder joints under random vibration test

Microelectronics and reliability, 2015-12, Vol.55 (12), p.2769-2776

2015

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Panel Warpage and Die Shift Simulation and Characterization of Fan-Out Panel-Level Packaging

2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.2097-2104

2020

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Characterization of MVP and VPARP assembly into vault ribonucleoprotein complexes

Biochemical and biophysical research communications, 2005-01, Vol.326 (1), p.100-107

2005

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Design, Process and Reliability of Face-up 2-layer molded FOWLP Antenna-in-Package

2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.19-24

2020

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High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications

Journal of electronic materials, 2012-09, Vol.41 (9), p.2631-2658

2012

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Evaluation on Influencing Factors of Board-Level Drop Reliability for Chip Scale Packages (Fine-Pitch Ball Grid Array)

IEEE transactions on advanced packaging, 2008-02, Vol.31 (1), p.66-75

2008

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Microstructure and Tensile Properties of Sn-1Ag-0.5Cu Solder Alloy Bearing Al for Electronics Applications

Journal of electronic materials, 2012-08, Vol.41 (8), p.2073-2082

2012

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NPTX1 Promotes Metastasis via Integrin/FAK Signaling in Gastric Cancer [Retraction]

Cancer management and research, 2023-10, Vol.15, p.1123-1124

2023

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NPTX1 promotes metastasis via integrin/FAK signaling in gastric cancer

Cancer management and research, 2019-01, Vol.11, p.3237-3251

2019

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DNMT3a promotes proliferation by activating the STAT3 signaling pathway and depressing apoptosis in pancreatic cancer

Cancer management and research, 2019-01, Vol.11, p.6379-6396

2019

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Thermal Compression Bonding of 30um Pitch Cu Pillar Microbump on Organic Substrate with Bare Cu Bondpad

2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.936-942

2016

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Study on board level solder joint reliability for extreme large fan-out WLP under temperature cycling

2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 2016, p.207-212

Che, F. X.

2016

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Study on Electrical Performance and Mechanical Reliability of Antenna in Package (AIP) with Fan-Out Wafer Level Packaging Technology

2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 2018, p.180-185

2018

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Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn–3.8Ag–0.7Cu solder joints

The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures

Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication

Study on Cu Protrusion of Through-Silicon Via

Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition

Vibration reliability test and finite element analysis for flip chip solder joints

Characterization and Modeling of Fine-Pitch Copper Ball Bonding on a Cu/Low-k Chip

Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards

Drop impact reliability testing for lead-free and lead-based soldered IC packages

Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods

Development of a Cu/Low- k Stack Die Fine Pitch Ball Grid Array (FBGA) Package for System in Package Applications

Study on Process Induced Wafer Level Warpage of Fan-Out Wafer Level Packaging

Study on reliability of PQFP assembly with lead free solder joints under random vibration test

Panel Warpage and Die Shift Simulation and Characterization of Fan-Out Panel-Level Packaging

Characterization of MVP and VPARP assembly into vault ribonucleoprotein complexes

Design, Process and Reliability of Face-up 2-layer molded FOWLP Antenna-in-Package

High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications

Evaluation on Influencing Factors of Board-Level Drop Reliability for Chip Scale Packages (Fine-Pitch Ball Grid Array)

Microstructure and Tensile Properties of Sn-1Ag-0.5Cu Solder Alloy Bearing Al for Electronics Applications

NPTX1 Promotes Metastasis via Integrin/FAK Signaling in Gastric Cancer [Retraction]

NPTX1 promotes metastasis via integrin/FAK signaling in gastric cancer

DNMT3a promotes proliferation by activating the STAT3 signaling pathway and depressing apoptosis in pancreatic cancer

Thermal Compression Bonding of 30um Pitch Cu Pillar Microbump on Organic Substrate with Bare Cu Bondpad

Study on board level solder joint reliability for extreme large fan-out WLP under temperature cycling

Study on Electrical Performance and Mechanical Reliability of Antenna in Package (AIP) with Fan-Out Wafer Level Packaging Technology

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