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Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric

Microelectronics and reliability, 2013-01, Vol.53 (1), p.17-29

2013

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Characterization of a smartphone size haptic rendering system based on thin-film AlN actuators on glass substrates

Journal of micromechanics and microengineering, 2016-08, Vol.26 (8), p.84007

2016

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An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization

Journal of the Electrochemical Society, 2011-01, Vol.158 (6), p.P81-P86

2011

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Resistance increase due to electromigration induced depletion under TSV

2011 International Reliability Physics Symposium, 2011, p.3F.4.1-3F.4.6

2011

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Development of Embedded Three-Dimensional 35-nF/mm ^ MIM Capacitor and BiCMOS Circuits Characterization

IEEE journal of solid-state circuits, 2007-09, Vol.42 (9), p.1842-1850

2007

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Lifetime extrapolation for Electromigration tests at wafer level with a dedicated device

2010 IEEE International Reliability Physics Symposium, 2010, p.887-889

2010

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Sortir au jour: Art égyptien de la Fondation Martin Bodmer

2012

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Dielectrical properties of metal-insulator-metal aluminum nitride structures: Measurement and modeling

Journal of applied physics, 2009-02, Vol.105 (4), p.044111-044111-10

2009

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4-inch transparent plates based on thin-film AlN actuators for haptic applications

Mechatronics (Oxford), 2016-12, Vol.40, p.264-269

2016

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Linear variation of aluminum nitride capacitance versus voltage induced by a piezoelectric-electrostrictive coupling

Journal of applied physics, 2008-08, Vol.104 (3), p.034110-034110-4

2008

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Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric : Reliability of Micro-Interconnects in 3D IC Packages

Microelectronics and reliability, 2013, Vol.53 (1), p.17-29

2013

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Stress management strategy to limit die curvature during silicon interposer integration

2015 International 3D Systems Integration Conference (3DIC), 2015, p.TS11.4.1-TS11.4.7

2015

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Through silicon via impact on above BEoL Time Dependent Dielectric Breakdown

2012 IEEE International Integrated Reliability Workshop Final Report, 2012, p.41-44

2012

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Design of thin-film AlN actuators for 4-inch transparent plates for haptic applications

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2015, p.1-4

2015

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Development of Embedded Three-Dimensional 35-nF/mm2 MIM Capacitor and BiCMOS Circuits Characterization

IEEE journal of solid-state circuits, 2007-09, Vol.42 (9), p.1842

2007

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Characterization and post simulation of thin-film PZT actuated plates for haptic applications

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2014, p.1-4

2014

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Development of Embedded Three-Dimensional 35-nF/mm@@u2@ MIM Capacitor and BiCMOS Circuits Characterization

IEEE journal of solid-state circuits, 2007-09, Vol.42 (9), p.1842-1850

2007

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Electromigration degradation mechanism analysis of SnAgCu interconnects for eWLB package

2012 IEEE International Reliability Physics Symposium (IRPS), 2012, p.2E.5.1-2E.5.6

2012

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Development of Embedded Three-Dimensional 35-nF/mm super(2) MIM Capacitor and BiCMOS Circuits Characterization

IEEE journal of solid-state circuits, 2007-01, Vol.42 (9)

2007

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(Invited) An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization

ECS transactions, 2010, Vol.33 (4), p.3-16

2010

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Electrodeposited Wide-Bandgap Semiconducting ZnO and CuSCN Thin Films and Nanowires for Interface Engineering of Polymer Solar Cells

ECS transactions, 2013, Vol.53 (2), p.107-117

2013

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Self heating under RF power in BAW SMR and its predictive 1D thermal model

2009 IEEE International Frequency Control Symposium Joint with the 22nd European Frequency and Time forum, 2009, p.237-240

2009

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Au commencement était le Nil

"Sortir au jour", 2001, Vol.2, p.13-24

Originally published 2001, 2001

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Écritures de l’Egypte pharaonique

"Sortir au jour", 2001, Vol.2, p.53-70

Originally published 2001, 2001

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Reliability approach of high density Through Silicon Via (TSV)

2010 12th Electronics Packaging Technology Conference, 2010, p.321-324

2010

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Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric

Characterization of a smartphone size haptic rendering system based on thin-film AlN actuators on glass substrates

An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization

Resistance increase due to electromigration induced depletion under TSV

Development of Embedded Three-Dimensional 35-nF/mm ^ MIM Capacitor and BiCMOS Circuits Characterization

Lifetime extrapolation for Electromigration tests at wafer level with a dedicated device

Sortir au jour: Art égyptien de la Fondation Martin Bodmer

Dielectrical properties of metal-insulator-metal aluminum nitride structures: Measurement and modeling

4-inch transparent plates based on thin-film AlN actuators for haptic applications

Linear variation of aluminum nitride capacitance versus voltage induced by a piezoelectric-electrostrictive coupling

Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric : Reliability of Micro-Interconnects in 3D IC Packages

Stress management strategy to limit die curvature during silicon interposer integration

Through silicon via impact on above BEoL Time Dependent Dielectric Breakdown

Design of thin-film AlN actuators for 4-inch transparent plates for haptic applications

Development of Embedded Three-Dimensional 35-nF/mm2 MIM Capacitor and BiCMOS Circuits Characterization

Characterization and post simulation of thin-film PZT actuated plates for haptic applications

Development of Embedded Three-Dimensional 35-nF/mm@@u2@ MIM Capacitor and BiCMOS Circuits Characterization

Electromigration degradation mechanism analysis of SnAgCu interconnects for eWLB package

Development of Embedded Three-Dimensional 35-nF/mm super(2) MIM Capacitor and BiCMOS Circuits Characterization

(Invited) An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization

Electrodeposited Wide-Bandgap Semiconducting ZnO and CuSCN Thin Films and Nanowires for Interface Engineering of Polymer Solar Cells

Self heating under RF power in BAW SMR and its predictive 1D thermal model

Au commencement était le Nil

Écritures de l’Egypte pharaonique

Reliability approach of high density Through Silicon Via (TSV)

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