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Microstructural evolution and change in macroscopic physical properties of microscale flip chip Cu/Sn58Bi/Cu joints under the coupling effect of electric current stressing and elastic stress

Journal of materials research, 2019-08, Vol.34 (16), p.2775-2788

2019

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Anisotropic Negative Thermal Expansion Behavior of the As-Fabricated Ti-Rich and Equiatomic Ti–Ni Alloys Induced by Preferential Grain Orientation

Shape memory and superelasticity : advances in science and technology, 2018-03, Vol.4 (1), p.218-223

2018

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Phase transformation and damping behavior of lightweight porous TiNiCu alloys fabricated by powder metallurgy process

Transactions of Nonferrous Metals Society of China, 2013-07, Vol.23 (7), p.2029-2036

2013

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Three-Dimensional Simulation of Effects of Microstructure Evolution and Interfacial Delamination on Cu Protrusion in Copper Filled Through Silicon Vias by Combined Monte Carlo and Finite Element Methods

2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.2134-2141

2018

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Modeling of Ni4Ti3 precipitation during stress-free and stress-assisted aging of bi-crystalline NiTi shape memory alloys

Transactions of Nonferrous Metals Society of China, 2012-10, Vol.22 (10), p.2578-2585

2012

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An Intensive Study of Effects of Orientations of Cu Bumps on Cu-Cu Direct Bonding for 3D Integration by Molecular Dynamics Simulation

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1760-1766

2023

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An Extensive Study of the Effects of Packaging Structure and Material Properties on Reliability of Advanced Packages by Charactering the Stress Singularities at Interface Corners

2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 2023, p.647-654

2023

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Morphological evolution and migration behavior of the microvoid in Sn/Cu interconnects under electrical field studied by phase-field simulation

2015 16th International Conference on Electronic Packaging Technology (ICEPT), 2015, p.260-265

2015

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Phase Field Simulation of Segregation of the Bi-Riched Phase in Cu/Sn-Bi/Cu Solder Interconnects under Electric Current Stressing

2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.264-270

2016

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Atomic-scale study of Cu-Cu direct bonding with assistance of Cu nanoparticles as joining medium by molecular dynamics simulation

2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022, p.1-5

2022

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Morphological evolution and growth kinetics of Kirkendall voids in binary alloy system during deformation process—Phase field crystal simulation study

Transactions of Nonferrous Metals Society of China, 2017-03, Vol.27 (3), p.599-607

2017

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Quasi in-situ study of morphological evolution of the interfacial IMC in single-sided interface Sn-0.3Ag-0.7Cu/Cu joints during multiple reflow process

2015 16th International Conference on Electronic Packaging Technology (ICEPT), 2015, p.333-337

2015

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Three-dimensional Simulation of Effects of Electro-Thermo-Mechanical Multi-physical Fields on Cu Protrusion and Performance of Micro-bump Joints in TSVs Based High Bandwidth Memory (HBM) Structures

2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.1659-1664

2020

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A multi-phase field study of the role of grain boundary diffusion in growth of Cu6Sn5 intermetallic compound during early stage of soldering reaction

2013 14th International Conference on Electronic Packaging Technology, 2013, p.572-578

2013

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Phase field crystal simulation of morphological evolution and growth kinetics of Kirkendall voids at the interface and in the intermetallic compound layer of Sn/Cu soldering system under cyclic loading

2015 16th International Conference on Electronic Packaging Technology (ICEPT), 2015, p.301-306

2015

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Interfacial Crack Initiation and Delamination Propagation in Cu-filled TSV Structure by Incorporating Cohesive Zone Model and Finite Element Method

2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.1186-1191

2020

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Phase field simulation of solidification behavior and microstructure evolution of Sn-58Bi/Cu solder interconnect during reflow soldering process

2013 14th International Conference on Electronic Packaging Technology, 2013, p.330-333

2013

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Finite Element Simulation Study of Interfacial Crack Propagation in the Underfilled FC-BGA Package

2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021, p.1-5

2021

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Three-Dimensional Simulation of the Thermo-Mechanical Interaction between the Micro-Bump Joints and Cu Protrusion in Cu-Filled TSVs of the High Bandwidth Memory (HBM) Structure

2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, p.410-416

2019

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Interaction effects between the preferred growth of β-Sn grains and thermo-mechanical response in microbump interconnects under thermal cycling

2018 7th Electronic System-Integration Technology Conference (ESTC), 2018, p.1-7

2018

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Effects of size distributions of copper nanoparticles on the pressureless bonding performance of the copper paste for die attachment

2019 20th International Conference on Electronic Packaging Technology(ICEPT), 2019, p.1-4

2019

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Phase field study of the combined effects of electromigration and thermomigration on phase segregation and physical properties of Sn58Bi solder joints under electric current stressing coupled with temperature gradient

2018 19th International Conference on Electronic Packaging Technology (ICEPT), 2018, p.376-382

2018

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Size and boundary effects on the growth and morphology evolution of interfacial intermetallic compound of Sn0.3Ag0.7Cu/Cu micro-bump joints

2017 18th International Conference on Electronic Packaging Technology (ICEPT), 2017, p.1667-1671

2017

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Microstructure Simulation and Thermo-Mechanical Behavior Analysis of Copper Filled Through Silicon Vias Using Coupled Phase Field and Finite Element Methods

2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.1668-1674

2017

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Microstructure simulation and thermo-mechanical behavior analysis of Cu-filled through silicon vias (TSVs) using combined Monte Carlo and finite element method

2017 18th International Conference on Electronic Packaging Technology (ICEPT), 2017, p.1617-1622

2017

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Microstructural evolution and change in macroscopic physical properties of microscale flip chip Cu/Sn58Bi/Cu joints under the coupling effect of electric current stressing and elastic stress

Anisotropic Negative Thermal Expansion Behavior of the As-Fabricated Ti-Rich and Equiatomic Ti–Ni Alloys Induced by Preferential Grain Orientation

Phase transformation and damping behavior of lightweight porous TiNiCu alloys fabricated by powder metallurgy process

Three-Dimensional Simulation of Effects of Microstructure Evolution and Interfacial Delamination on Cu Protrusion in Copper Filled Through Silicon Vias by Combined Monte Carlo and Finite Element Methods

Modeling of Ni4Ti3 precipitation during stress-free and stress-assisted aging of bi-crystalline NiTi shape memory alloys

An Intensive Study of Effects of Orientations of Cu Bumps on Cu-Cu Direct Bonding for 3D Integration by Molecular Dynamics Simulation

An Extensive Study of the Effects of Packaging Structure and Material Properties on Reliability of Advanced Packages by Charactering the Stress Singularities at Interface Corners

Morphological evolution and migration behavior of the microvoid in Sn/Cu interconnects under electrical field studied by phase-field simulation

Phase Field Simulation of Segregation of the Bi-Riched Phase in Cu/Sn-Bi/Cu Solder Interconnects under Electric Current Stressing

Atomic-scale study of Cu-Cu direct bonding with assistance of Cu nanoparticles as joining medium by molecular dynamics simulation

Morphological evolution and growth kinetics of Kirkendall voids in binary alloy system during deformation process—Phase field crystal simulation study

Quasi in-situ study of morphological evolution of the interfacial IMC in single-sided interface Sn-0.3Ag-0.7Cu/Cu joints during multiple reflow process

Three-dimensional Simulation of Effects of Electro-Thermo-Mechanical Multi-physical Fields on Cu Protrusion and Performance of Micro-bump Joints in TSVs Based High Bandwidth Memory (HBM) Structures

A multi-phase field study of the role of grain boundary diffusion in growth of Cu6Sn5 intermetallic compound during early stage of soldering reaction

Phase field crystal simulation of morphological evolution and growth kinetics of Kirkendall voids at the interface and in the intermetallic compound layer of Sn/Cu soldering system under cyclic loading

Interfacial Crack Initiation and Delamination Propagation in Cu-filled TSV Structure by Incorporating Cohesive Zone Model and Finite Element Method

Phase field simulation of solidification behavior and microstructure evolution of Sn-58Bi/Cu solder interconnect during reflow soldering process

Finite Element Simulation Study of Interfacial Crack Propagation in the Underfilled FC-BGA Package

Three-Dimensional Simulation of the Thermo-Mechanical Interaction between the Micro-Bump Joints and Cu Protrusion in Cu-Filled TSVs of the High Bandwidth Memory (HBM) Structure

Interaction effects between the preferred growth of β-Sn grains and thermo-mechanical response in microbump interconnects under thermal cycling

Effects of size distributions of copper nanoparticles on the pressureless bonding performance of the copper paste for die attachment

Phase field study of the combined effects of electromigration and thermomigration on phase segregation and physical properties of Sn58Bi solder joints under electric current stressing coupled with temperature gradient

Size and boundary effects on the growth and morphology evolution of interfacial intermetallic compound of Sn0.3Ag0.7Cu/Cu micro-bump joints

Microstructure Simulation and Thermo-Mechanical Behavior Analysis of Copper Filled Through Silicon Vias Using Coupled Phase Field and Finite Element Methods

Microstructure simulation and thermo-mechanical behavior analysis of Cu-filled through silicon vias (TSVs) using combined Monte Carlo and finite element method

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