UB Paderborn / Katalog / Suche / in CDI

1 – 25 von 127

Sortiert nach

5-Year Continence Rates, Satisfaction and Adverse Events of Burch Urethropexy and Fascial Sling Surgery for Urinary Incontinence

The Journal of urology, 2012-04, Vol.187 (4), p.1324-1330

2012

Volltextzugriff (PDF)

Electromigration performance of Through Silicon Via (TSV) – A modeling approach

Microelectronics and reliability, 2010-09, Vol.50 (9), p.1336-1340

2010

Volltextzugriff (PDF)

A Time-Domain Band-Gap Temperature Sensor in SOI CMOS for High-Temperature Applications

IEEE transactions on circuits and systems. II, Express briefs, 2015-05, Vol.62 (5), p.436-440

2015

Volltextzugriff (PDF)

Randomized Multicenter Clinical Trial of Myofascial Physical Therapy in Women With Interstitial Cystitis/Painful Bladder Syndrome and Pelvic Floor Tenderness

The Journal of urology, 2012-06, Vol.187 (6), p.2113-2118

2012

Volltextzugriff (PDF)

Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps

IEEE transactions on advanced packaging, 2009-11, Vol.32 (4), p.720-728

2009

Volltextzugriff (PDF)

A Capacitance to Digital Converter Using Continuous Time ΔΣ Modulator for Microphone-Based Auscultation

IEEE sensors journal, 2021-06, Vol.21 (12), p.13373-13383

2021

Volltextzugriff (PDF)

Development of 3-D Silicon Module With TSV for System in Packaging

IEEE transactions on components and packaging technologies, 2010-03, Vol.33 (1), p.3-9

2010

Volltextzugriff (PDF)

Investigation of Au-AuSn Bonding Below Eutectic Temperature for Gigahertz Bulk Acoustic Wave Transmission

2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 2022, p.315-320

2022

Volltextzugriff (PDF)

Effects of dimethyl sulphoxide and heparin on stretch‐activated ATP release by bladder urothelial cells from patients with interstitial cystitis

BJU international, 2002-09, Vol.90 (4), p.381-385

2002

Volltextzugriff (PDF)

Design of Wireless IoT Sensor Node & Platform for Water Pipeline Leak Detection

2019 IEEE Asia-Pacific Microwave Conference (APMC), 2019, p.1328-1330

2019

Volltextzugriff (PDF)

A Resonator-Adaptable Oscillator Using Varactor-Loaded Tuned Amplifiers

IEEE microwave and wireless components letters, 2017-08, Vol.27 (8), p.724-726

2017

Volltextzugriff (PDF)

Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP)

Microelectronics and reliability, 2008-04, Vol.48 (4), p.602-610

2008

Volltextzugriff (PDF)

A 2.1 pJ/SOP 40nm SNN Accelerator Featuring On-chip Transfer Learning using Delta STDP

ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC), 2021, p.95-98

2021

Volltextzugriff (PDF)

Sample-and-hold circuit with dynamic switch leakage compensation

Electronics letters, 2013-10, Vol.49 (21), p.1323-1325

2013

Volltextzugriff (PDF)

A 2.1 pJ/SOP 40nm SNN Accelerator Featuring On-chip Transfer Learning using Delta STDP

ESSCIRC 2021 - IEEE 47th European Solid State Circuits Conference (ESSCIRC), 2021, p.95-98

2021

Volltextzugriff (PDF)

171 Twenty-four month outcomes of randomized equivalence trial of retropubic and transobturator midurethral slings (TOMUS)

European urology supplements : official journal of the European Association of Urology, 2012-02, Vol.11 (1), p.e171-e171a

2012

Volltextzugriff (PDF)

Modelling and prediction on process dependent wafer warpage for FOWLP technology using finite element analysis and statistical approach

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 2020, p.386-393

2020

Volltextzugriff (PDF)

Electrical impedance tomography for sensing with integrated microelectrodes on a CMOS microchip

Sensors and actuators. B, Chemical, 2007-10, Vol.127 (1), p.97-101

2007

Volltextzugriff (PDF)

Modification of a CMOS microelectrode array for a bioimpedance imaging system

Sensors and actuators. B, Chemical, 2005-11, Vol.111 (Complete), p.305-309

2005

Volltextzugriff (PDF)

A Multiplexed Impedance Analyzer for Characterizing Polymer-Coated QCM Sensor Arrays

IEEE sensors journal, 2006-08, Vol.6 (4), p.996-1002

2006

Volltextzugriff (PDF)

Wave-breaking on CMOS interconnect

Electronics letters, 2002-08, Vol.38 (16), p.878-879

2002

Volltextzugriff (PDF)

Surface treatment of copper for the adhesion improvement to epoxy mold compounds

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206), 1998, p.1162-1166

1998

Volltextzugriff (PDF)

Nonlinear thermal stress/strain analyses of copper filled TSV (through silicon via) and their flip-chip microbumps

2008 58th Electronic Components and Technology Conference, 2008, p.1073-1081

2008

Volltextzugriff (PDF)

Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package

2009 59th Electronic Components and Technology Conference, 2009, p.305-312

2009

Volltextzugriff (PDF)

Ultrasonic Wavefront Computing Architecture on CMOS for Fourier Transform Computation

2023 8th International Conference on Frontiers of Signal Processing (ICFSP), 2023, p.12-16

2023

Volltextzugriff (PDF)

1 – 25 von 127

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(78)
Mit Volltextzugriff
(113)

Publikationsform

Sprache

Erscheinungsjahr

n.n

Thema

Science & Technology
(75)
Technology
(50)
Physics
(49)
Engineering
(43)
Engineering, Electrical & Electronic
(38)
Nuclear Experiment
(34)
Physical Sciences
(27)
Engineering, Manufacturing
(16)
Packaging
(16)
Testing
(15)
Life Sciences & Biomedicine
(13)
Materials Science
(13)
Materials Science, Multidisciplinary
(13)
Physics, Nuclear
(13)
Capacitive Sensors
(11)
Finite Element Methods
(10)
Biological And Medical Sciences
(9)
Exact Sciences And Technology
(9)
High Energy Physics - Experiment
(9)
Microelectronics
(9)

15 weitere anzeigen...

Weniger anzeigen...

Menü

Weitere Dienste

Einstellungen

5-Year Continence Rates, Satisfaction and Adverse Events of Burch Urethropexy and Fascial Sling Surgery for Urinary Incontinence

Electromigration performance of Through Silicon Via (TSV) – A modeling approach

A Time-Domain Band-Gap Temperature Sensor in SOI CMOS for High-Temperature Applications

Randomized Multicenter Clinical Trial of Myofascial Physical Therapy in Women With Interstitial Cystitis/Painful Bladder Syndrome and Pelvic Floor Tenderness

Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps

A Capacitance to Digital Converter Using Continuous Time ΔΣ Modulator for Microphone-Based Auscultation

Development of 3-D Silicon Module With TSV for System in Packaging

Investigation of Au-AuSn Bonding Below Eutectic Temperature for Gigahertz Bulk Acoustic Wave Transmission

Effects of dimethyl sulphoxide and heparin on stretch‐activated ATP release by bladder urothelial cells from patients with interstitial cystitis

Design of Wireless IoT Sensor Node & Platform for Water Pipeline Leak Detection

A Resonator-Adaptable Oscillator Using Varactor-Loaded Tuned Amplifiers

Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP)

A 2.1 pJ/SOP 40nm SNN Accelerator Featuring On-chip Transfer Learning using Delta STDP

Sample-and-hold circuit with dynamic switch leakage compensation

A 2.1 pJ/SOP 40nm SNN Accelerator Featuring On-chip Transfer Learning using Delta STDP

171 Twenty-four month outcomes of randomized equivalence trial of retropubic and transobturator midurethral slings (TOMUS)

Modelling and prediction on process dependent wafer warpage for FOWLP technology using finite element analysis and statistical approach

Electrical impedance tomography for sensing with integrated microelectrodes on a CMOS microchip

Modification of a CMOS microelectrode array for a bioimpedance imaging system

A Multiplexed Impedance Analyzer for Characterizing Polymer-Coated QCM Sensor Arrays

Wave-breaking on CMOS interconnect

Surface treatment of copper for the adhesion improvement to epoxy mold compounds

Nonlinear thermal stress/strain analyses of copper filled TSV (through silicon via) and their flip-chip microbumps

Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package

Ultrasonic Wavefront Computing Architecture on CMOS for Fourier Transform Computation

Suchergebnisse filtern