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The influence of strengthening and recrystallization to the cracking behavior of Ni, Sb, Bi alloyed SnAgCu solder during thermal cycling

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2016-01, Vol.652, p.264-270

2016

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Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling

Journal of electronic materials, 2008-06, Vol.37 (6), p.829-836

2008

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Guidelines to select underfills for flip chip on board assemblies and compliant interposers for chip scale package assemblies

Microelectronics and reliability, 2000-07, Vol.40 (7), p.1173-1180

2000

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Advances in the drop-impact reliability of solder joints for mobile applications

Microelectronics and reliability, 2009-02, Vol.49 (2), p.139-149

2009

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Frequency-dependent strain–life characteristics of Sn1.0Ag0.1Cu solder on cupper pad at high cyclic frequency

International journal of fatigue, 2014-02, Vol.59, p.43-49

2014

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Stress–strain characteristics of tin-based solder alloys at medium strain rate

Materials letters, 2008-06, Vol.62 (17), p.3031-3034

2008

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Investigation on flip chip solder joint fatigue with cure-dependent underfill properties

IEEE transactions on components and packaging technologies, 2003-06, Vol.26 (2), p.388-398

2003

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Correlation studies for component level ball impact shear test and board level drop test

Microelectronics and reliability, 2008-07, Vol.48 (7), p.1069-1078

2008

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High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies

Journal of electronic materials, 2009-06, Vol.38 (6), p.884-895

2009

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Solder parameter sensitivity for CSP life-time prediction using simulation-based optimization method

IEEE transactions on electronics packaging manufacturing, 2002-10, Vol.25 (4), p.318-325

2002

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Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives

Microelectronics and reliability, 2005-07, Vol.45 (7), p.1215-1221

2005

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A Study of Crack Propagation in Pb-Free Solder Joints

IEEE transactions on electronics packaging manufacturing, 2010-04, Vol.33 (2), p.84-90

2010

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Prediction of moisture induced failures in flip chip on flex interconnections with non-conductive adhesives

53rd Electronic Components and Technology Conference, 2003. Proceedings, 2003, p.1176-1180

2003

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Towards a predictive behavior of non-conductive adhesive interconnects in moisture environment

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.1, p.106-112 Vol.1

2004

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Some Characteristics of Anisotropic Conductive and Non-conductive Adhesive Flip Chip on Flex Interconnections

Journal of semiconductor technology and science, 2003, Vol.3 (3), p.122-131

2003

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Guidelines to select underfills for flip chip on board assemblies

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431), 2000, p.86-92

2000

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Solders Fatigue Prediction Using Interfacial Boundary Volume Criterion

Journal of electronic packaging, 2003-12, Vol.125 (4), p.582-588

2003

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Reliability of flip chip on board. First order model for the effect on contact integrity of moisture penetration in the underfill

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206), 1998, p.867-871

1998

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Feasibility study on board assembly of TSSOP components with NiPdAu PPF finish

2005 7th Electronic Packaging Technology Conference, 2005, Vol.2, p.7 pp.

2005

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3 - Anisotropic conductive adhesives in electronics

Advanced adhesives in electronics, 2011, p.53-104

2011

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Evaluation of soldering and reliability performance of NiPdAu finished PPF with Pb-free solder alloy 95.5Sn4.0Ag0.5Cu

56th Electronic Components and Technology Conference 2006, 2006, p.7 pp.

2006

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Improvement of mechanical impact resistance of BGA packages with Pb-free solder bumps

2006 8th Electronics Packaging Technology Conference, 2006, p.174-178

2006

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Recent advances in drop-impact reliability

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008, p.1-9

2008

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Flip-Chip Mounting of an RF IC using Eutectic Solder Bumps

ESSDERC '95: Proceedings of the 25th European Solid State Device Research Conference, 1995, p.409-413

1995

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To simulate the formation of TSSOP solder joint with SAC solder and assess on the effects of the stencil design and the misalignment on the joint shape

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971), 2004, p.313-317

2004

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The influence of strengthening and recrystallization to the cracking behavior of Ni, Sb, Bi alloyed SnAgCu solder during thermal cycling

Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling

Guidelines to select underfills for flip chip on board assemblies and compliant interposers for chip scale package assemblies

Advances in the drop-impact reliability of solder joints for mobile applications

Frequency-dependent strain–life characteristics of Sn1.0Ag0.1Cu solder on cupper pad at high cyclic frequency

Stress–strain characteristics of tin-based solder alloys at medium strain rate

Investigation on flip chip solder joint fatigue with cure-dependent underfill properties

Correlation studies for component level ball impact shear test and board level drop test

High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies

Solder parameter sensitivity for CSP life-time prediction using simulation-based optimization method

Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives

A Study of Crack Propagation in Pb-Free Solder Joints

Prediction of moisture induced failures in flip chip on flex interconnections with non-conductive adhesives

Towards a predictive behavior of non-conductive adhesive interconnects in moisture environment

Some Characteristics of Anisotropic Conductive and Non-conductive Adhesive Flip Chip on Flex Interconnections

Guidelines to select underfills for flip chip on board assemblies

Solders Fatigue Prediction Using Interfacial Boundary Volume Criterion

Reliability of flip chip on board. First order model for the effect on contact integrity of moisture penetration in the underfill

Feasibility study on board assembly of TSSOP components with NiPdAu PPF finish

3 - Anisotropic conductive adhesives in electronics

Evaluation of soldering and reliability performance of NiPdAu finished PPF with Pb-free solder alloy 95.5Sn4.0Ag0.5Cu

Improvement of mechanical impact resistance of BGA packages with Pb-free solder bumps

Recent advances in drop-impact reliability

Flip-Chip Mounting of an RF IC using Eutectic Solder Bumps

To simulate the formation of TSSOP solder joint with SAC solder and assess on the effects of the stencil design and the misalignment on the joint shape

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