UB Paderborn / Katalog / Suche / in CDI

Silicides and ohmic contacts

Materials chemistry and physics, 1998-02, Vol.52 (2), p.99-146

1998

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High Performance and Subambient Silicon Microchannel Cooling

Journal of heat transfer, 2007-08, Vol.129 (8), p.1046-1051

2007

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Oxidation and protection in copper and copper alloy thin films

Journal of applied physics, 1991-09, Vol.70 (5), p.2820-2827

1991

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Formation and stability of silicides on polycrystalline silicon

Materials science & engineering. R, Reports : a review journal, 1996-02, Vol.16 (2), p.43-96

1996

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Kinetics of silicide formation measured by in situ ramped resistance measurements

Journal of applied physics, 1996-04, Vol.79 (8), p.4087-4095

1996

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Effects of oxygen in TiNx on the diffusion of Cu in Cu/TiN/Al and Cu/TiNx/Si structures

Applied physics letters, 1991-02, Vol.58 (5), p.469-471

1991

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Activation energy for Ni2Si and NiSi formation measured over a wide range of ramp rates

Thin solid films, 1996-06, Vol.279 (1-2), p.193-198

COLGAN, E. G

1996

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Control of in-plane texture of body centered cubic metal thin films

Journal of applied physics, 1997-11, Vol.82 (9), p.4319-4326

1997

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The role of Cu distribution and Al2Cu precipitation on the electromigration reliability of submicrometer Al(Cu) lines

Journal of applied physics, 1994-04, Vol.75 (7), p.3423-3434

1994

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Formation of TiN-encapsulated copper structures in a NH3 ambient

Applied physics letters, 1992-06, Vol.60 (24), p.2983-2985

1992

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Interdiffusion and phase formation in Cu(Sn) alloy films

Journal of applied physics, 1998-01, Vol.83 (1), p.90-99

1998

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Initial phase formation and dissociation in the thin-film Ni/Al system

Journal of applied physics, 1985-12, Vol.58 (11), p.4125-4129

1985

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A practical implementation of silicon microchannel coolers for high power chips

Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005, 2005, p.1-7

2005

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Phase formation and dissociation in the thin-film Pt-Al system

Journal of applied physics, 1987-08, Vol.62 (4), p.1224-1231

COLGAN, E. G

1987

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Phase formation and dissociation in the thin-film Pd/Al system

Journal of applied physics, 1987-09, Vol.62 (6), p.2269-2274

COLGAN, E. G

1987

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Thin-film reactions of Al with Co, Cr, Mo, Ta, Ti, and W

Journal of materials research, 1989-08, Vol.4 (4), p.815-820

1989

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Kinetics of Al grain growth, Al2Cu precipitation, and dissolution in blanket thin films and fine lines

Journal of applied physics, 1994-09, Vol.76 (5), p.2781-2790

1994

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Nickel silicide thermal stability on polycrystalline and single crystalline silicon

Materials chemistry and physics, 1996-11, Vol.46 (2), p.209-214

1996

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The effect of Cu on morphological instabilities in thin Al/Pt films

Journal of materials research, 1992-05, Vol.7 (5), p.1093-1095

1992

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A Practical Implementation of Silicon Microchannel Coolers for High Power Chips

IEEE transactions on components and packaging technologies, 2007-06, Vol.30 (2), p.218-225

2007

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Materials Issues in Copper Interconnections

MRS bulletin, 1994-08, Vol.19 (8), p.23-29

1994

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Back-End-of-Line and Micro-C4 Thermal Resistance Contributions to 3-D Stack Packages

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-07, Vol.1 (7), p.1007-1014

2011

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Activation energy for Pt2Si and PtSi formation measured over a wide range of ramp rates

Journal of materials research, 1995-08, Vol.10 (8), p.1953-1957

Colgan, E.G.

1995

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Solutions to current crowding in circular vias for contact resistance measurements

Journal of applied physics, 1991-07, Vol.70 (1), p.253-258

1991

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Kinetics of the Growth of Spinel on Alumina Using Rutherford Backscattering Spectroscopy

Journal of the American Ceramic Society, 1987-07, Vol.70 (7), p.C-149-C-151

1987

Volltextzugriff (PDF)

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Silicides and ohmic contacts

High Performance and Subambient Silicon Microchannel Cooling

Oxidation and protection in copper and copper alloy thin films

Formation and stability of silicides on polycrystalline silicon

Kinetics of silicide formation measured by in situ ramped resistance measurements

Effects of oxygen in TiNx on the diffusion of Cu in Cu/TiN/Al and Cu/TiNx/Si structures

Activation energy for Ni2Si and NiSi formation measured over a wide range of ramp rates

Control of in-plane texture of body centered cubic metal thin films

The role of Cu distribution and Al2Cu precipitation on the electromigration reliability of submicrometer Al(Cu) lines

Formation of TiN-encapsulated copper structures in a NH3 ambient

Interdiffusion and phase formation in Cu(Sn) alloy films

Initial phase formation and dissociation in the thin-film Ni/Al system

A practical implementation of silicon microchannel coolers for high power chips

Phase formation and dissociation in the thin-film Pt-Al system

Phase formation and dissociation in the thin-film Pd/Al system

Thin-film reactions of Al with Co, Cr, Mo, Ta, Ti, and W

Kinetics of Al grain growth, Al2Cu precipitation, and dissolution in blanket thin films and fine lines

Nickel silicide thermal stability on polycrystalline and single crystalline silicon

The effect of Cu on morphological instabilities in thin Al/Pt films

A Practical Implementation of Silicon Microchannel Coolers for High Power Chips

Materials Issues in Copper Interconnections

Back-End-of-Line and Micro-C4 Thermal Resistance Contributions to 3-D Stack Packages

Activation energy for Pt2Si and PtSi formation measured over a wide range of ramp rates

Solutions to current crowding in circular vias for contact resistance measurements

Kinetics of the Growth of Spinel on Alumina Using Rutherford Backscattering Spectroscopy

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