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Numerical Implementation of a Unified Viscoplastic Model for Considering Solder Joint Response under Board-Level Temperature Cycling

Computer modeling in engineering & sciences, 2021-01, Vol.128 (2), p.639-668

2021

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Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability

Journal of applied physics, 2005-01, Vol.97 (2), p.024508-024508-8

2005

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Non-oscillatory fracture mode partition for interface crack under mixed-mode loading

International journal of solids and structures, 2024-07, Vol.298, p.112871, Article 112871

2024

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Warpage simulation for the reconstituted wafer used in fan-out wafer level packaging

Microelectronics and reliability, 2018-01, Vol.80, p.14-23

2018

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Cohesive-zone based fracture mechanics model of an edge delamination in bimaterial beam under mixed-mode bending test

European journal of mechanics, A, Solids, 2023-05, Vol.99, p.104928, Article 104928

2023

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Constitutive Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Alloys at Creep and Low Strain Rate Regimes

IEEE transactions on components and packaging technologies, 2008-09, Vol.31 (3), p.622-633

2008

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A unified viscoplastic model for characterizing the softening behavior of the Sn3.0Ag0.5Cu solder under monotonic and cyclic loading conditions

Microelectronics and reliability, 2021-04, Vol.119, p.114086, Article 114086

2021

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An experimental setup for characterizing subcritical debonding of materials interface under mixed mode fatigue loading

International journal of fatigue, 2018-09, Vol.114, p.109-119

2018

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Heat conduction in a functionally graded medium with an arbitrarily oriented crack

International journal of heat and mass transfer, 2013-12, Vol.67, p.514-522

2013

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Thermo-mechanical analysis of laser peeling of ultrathin glass for removing edge flaws in web processing applications

Microsystem technologies : sensors, actuators, systems integration, 2018, Vol.24 (1), p.397-409

2018

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On the Homogenization of Multilayered Interconnect for Interfacial Fracture Analysis

IEEE transactions on components and packaging technologies, 2008-06, Vol.31 (2), p.388-398

2008

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On the mechanics of laser peeling for ultra-thin glasses

Engineering fracture mechanics, 2016-09, Vol.163, p.236-247

2016

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Warpage evolution of overmolded ball grid array package during post-mold curing thermal process

Microelectronics and reliability, 2011-12, Vol.51 (12), p.2263-2273

2011

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Interconversions between linear viscoelastic functions with a time-dependent bulk modulus

Mathematics and mechanics of solids, 2018-06, Vol.23 (6), p.879-895

2018

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Time-domain viscoelastic constitutive model based on concurrent fitting of frequency-domain characteristics

Microelectronics and reliability, 2015-11, Vol.55 (11), p.2336-2344

2015

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Temperature distribution and heat flow around a crack of arbitrary orientation in a functionally graded medium

Journal of engineering mathematics, 2014-08, Vol.87 (1), p.123-137

2014

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A numerical procedure for simulating delamination growth on interfaces of interconnect structures

Microelectronics and reliability, 2012-07, Vol.52 (7), p.1464-1474

2012

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A Quantitative Evaluation of the Inelastic Energy Absorptions in Cu-Polyimide Interconnect and the Effect on Interface Debond Driving Force

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.721-726

2023

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Using DMA to Simultaneously Acquire Young's Relaxation Modulus and Time-dependent Poisson's Ratio of a Viscoelastic Material

Procedia engineering, 2014, Vol.79, p.153-159

2014

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Reliability model for bridging failure of Pb-free ball grid array solder joints under compressive load

Microelectronics and reliability, 2010-12, Vol.50 (12), p.2037-2050

2010

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Evaluation of Strain Measurement in a Die-to-Interposer Chip Using In Situ Synchrotron X-Ray Diffraction and Finite-Element Analysis

Journal of electronic materials, 2014, Vol.43 (1), p.52-56

2014

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Effect of thermal aging on board level drop reliability for Pb-free BGA packages

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.2, p.1256-1262 Vol.2

2004

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Design optimization for wafer level package by using sequential optimization and reliability assessment method

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2016, p.184-187

2016

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Debonding of graded coatings under in-plane compression

International journal of solids and structures, 2003-12, Vol.40 (25), p.7155-7179

2003

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The Effects of Time-Dependent Inelastic Behaviors on the Debonding of Cu-Polyimide Interface

2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022, p.1-4

2022

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Numerical Implementation of a Unified Viscoplastic Model for Considering Solder Joint Response under Board-Level Temperature Cycling

Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability

Non-oscillatory fracture mode partition for interface crack under mixed-mode loading

Warpage simulation for the reconstituted wafer used in fan-out wafer level packaging

Cohesive-zone based fracture mechanics model of an edge delamination in bimaterial beam under mixed-mode bending test

Constitutive Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Alloys at Creep and Low Strain Rate Regimes

A unified viscoplastic model for characterizing the softening behavior of the Sn3.0Ag0.5Cu solder under monotonic and cyclic loading conditions

An experimental setup for characterizing subcritical debonding of materials interface under mixed mode fatigue loading

Heat conduction in a functionally graded medium with an arbitrarily oriented crack

Thermo-mechanical analysis of laser peeling of ultrathin glass for removing edge flaws in web processing applications

On the Homogenization of Multilayered Interconnect for Interfacial Fracture Analysis

On the mechanics of laser peeling for ultra-thin glasses

Warpage evolution of overmolded ball grid array package during post-mold curing thermal process

Interconversions between linear viscoelastic functions with a time-dependent bulk modulus

Time-domain viscoelastic constitutive model based on concurrent fitting of frequency-domain characteristics

Temperature distribution and heat flow around a crack of arbitrary orientation in a functionally graded medium

A numerical procedure for simulating delamination growth on interfaces of interconnect structures

A Quantitative Evaluation of the Inelastic Energy Absorptions in Cu-Polyimide Interconnect and the Effect on Interface Debond Driving Force

Using DMA to Simultaneously Acquire Young's Relaxation Modulus and Time-dependent Poisson's Ratio of a Viscoelastic Material

Reliability model for bridging failure of Pb-free ball grid array solder joints under compressive load

Evaluation of Strain Measurement in a Die-to-Interposer Chip Using In Situ Synchrotron X-Ray Diffraction and Finite-Element Analysis

Effect of thermal aging on board level drop reliability for Pb-free BGA packages

Design optimization for wafer level package by using sequential optimization and reliability assessment method

Debonding of graded coatings under in-plane compression

The Effects of Time-Dependent Inelastic Behaviors on the Debonding of Cu-Polyimide Interface

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