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Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits

Microelectronics and reliability, 2012-03, Vol.52 (3), p.530-533

2012

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On the Mechanical Stresses of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH – Enabling Robust and Reliable 3-D Interconnect/Integrated Circuit (IC) Technology

Procedia engineering, 2016, Vol.139, p.101-111

2016

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Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique

Thermochimica acta, 2007-04, Vol.455 (1), p.148-155

2007

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Closed-Form Forward-Position Solution for a 6-Dof 3-PPSP Parallel Mechanism and Its Implementation

The International journal of robotics research, 2001-01, Vol.20 (1), p.85-99

2001

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Thermal residual stresses in thick graphite/epoxy composite laminates―uniaxial approach

Experimental mechanics, 1993-03, Vol.33 (1), p.70-76

1993

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3D memory chip stacking by multi-layer self-assembly technology

2013 IEEE International 3D Systems Integration Conference (3DIC), 2013, p.1-4

2013

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Effect of Free Radical Activation for Low Temperature Si to Si Wafer Bonding

Journal of the Electrochemical Society, 2010, Vol.157 (1), p.H109

2010

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Pivot nonlinearity in disk drive rotary actuator: measurement and modeling

IEEE transactions on magnetics, 1997-09, Vol.33 (5), p.2635-2637

1997

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Low temperature exfoliation process in hydrogen-implanted germanium layers

Journal of applied physics, 2010-03, Vol.107 (5), p.054315-054315-5

2010

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Analysis of a Novel 6-DOF, 3-PPSP Parallel Manipulator

The International journal of robotics research, 1997-12, Vol.16 (6), p.859-872

1997

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Hot carrier (HC) and bias-temperature-instability (BTI) degradation of MuGFETs on silicon oxide and silicon nitride buried layers

2009 Proceedings of the European Solid State Device Research Conference, 2009, p.261-264

2009

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Comparison of mechanical stresses of Cu Through-Silicon Via (TSV) samples fabricated by Hynix vs. SEMATECH using synchrotron X-ray microdiffraction for 3-D integration and reliability

2012 IEEE International Interconnect Technology Conference, 2012, p.1-3

2012

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The Ultraviolet Galaxy Luminosity Function in the Local Universe from GALEX Data

The Astrophysical journal, 2005-01, Vol.619 (1), p.L15-L18

2005

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Development of Micromechanics Finite Element for Analysis of Composites With Local Damage

Journal of energy resources technology, 1991-09, Vol.113 (3), p.171-175

1991

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Development of a new finite element formulation for the elasto-plastic analysis of fiber-reinforced composites

Computers & structures, 1990, Vol.35 (5), p.563-570

1990

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Ge/Si p-n Diode Fabricated by Direct Wafer Bonding and Layer Exfoliation

ECS transactions, 2012, Vol.45 (6), p.131-139

2012

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Effects of immunosuppressants, FK506 and cyclosporin A, on the osteogenic differentiation of rat mesenchymal stem cells

Journal of Periodontal & Implant Science, 2012, 42(3), , pp.73-80

2012

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Comprehensive Study of Wafer-bonded Si-Si and Si-Ge Structures

Byun, K. Y

2011

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Low-Temperature Fabrication of Germanium-on-Insulator Using Remote Plasma Activation Bonding and Hydrogen Exfoliation

Semiconductor-On-Insulator Materials for Nanoelectronics Applications, p.31-46

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Development of differential affinities and positional information in embryonic retina cells: Inhibition by BrdU

Cell differentiation, 1981-12, Vol.10 (6), p.317-327

1981

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Optimization of wide-bandwidth hard disk drive actuator design using statistical methods

IEEE transactions on magnetics, 2005-02, Vol.41 (2), p.836-841

2005

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Enzymatic synthesis of sorbitan methacrylate: Comparison of methacrylic acid and vinyl methacrylate

Biochemical engineering journal, 2006-04, Vol.29 (1), p.69-74

2006

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Board-level reliability of Pb-free solder joints of TSOP and various CSPs

IEEE transactions on electronics packaging manufacturing, 2005-04, Vol.28 (2), p.168-175

2005

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Thermal Residual Stress-Strain Analysis for Composite Materials Using High Sensitivity Moire Interferometry

Byun, K Y

1993

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Optimization of wide bandwidth hard disk drive actuator design using statistical methods

APMRC 2004 Asia-Pacific Magnetic Recording Conference, 2004, 2004, p.64-65

2004

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Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits

On the Mechanical Stresses of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH – Enabling Robust and Reliable 3-D Interconnect/Integrated Circuit (IC) Technology

Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique

Closed-Form Forward-Position Solution for a 6-Dof 3-PPSP Parallel Mechanism and Its Implementation

Thermal residual stresses in thick graphite/epoxy composite laminates―uniaxial approach

3D memory chip stacking by multi-layer self-assembly technology

Effect of Free Radical Activation for Low Temperature Si to Si Wafer Bonding

Pivot nonlinearity in disk drive rotary actuator: measurement and modeling

Low temperature exfoliation process in hydrogen-implanted germanium layers

Analysis of a Novel 6-DOF, 3-PPSP Parallel Manipulator

Hot carrier (HC) and bias-temperature-instability (BTI) degradation of MuGFETs on silicon oxide and silicon nitride buried layers

Comparison of mechanical stresses of Cu Through-Silicon Via (TSV) samples fabricated by Hynix vs. SEMATECH using synchrotron X-ray microdiffraction for 3-D integration and reliability

The Ultraviolet Galaxy Luminosity Function in the Local Universe from GALEX Data

Development of Micromechanics Finite Element for Analysis of Composites With Local Damage

Development of a new finite element formulation for the elasto-plastic analysis of fiber-reinforced composites

Ge/Si p-n Diode Fabricated by Direct Wafer Bonding and Layer Exfoliation

Effects of immunosuppressants, FK506 and cyclosporin A, on the osteogenic differentiation of rat mesenchymal stem cells

Comprehensive Study of Wafer-bonded Si-Si and Si-Ge Structures

Low-Temperature Fabrication of Germanium-on-Insulator Using Remote Plasma Activation Bonding and Hydrogen Exfoliation

Development of differential affinities and positional information in embryonic retina cells: Inhibition by BrdU

Optimization of wide-bandwidth hard disk drive actuator design using statistical methods

Enzymatic synthesis of sorbitan methacrylate: Comparison of methacrylic acid and vinyl methacrylate

Board-level reliability of Pb-free solder joints of TSOP and various CSPs

Thermal Residual Stress-Strain Analysis for Composite Materials Using High Sensitivity Moire Interferometry

Optimization of wide bandwidth hard disk drive actuator design using statistical methods

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