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Thermomechanical residual stress evaluation in multi-crystalline silicon solar cells of photovoltaic modules with different encapsulation polymers using synchrotron X-ray microdiffraction

Solar energy materials and solar cells, 2019-05, Vol.193 (C), p.387-402

2019

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Plasticity evolution in nanoscale Cu/Nb single-crystal multilayers as revealed by synchrotron X-ray microdiffraction

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2015-05, Vol.635 (C), p.6-12

2015

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Enabling thin silicon technologies for next generation c-Si solar PV renewable energy systems using synchrotron X-ray microdiffraction as stress and crack mechanism probe

Solar energy materials and solar cells, 2014-11, Vol.130 (C), p.303-308

2014

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Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits

Microelectronics and reliability, 2012-03, Vol.52 (3), p.530-533

2012

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A search for evidence of strain gradient hardening in Au submicron pillars under uniaxial compression using synchrotron X-ray microdiffraction

Acta materialia, 2008-02, Vol.56 (3), p.602-608

2008

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On the Mechanical Stresses of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH – Enabling Robust and Reliable 3-D Interconnect/Integrated Circuit (IC) Technology

Procedia engineering, 2016, Vol.139, p.101-111

2016

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Mechanical Studies of Solar Photovoltaics (PV) Backsheets Under Salt Damp Heat Environments

Procedia engineering, 2017, Vol.215, p.238-245

2017

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Effects of interface shear strength during failure of semicoherent Metal–Metal nanolaminates: An example of accumulative roll-bonded Cu/Nb

Acta materialia, 2018-09, Vol.156 (C), p.125-135

2018

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Effect of interconnect geometry on the evolution of stresses in a solar photovoltaic laminate during and after lamination

Solar energy materials and solar cells, 2018-12, Vol.187, p.241-248

2018

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Effect of encapsulants on the thermomechanical residual stress in the back-contact silicon solar cells of photovoltaic modules – A constrained local curvature model

Solar energy, 2019-04, Vol.182, p.134-147

2019

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Enabling lightweight polycarbonate-polycarbonate (PC-PC) photovoltaics module technology – Enhancing integration of silicon solar cells into aesthetic design for greener building and urban structures

Solar energy, 2022-03, Vol.235, p.129-139

2022

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Probing stress and fracture mechanism in encapsulated thin silicon solar cells by synchrotron X-ray microdiffraction

Solar energy materials and solar cells, 2017-04, Vol.162 (C), p.30-40

2017

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Enabling curvable silicon photovoltaics technology using polycarbonate-sandwiched laminate design

Solar energy, 2021-05, Vol.220, p.462-472

2021

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Growth and structural characterization of epitaxial Cu/Nb multilayers

Thin solid films, 2011-04, Vol.519 (13), p.4137-4143

2011

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Probing Plasticity Mechanisms in Low Melting Temperature Metallic Nanostructures Using Synchrotron X-Ray Microdiffraction

Procedia engineering, 2017, Vol.215, p.246-262

2017

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Water mass characteristic in the outflow region of the Indonesian throughflow during and post 2016 negative Indian ocean dipole event

IOP conference series. Earth and environmental science, 2018-05, Vol.149 (1), p.12053

2018

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Electromigration-Induced Plastic Deformation in Cu Interconnects: Effects on Current Density Exponent, n, and Implications for EM Reliability Assessment

Journal of electronic materials, 2010-11, Vol.39 (11), p.2483-2488

2010

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Critical Temperature Shift for Stress Induced Voiding in Advanced Cu Interconnects for 32 nm and Beyond

Procedia engineering, 2016, Vol.139, p.32-40

2016

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Electromigration-Induced Plasticity: Texture Correlation and Implications for Reliability Assessment

Journal of electronic materials, 2009-03, Vol.38 (3), p.379-391

2009

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Crystal Plasticity in Cu Damascene Interconnect Lines UndergoingElectromigration As Revealed by Synchrotron X-Ray Microdiffraction

Applied physics letters, 2006-01, Vol.88

2006

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Electromigration-induced Plasticity: Texture Correlation and Implications for Reliability Assessment

Journal of electronic materials, 2008-05

2008

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Critical temperature shift for Stress Induced Voiding in advanced Cu interconnects for 32 nm and beyond

2012 IEEE International Reliability Physics Symposium (IRPS), 2012, p.EM.8.1-EM.8.3

2012

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IEEE_Xplore

6 - The evolution of microstructure in copper interconnects during electromigration

Electromigration in thin films and electronic devices, 2011, p.135-189

Budiman, A.S.

2011

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Plasticity-Amplified Diffusivity: Dislocation Cores as Fast Diffusion Paths in CU Interconnects

2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual, 2007, p.122-127

2007

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IEEE_Xplore

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Electromigration in thin films and electronic devices, 2011, p.ix-xii

2011

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Thermomechanical residual stress evaluation in multi-crystalline silicon solar cells of photovoltaic modules with different encapsulation polymers using synchrotron X-ray microdiffraction

Plasticity evolution in nanoscale Cu/Nb single-crystal multilayers as revealed by synchrotron X-ray microdiffraction

Enabling thin silicon technologies for next generation c-Si solar PV renewable energy systems using synchrotron X-ray microdiffraction as stress and crack mechanism probe

Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits

A search for evidence of strain gradient hardening in Au submicron pillars under uniaxial compression using synchrotron X-ray microdiffraction

On the Mechanical Stresses of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH – Enabling Robust and Reliable 3-D Interconnect/Integrated Circuit (IC) Technology

Mechanical Studies of Solar Photovoltaics (PV) Backsheets Under Salt Damp Heat Environments

Effects of interface shear strength during failure of semicoherent Metal–Metal nanolaminates: An example of accumulative roll-bonded Cu/Nb

Effect of interconnect geometry on the evolution of stresses in a solar photovoltaic laminate during and after lamination

Effect of encapsulants on the thermomechanical residual stress in the back-contact silicon solar cells of photovoltaic modules – A constrained local curvature model

Enabling lightweight polycarbonate-polycarbonate (PC-PC) photovoltaics module technology – Enhancing integration of silicon solar cells into aesthetic design for greener building and urban structures

Probing stress and fracture mechanism in encapsulated thin silicon solar cells by synchrotron X-ray microdiffraction

Enabling curvable silicon photovoltaics technology using polycarbonate-sandwiched laminate design

Growth and structural characterization of epitaxial Cu/Nb multilayers

Probing Plasticity Mechanisms in Low Melting Temperature Metallic Nanostructures Using Synchrotron X-Ray Microdiffraction

Water mass characteristic in the outflow region of the Indonesian throughflow during and post 2016 negative Indian ocean dipole event

Electromigration-Induced Plastic Deformation in Cu Interconnects: Effects on Current Density Exponent, n, and Implications for EM Reliability Assessment

Critical Temperature Shift for Stress Induced Voiding in Advanced Cu Interconnects for 32 nm and Beyond

Electromigration-Induced Plasticity: Texture Correlation and Implications for Reliability Assessment

Crystal Plasticity in Cu Damascene Interconnect Lines UndergoingElectromigration As Revealed by Synchrotron X-Ray Microdiffraction

Electromigration-induced Plasticity: Texture Correlation and Implications for Reliability Assessment

Critical temperature shift for Stress Induced Voiding in advanced Cu interconnects for 32 nm and beyond

6 - The evolution of microstructure in copper interconnects during electromigration

Plasticity-Amplified Diffusivity: Dislocation Cores as Fast Diffusion Paths in CU Interconnects

Contributor contact details

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