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Polymeric Antimicrobial N‑Halamine-Surface Modification of Stainless Steel

Industrial & engineering chemistry research, 2017-10, Vol.56 (41), p.11773-11781

2017

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Polymer-Initiated Photogeneration of Silver Nanoparticles in SPEEK/PVA Films: Direct Metal Photopatterning

Journal of the American Chemical Society, 2004-01, Vol.126 (1), p.10-11

2004

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Effects of Ga Additives on the Thermal and Wetting Performance of Sn-0.7Cu Solder

Journal of electronic materials, 2019-06, Vol.48 (6), p.3970-3978

2019

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Anisotropic Mechanical Properties of SAC Solder Joints in Microelectronic Packaging and Prediction of Uniaxial Creep Using Nanoindentation Creep

Experimental mechanics, 2017-04, Vol.57 (4), p.603-614

2017

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Effects of Interrupting the Contiguous Sn Thin-Film Network in Whiskering

IEEE transactions on components, packaging, and manufacturing technology (2011), 2021-12, Vol.11 (12), p.2114-2121

2021

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Influence of Surface Segregation on Wetting of Sn-Ag-Cu (SAC) Series and Pb-Containing Solder Alloys

Journal of electronic materials, 2011-10, Vol.40 (10), p.2093-2104

2011

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Methods for fast, reliable growth of Sn whiskers

Surface science, 2016-10, Vol.652, p.355-366

2016

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N-halamine surface coating for mitigation of biofilm and microbial contamination in water systems for space travel

Biofilm, 2022-12, Vol.4, p.100076-100076, Article 100076

2022

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High-temperature ohmic contact to n-type 6H-SiC using nickel

Journal of applied physics, 1995-02, Vol.77 (3), p.1317-1319

1995

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Lasing in whispering gallery mode in ZnO nanonails

Journal of applied physics, 2006-05, Vol.99 (9), p.093112-093112-4

2006

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Effects of postgrowth annealing treatment on the photoluminescence of zinc oxide nanorods

Journal of applied physics, 2006-06, Vol.99 (11)

2006

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Real-time scanning electron microscopy and Auger spectroscopy of wetting in Sn-3.3Ag-4.8Bi solder paste wetted to Ni-Au

Journal of electronic materials, 2005-03, Vol.34 (3), p.248-265

2005

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Comparative electron spectroscopic studies of surface segregation on SiC(0001) and SiC(0001)

Journal of applied physics, 1986-10, Vol.60 (8), p.2842-2853

1986

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Effects of Isothermal Aging on the Thermal Expansion of Several Sn-Based Lead-Free Solder Alloys

Journal of materials engineering and performance, 2018-03, Vol.27 (3), p.1274-1280

2018

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Surface Studies on SiC as Related to Contacts

physica status solidi (b), 1997-07, Vol.202 (1), p.549-580

Bozack, M. J.

1997

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Structural modifications in the amino acid lysine induced by soft x-ray irradiation

The Journal of chemical physics, 1994-06, Vol.100 (11), p.8392-8398

1994

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Real-time wetting dynamics and interfacial chemistry in low-melting 57Bi–42Sn–1Ag solder paste on Ni–Au

Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 2004-11, Vol.22 (6), p.2223-2233

Bozack, M. J.

2004

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Comparative oxidation studies of SiC(ooo1) and SiC(0001) surfaces

Journal of applied physics, 1986-10, Vol.60 (7), p.2558-2563

1986

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Oxidation-Induced Growth of Sn Whiskers in a Pure Oxygen Gas Environment

2010 Proceedings of the 56th IEEE Holm Conference on Electrical Contacts, 2010, p.1-5

2010

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Growth of Sn Whiskers on Semiconductor and Insulator Surfaces

2010 Proceedings of the 56th IEEE Holm Conference on Electrical Contacts, 2010, p.1-6

2010

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Methods in semiconductor surface chemistry

Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 1987-01, Vol.5 (1), p.1-8

1987

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High temperature stability of chromium boride ohmic contacts to p-type 6H-SiC

Journal of electronic materials, 1998-04, Vol.27 (4), p.324-329

1998

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The Effects of Surface Finish Roughness on Intermetallic Layer Growth, Intermetallic Interface Roughness, and Solder Joint Reliability

2010 Proceedings of the 56th IEEE Holm Conference on Electrical Contacts, 2010, p.1-5

2010

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Vibration-Induced Changes in the Contact Resistance of High Power Electrical Connectors for Hybrid Vehicles

IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-02, Vol.2 (2), p.185-193

2012

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Ohmic contacts to P-type epitaxial and implanted 4H-SiC

Materials science forum, 2006, Vol.527-529, p.895-898

2006

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Polymeric Antimicrobial N‑Halamine-Surface Modification of Stainless Steel

Polymer-Initiated Photogeneration of Silver Nanoparticles in SPEEK/PVA Films: Direct Metal Photopatterning

Effects of Ga Additives on the Thermal and Wetting Performance of Sn-0.7Cu Solder

Anisotropic Mechanical Properties of SAC Solder Joints in Microelectronic Packaging and Prediction of Uniaxial Creep Using Nanoindentation Creep

Effects of Interrupting the Contiguous Sn Thin-Film Network in Whiskering

Influence of Surface Segregation on Wetting of Sn-Ag-Cu (SAC) Series and Pb-Containing Solder Alloys

Methods for fast, reliable growth of Sn whiskers

N-halamine surface coating for mitigation of biofilm and microbial contamination in water systems for space travel

High-temperature ohmic contact to n-type 6H-SiC using nickel

Lasing in whispering gallery mode in ZnO nanonails

Effects of postgrowth annealing treatment on the photoluminescence of zinc oxide nanorods

Real-time scanning electron microscopy and Auger spectroscopy of wetting in Sn-3.3Ag-4.8Bi solder paste wetted to Ni-Au

Comparative electron spectroscopic studies of surface segregation on SiC(0001) and SiC(0001)

Effects of Isothermal Aging on the Thermal Expansion of Several Sn-Based Lead-Free Solder Alloys

Surface Studies on SiC as Related to Contacts

Structural modifications in the amino acid lysine induced by soft x-ray irradiation

Real-time wetting dynamics and interfacial chemistry in low-melting 57Bi–42Sn–1Ag solder paste on Ni–Au

Comparative oxidation studies of SiC(ooo1) and SiC(0001) surfaces

Oxidation-Induced Growth of Sn Whiskers in a Pure Oxygen Gas Environment

Growth of Sn Whiskers on Semiconductor and Insulator Surfaces

Methods in semiconductor surface chemistry

High temperature stability of chromium boride ohmic contacts to p-type 6H-SiC

The Effects of Surface Finish Roughness on Intermetallic Layer Growth, Intermetallic Interface Roughness, and Solder Joint Reliability

Vibration-Induced Changes in the Contact Resistance of High Power Electrical Connectors for Hybrid Vehicles

Ohmic contacts to P-type epitaxial and implanted 4H-SiC

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