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Shear based analysis of nickel nano-plate by molecular dynamics simulations

AIP Conference Proceedings, 2018, Vol.1980 (1)

2018

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Simultaneous Improvement in the Elastic and Fracture Properties of Graphene-Epoxy Nanocomposites ̶ a Computational Perspective

Carbon (New York), 2024-10, Vol.229, p.119455, Article 119455

2024

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Engineered defects to modulate fracture strength of single layer MoS2: An atomistic study

Physica. B, Condensed matter, 2020-09, Vol.592, p.412219, Article 412219

2020

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Investigation on the mechanical properties and fracture phenomenon of silicon doped graphene by molecular dynamics simulation

RSC advances, 2020-08, Vol.1 (52), p.31318-31332

2020

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Atomic-scale analysis of the physical strength and phonon transport mechanisms of monolayer β-bismuthene

Physical chemistry chemical physics : PCCP, 2020-12, Vol.22 (48), p.28238-28255

2020

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Giant pyroelectricity in nanomembranes

Nature (London), 2022-07, Vol.607 (7919), p.480-485

2022

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Phonon thermal conductivity of the stanene/hBN van der Waals heterostructure

Physical chemistry chemical physics : PCCP, 2021-05, Vol.23 (18), p.1128-1138

2021

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Tuning the mechanical properties of functionally graded nickel and aluminium alloy at the nanoscale

RSC advances, 2021-09, Vol.11 (49), p.375-3718

2021

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Inherent mechanical properties of bilayer germanene coupled by covalent bonding

RSC advances, 2019-10, Vol.9 (59), p.34437-3445

2019

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Nanomechanics of antimonene allotropes under tensile loading

Physical chemistry chemical physics : PCCP, 2021-03, Vol.23 (1), p.6241-6251

2021

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Mechanical anisotropy and tension-compression asymmetry of Au coated Si nanowafers: An atomistic approach

AIP Conference Proceedings, 2021, Vol.2324 (1)

2021

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Intrinsic mechanical properties of monolayer nickel ditelluride: An atomistic study

Computational Condensed Matter, 2021-03, Vol.26, p.e00522, Article e00522

2021

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Atomistic modelling of functionally graded Cu-Ni alloy and its implication on the mechanical properties of nanowires

AIP Conference Proceedings, 2021, Vol.2324 (1)

2021

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Temperature and size effect on the mechanical properties of indium phosphide nanowire: An atomistic study

AIP Conference Proceedings, 2018, Vol.1980 (1)

2018

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MHD mixed convection analysis of non-Newtonian power law fluid in an open channel with round cavity

AIP Conference Proceedings, 2017, Vol.1851 (1)

2017

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Insights into the Mechanical Properties of SnAgCu Based Solder Materials Including Void Effects: An Atomistic Study

2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021, p.1250-1256

2021

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Shear based analysis of nickel nano-plate by molecular dynamics simulations

Simultaneous Improvement in the Elastic and Fracture Properties of Graphene-Epoxy Nanocomposites ̶ a Computational Perspective

Engineered defects to modulate fracture strength of single layer MoS2: An atomistic study

Investigation on the mechanical properties and fracture phenomenon of silicon doped graphene by molecular dynamics simulation

Atomic-scale analysis of the physical strength and phonon transport mechanisms of monolayer β-bismuthene

Giant pyroelectricity in nanomembranes

Phonon thermal conductivity of the stanene/hBN van der Waals heterostructure

Tuning the mechanical properties of functionally graded nickel and aluminium alloy at the nanoscale

Inherent mechanical properties of bilayer germanene coupled by covalent bonding

Nanomechanics of antimonene allotropes under tensile loading

Mechanical anisotropy and tension-compression asymmetry of Au coated Si nanowafers: An atomistic approach

Intrinsic mechanical properties of monolayer nickel ditelluride: An atomistic study

Atomistic modelling of functionally graded Cu-Ni alloy and its implication on the mechanical properties of nanowires

Temperature and size effect on the mechanical properties of indium phosphide nanowire: An atomistic study

MHD mixed convection analysis of non-Newtonian power law fluid in an open channel with round cavity

Insights into the Mechanical Properties of SnAgCu Based Solder Materials Including Void Effects: An Atomistic Study

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