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Microstructural Optimization of a Zeolite Membrane for Organic Vapor Separation

Science (American Association for the Advancement of Science), 2003-04, Vol.300 (5618), p.456-460

2003

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Electron scattering at interfaces in nano-scale vertical interconnects: A combined experimental and ab initio study

Applied physics letters, 2018-04, Vol.112 (16)

2018

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Zeolite (MFI) Crystal Morphology Control Using Organic Structure-Directing Agents

Chemistry of materials, 2004-12, Vol.16 (26), p.5697-5705

2004

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Separation of close-boiling hydrocarbon mixtures by MFI and FAU membranes made by secondary growth

Microporous and mesoporous materials, 2001-11, Vol.48 (1), p.219-228

2001

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Simulations and experiments on the growth and microstructure of zeolite MFI films and membranes made by secondary growth

Microporous and mesoporous materials, 2001-02, Vol.42 (2), p.191-203

2001

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Artificial Intelligence (AI) based methodology to minimize asymmetric bare substrate warpage

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1213-1218

2023

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On the path to AI hardware via chiplet integration enabled by high density organic substrates

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1374-1380

2023

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A Flexible and Inherently Self-Consistent Methodology for MOL/BEOL/MIMCAP TDDB Applications with Excessive Variability-Induced Degradation

2022 IEEE International Reliability Physics Symposium (IRPS), 2022, p.2A.2-1-2A.2-9

2022

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A novel tri-layer nanoindentation method to measure the mechanical properties of a porous brittle ultra-low-k dielectric thin film

Extreme Mechanics Letters, 2017-05, Vol.13, p.100-107

2017

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Creep characterization of solder bumps using nanoindentation

Mechanics of time-dependent materials, 2017-08, Vol.21 (3), p.287-305

2017

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Delayed mechanical failure of the under-bump interconnects by bump shearing

Journal of applied physics, 2012-04, Vol.111 (8), p.083503-083503-5

2012

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Detection of charge carrier confinement into mobile ionic defects in nanoporous dielectric films for advanced interconnects

Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 2014-09, Vol.32 (5)

2014

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A critical analysis of sampling-based reconstruction methodology for dielectric breakdown systems (BEOL/MOL/FEOL)

2015 IEEE International Reliability Physics Symposium, 2015, p.2A.2.1-2A.2.11

2015

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Fluorescence confocal optical microscopy imaging of the grain boundary structure of zeolite MFI membranes made by secondary (seeded) growth

Journal of membrane science, 2001-02, Vol.182 (1), p.103-109

2001

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Fundamental statistical properties of reconstruction methodology for TDDB with variability in BEOL/MOL/FEOL applications

2016 IEEE International Reliability Physics Symposium (IRPS), 2016, p.3A-1-1-3A-1-13

2016

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Ultrathin (8-14 nm) Conformal SiN for sub-20 nm Copper/Low-k Interconnects

ECS transactions, 2014, Vol.61 (3), p.17-28

2014

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Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.872-877

2023

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Reliable Chiplet Integration on High Density Laminate (2.XD) for AI Hardware

2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.581-586

2024

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Electrical Characterization and Modeling of 2-\mu \mathrm and Electrical Characterization and Modeling of 2-µm and 1.5-µm Line-and-Space High-Density Signal Wiring in Organic Interposer.5-\mu \mathrm$ Line-and-Space High-Density Signal Wiring in Organic Interposer

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1590-1596

2023

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Line Resistance and Electromigration Variations Induced by Hydrogen-Based Plasma Modifications to the Silicon Carbonitride/Copper Interface

Journal of the Electrochemical Society, 2007, Vol.154 (7), p.H604

2007

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Ultrathin (5-35 nm) SiCNH Dielectrics for Damascene Cu Cap Application: Thickness Scaling and Oxidation Barrier Performance Limitation

ECS transactions, 2010, Vol.33 (12), p.137-145

2010

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Robust Ultrathin (20-25 nm)Trilayer Dielectric Low k Cu Damascene Cap for Sub-30 nm Nanoelectric Devices

ECS transactions, 2012-05, Vol.41 (43), p.3-9

2012

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Interconnect scaling challenges, and opportunities to enable system-level performance beyond 30 nm pitch

2020 IEEE International Electron Devices Meeting (IEDM), 2020, p.20.4.1-20.4.4

2020

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Ruthenium interconnect resistivity and reliability at 48 nm pitch

2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2016, p.31-33

2016

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Modeling, analysis, and characterization of zeolite MFI crystal and membrane growth

Bonilla, Griselda

2004

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Microstructural Optimization of a Zeolite Membrane for Organic Vapor Separation

Electron scattering at interfaces in nano-scale vertical interconnects: A combined experimental and ab initio study

Zeolite (MFI) Crystal Morphology Control Using Organic Structure-Directing Agents

Separation of close-boiling hydrocarbon mixtures by MFI and FAU membranes made by secondary growth

Simulations and experiments on the growth and microstructure of zeolite MFI films and membranes made by secondary growth

Artificial Intelligence (AI) based methodology to minimize asymmetric bare substrate warpage

On the path to AI hardware via chiplet integration enabled by high density organic substrates

A Flexible and Inherently Self-Consistent Methodology for MOL/BEOL/MIMCAP TDDB Applications with Excessive Variability-Induced Degradation

A novel tri-layer nanoindentation method to measure the mechanical properties of a porous brittle ultra-low-k dielectric thin film

Creep characterization of solder bumps using nanoindentation

Delayed mechanical failure of the under-bump interconnects by bump shearing

Detection of charge carrier confinement into mobile ionic defects in nanoporous dielectric films for advanced interconnects

A critical analysis of sampling-based reconstruction methodology for dielectric breakdown systems (BEOL/MOL/FEOL)

Fluorescence confocal optical microscopy imaging of the grain boundary structure of zeolite MFI membranes made by secondary (seeded) growth

Fundamental statistical properties of reconstruction methodology for TDDB with variability in BEOL/MOL/FEOL applications

Ultrathin (8-14 nm) Conformal SiN for sub-20 nm Copper/Low-k Interconnects

Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps

Reliable Chiplet Integration on High Density Laminate (2.XD) for AI Hardware

Electrical Characterization and Modeling of 2-\mu \mathrm and Electrical Characterization and Modeling of 2-µm and 1.5-µm Line-and-Space High-Density Signal Wiring in Organic Interposer.5-\mu \mathrm$ Line-and-Space High-Density Signal Wiring in Organic Interposer

Line Resistance and Electromigration Variations Induced by Hydrogen-Based Plasma Modifications to the Silicon Carbonitride/Copper Interface

Ultrathin (5-35 nm) SiCNH Dielectrics for Damascene Cu Cap Application: Thickness Scaling and Oxidation Barrier Performance Limitation

Robust Ultrathin (20-25 nm)Trilayer Dielectric Low k Cu Damascene Cap for Sub-30 nm Nanoelectric Devices

Interconnect scaling challenges, and opportunities to enable system-level performance beyond 30 nm pitch

Ruthenium interconnect resistivity and reliability at 48 nm pitch

Modeling, analysis, and characterization of zeolite MFI crystal and membrane growth

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