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Mechanism of Random Telegraph Noise in 22-nm FDSOI-Based MOSFET at Cryogenic Temperatures

Nanomaterials (Basel, Switzerland), 2022-12, Vol.12 (23), p.4344

2022

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Improved Ferroelectric Properties in Hf0.5Zr0.5O2 Thin Films by Microwave Annealing

Nanomaterials (Basel, Switzerland), 2022-08, Vol.12 (17), p.3001

2022

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Modeling and analysis of package PDN for computing system based on cavity model

2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2017, p.213-218

2017

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A novel z-directed embedded component for the reduction of voltage ripple on the power distribution network for PCBs

2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2017, p.225-230

2017

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A novel Z-directed embedded component for the reduction of voltage ripple on the power distribution network for PCBs

IEEE electromagnetic compatibility magazine, 2017-01, Vol.6 (3), p.91-97

2017

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On finding the optimal number of decoupling capacitors by minimizing the equivalent inductance of the PCB PDN

2014 IEEE International Symposium on Electromagnetic Compatibility (EMC), 2014, p.218-223

2014

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Effect of narrow power fills on PCB PDN noise

2014 IEEE International Symposium on Electromagnetic Compatibility (EMC), 2014, p.839-844

2014

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Cavity model method based with gradient current distribution along the via for power integrity simulation

2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2017, p.209-212

2017

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Sub-10-nm Air Channel Field Emission Device With Ultra-Low Operating Voltage

IEEE electron device letters, 2021-09, Vol.42 (9), p.1390-1393

2021

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Localized Backside Etching Structure of SOI Substrates on Total Ionizing Dose Effect Hardening for RF Applications

IEEE transactions on electron devices, 2022-05, Vol.69 (5), p.2256-2261

2022

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Nanoscale Vacuum Channel Hall Sensors

IEEE sensors journal, 2022-12, Vol.22 (24), p.1-1

2022

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Power integrity with voltage ripple spectrum decomposition for physics-based design

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC), 2016, p.318-323

2016

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Identification of the domestication gene GmCYP82C4 underlying the major quantitative trait locus for the seed weight in soybean

Theoretical and applied genetics, 2024-03, Vol.137 (3), p.62-62, Article 62

2024

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Identification and confirmation of novel genetic loci and domestication gene GmGA20ox1 regulating primary root length in soybean seedling stage

Industrial crops and products, 2024-10, Vol.217, p.118814, Article 118814

2024

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Radiation Immune-Planar Two-Terminal Nanoscale Air Channel Devices toward Space Applications

ACS applied nano materials, 2023-12, Vol.6 (23), p.22080-22087

2023

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System SI/PI Modeling and Analysis

Zhao, Biyao

2020

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The influences of radiation effects on DC/RF performances of L g = 22 nm gate-all-around nanosheet field-effect transistor

Semiconductor science and technology, 2022-03, Vol.37 (3), p.35010

2022

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The impacts of localized backside etching on proton radiation response in SOI passive devices

Japanese Journal of Applied Physics, 2023-02, Vol.62 (2), p.20905

2023

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Physics-Based Circuit Modeling Methodology for System Power Integrity Analysis and Design

IEEE transactions on electromagnetic compatibility, 2020-08, Vol.62 (4), p.1266-1277

2020

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PEEC Modeling in 3D IC/Packaging Applications based on Layered Green's Functions

IEEE transactions on signal and power integrity, 2023-02, Vol.2, p.1-9

2023

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Improved Ferroelectric Properties in Hf[sub.0.5]Zr[sub.0.5]O[sub.2] Thin Films by Microwave Annealing

Nanomaterials (Basel, Switzerland), 2022-08, Vol.12 (17)

2022

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A Physics-Based Approach for Power Integrity in Multi-Layered PCBs

Zhao, Biyao

2017

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Z-Directed Component (ZDC) Technology for Power Integrity Applications

IEEE transactions on electromagnetic compatibility, 2018-12, Vol.60 (6), p.1948-1956

2018

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Decoupling capacitor power ground via layout analysis for multi-layered PCB PDNs

IEEE electromagnetic compatibility magazine, 2020-01, Vol.9 (3), p.84-94

2020

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Systematic Power Integrity Analysis Based on Inductance Decomposition in a Multi-Layered PCB PDN

IEEE electromagnetic compatibility magazine, 2020-01, Vol.9 (4), p.80-90

2020

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Mechanism of Random Telegraph Noise in 22-nm FDSOI-Based MOSFET at Cryogenic Temperatures

Improved Ferroelectric Properties in Hf0.5Zr0.5O2 Thin Films by Microwave Annealing

Modeling and analysis of package PDN for computing system based on cavity model

A novel z-directed embedded component for the reduction of voltage ripple on the power distribution network for PCBs

A novel Z-directed embedded component for the reduction of voltage ripple on the power distribution network for PCBs

On finding the optimal number of decoupling capacitors by minimizing the equivalent inductance of the PCB PDN

Effect of narrow power fills on PCB PDN noise

Cavity model method based with gradient current distribution along the via for power integrity simulation

Sub-10-nm Air Channel Field Emission Device With Ultra-Low Operating Voltage

Localized Backside Etching Structure of SOI Substrates on Total Ionizing Dose Effect Hardening for RF Applications

Nanoscale Vacuum Channel Hall Sensors

Power integrity with voltage ripple spectrum decomposition for physics-based design

Identification of the domestication gene GmCYP82C4 underlying the major quantitative trait locus for the seed weight in soybean

Identification and confirmation of novel genetic loci and domestication gene GmGA20ox1 regulating primary root length in soybean seedling stage

Radiation Immune-Planar Two-Terminal Nanoscale Air Channel Devices toward Space Applications

System SI/PI Modeling and Analysis

The influences of radiation effects on DC/RF performances of L g = 22 nm gate-all-around nanosheet field-effect transistor

The impacts of localized backside etching on proton radiation response in SOI passive devices

Physics-Based Circuit Modeling Methodology for System Power Integrity Analysis and Design

PEEC Modeling in 3D IC/Packaging Applications based on Layered Green's Functions

Improved Ferroelectric Properties in Hf[sub.0.5]Zr[sub.0.5]O[sub.2] Thin Films by Microwave Annealing

A Physics-Based Approach for Power Integrity in Multi-Layered PCBs

Z-Directed Component (ZDC) Technology for Power Integrity Applications

Decoupling capacitor power ground via layout analysis for multi-layered PCB PDNs

Systematic Power Integrity Analysis Based on Inductance Decomposition in a Multi-Layered PCB PDN

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