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Improved “Root-Omega” Method for Transmission-Line-Based Material Property Extraction for Multilayer PCBs

IEEE transactions on electromagnetic compatibility, 2017-08, Vol.59 (4), p.1356-1367

2017

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Analytical Equivalent Circuit Modeling for BGA in High-Speed Package

IEEE transactions on electromagnetic compatibility, 2018-02, Vol.60 (1), p.68-76

2018

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Error bounds analysis of de-embedded results in 2x thru de-embedding methods

2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2017, p.532-536

2017

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Analytical and numerical sensitivity analyses of fixtures de-embedding

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC), 2016, p.440-444

2016

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Validating the transmission-line based material property extraction procedure including surface roughness for multilayer PCBs using simulations

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC), 2016, p.472-477

2016

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Differential integrated crosstalk noise (ICN) reduction among multiple differential BGA and Via pairs by using design of experiments (DoE) method

2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2017, p.112-117

2017

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Advanced On-chip SOL Calibration Method for Unknown Fixture De-embedding

JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, 2017, 17(4), 76, pp.543-551

2017

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Characterization of PCB dielectric properties using two striplines on the same board

2014 IEEE International Symposium on Electromagnetic Compatibility (EMC), 2014, p.809-814

2014

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Multi-Ports ([ 2^) 2×-Thru De-Embedding: Theory, Validation, and Mode Conversion Characterization

IEEE transactions on electromagnetic compatibility, 2019-08, Vol.61 (4), p.1261-1270

2019

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Parallel Plate Impedance and Equivalent Inductance Extraction Considering Proximity Effect by a Modal Approach

IEEE transactions on electromagnetic compatibility, 2018-10, Vol.60 (5), p.1481-1490

2018

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Differential Crosstalk Mitigation in the Pin Field Area of SerDes Channel With Trace Routing Guidance

IEEE transactions on electromagnetic compatibility, 2019-08, Vol.61 (4), p.1385-1394

2019

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Modeling Stripline With Slotted Ground Plane in Multilayered Circuit Board Using PEEC Formulation

IEEE transactions on electromagnetic compatibility, 2020-02, Vol.62 (1), p.280-284

2020

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Thru-Reflect-Line Calibration Technique: Error Analysis for Characteristic Impedance Variations in the Line Standards

IEEE transactions on electromagnetic compatibility, 2017-06, Vol.59 (3), p.779-788

2017

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A novel de-embedding method suitable for transmission-line measurement

2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), 2015, p.1-4

2015

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2X-Thru, 1X-Reflection, and Thru-Line De-Embedding: Theory, Sensitivity Analysis, and Error Corrections

Chen, Bichen

2019

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Inhomogeneous Dielectric Induced Skew Modeling of Twinax Cables

IEEE transactions on signal and power integrity, 2023, Vol.2, p.94-102

2023

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Phase Noise Analysis of Clock Generator by Using Phase Noise Sensitivity

IEEE transactions on signal and power integrity, 2022, Vol.1, p.150-159

2022

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Analysis of Power-via-Induced Quasi-Quarter-Wavelength Resonance to Reduce Crosstalk

IEEE transactions on signal and power integrity, 2022, Vol.1, p.121-129

2022

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Advanced On-chip SOL Calibration Method for Unknown Fixture De-embedding

Journal of semiconductor technology and science, 2017, Vol.17 (4), p.543-551

2017

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Signal-signal D-probe and unified launch pad designs

IEEE electromagnetic compatibility magazine, 2018-01, Vol.7 (3), p.101-106

2018

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Proceedings of the 2nd International Conference for Cancer Metabolism and Therapy, October 13-15, 2017, Wenzhou, China

Pancreas, 2018-05, Vol.47 (5), p.526-532

2018

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Accurate characterization of PCB transmission lines for high speed interconnect

2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), 2015, p.16-19

2015

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2X-Thru De-embedding for Non-2N Even Number Port Network

2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI), 2019, p.51-55

2019

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De-embedding comparisons of 1X-Reflect SFD, 1-port AFR, and 2X-Thru SFD

2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), 2018, p.160-164

2018

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Undesired-resonance Analysis and Modeling of Differential Signals Due to Narrow Ground Lines Without Stitching Vias

2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), 2023, p.688-692

2023

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Improved “Root-Omega” Method for Transmission-Line-Based Material Property Extraction for Multilayer PCBs

Analytical Equivalent Circuit Modeling for BGA in High-Speed Package

Error bounds analysis of de-embedded results in 2x thru de-embedding methods

Analytical and numerical sensitivity analyses of fixtures de-embedding

Validating the transmission-line based material property extraction procedure including surface roughness for multilayer PCBs using simulations

Differential integrated crosstalk noise (ICN) reduction among multiple differential BGA and Via pairs by using design of experiments (DoE) method

Advanced On-chip SOL Calibration Method for Unknown Fixture De-embedding

Characterization of PCB dielectric properties using two striplines on the same board

Multi-Ports ([ 2^) 2×-Thru De-Embedding: Theory, Validation, and Mode Conversion Characterization

Parallel Plate Impedance and Equivalent Inductance Extraction Considering Proximity Effect by a Modal Approach

Differential Crosstalk Mitigation in the Pin Field Area of SerDes Channel With Trace Routing Guidance

Modeling Stripline With Slotted Ground Plane in Multilayered Circuit Board Using PEEC Formulation

Thru-Reflect-Line Calibration Technique: Error Analysis for Characteristic Impedance Variations in the Line Standards

A novel de-embedding method suitable for transmission-line measurement

2X-Thru, 1X-Reflection, and Thru-Line De-Embedding: Theory, Sensitivity Analysis, and Error Corrections

Inhomogeneous Dielectric Induced Skew Modeling of Twinax Cables

Phase Noise Analysis of Clock Generator by Using Phase Noise Sensitivity

Analysis of Power-via-Induced Quasi-Quarter-Wavelength Resonance to Reduce Crosstalk

Advanced On-chip SOL Calibration Method for Unknown Fixture De-embedding

Signal-signal D-probe and unified launch pad designs

Proceedings of the 2nd International Conference for Cancer Metabolism and Therapy, October 13-15, 2017, Wenzhou, China

Accurate characterization of PCB transmission lines for high speed interconnect

2X-Thru De-embedding for Non-2N Even Number Port Network

De-embedding comparisons of 1X-Reflect SFD, 1-port AFR, and 2X-Thru SFD

Undesired-resonance Analysis and Modeling of Differential Signals Due to Narrow Ground Lines Without Stitching Vias

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