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Electromigration-Induced Plastic Deformation in Cu Interconnects: Effects on Current Density Exponent, n, and Implications for EM Reliability Assessment

Journal of electronic materials, 2010-11, Vol.39 (11), p.2483-2488

2010

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Electromigration-Induced Plasticity: Texture Correlation and Implications for Reliability Assessment

Journal of electronic materials, 2009-03, Vol.38 (3), p.379-391

2009

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Effect of film thickness on the evolution of annealing texture in sputtered copper films

Journal of electronic materials, 2005-12, Vol.34 (12), p.1500-1508

2005

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Stress modeling of Cu/low-k BEoL - application to stress migration

2004 IEEE International Reliability Physics Symposium. Proceedings, 2004, p.234-239

2004

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Microstructural characterization of inlaid copper interconnect lines

Journal of electronic materials, 2001-04, Vol.30 (4), p.320-330

2001

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Electromigration-induced Plasticity and Texture in Cu Interconnects

Stress-Induced Phenomona in Metallization (AIP Conference Proceedings Volume 945), 2007, Vol.945, p.56-65

2007

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An x-ray method for direct determination of the strain state and strain relaxation in micron-scale passivated metallization lines during thermal cycling

Journal of materials research, 1994-01, Vol.9 (1), p.13-24

1994

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The Effect of Cluster Interactions on Electromigration Induced Stress Evolution in Confined Metal Lines

MRS proceedings, 1995, Vol.391, p.197-202, Article 197

1995

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Structure Evolution in Plated Cu Films

MRS proceedings, 2005, Vol.863, Article B5.2

2005

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Scalp, basal epidural and intravascular far-field recordings after median nerve stimulation: evidence for a separate N18a potential

Somatosensory & motor research, 2000, Vol.17 (3), p.239-243

Koehler, R. Besser, P. Stoeter, P. P. Urban, H. C. Hopf, J.

2000

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Elastic strain gradients and x-ray line broadening effects as a function of temperature in aluminum thin films on silicon

Journal of materials research, 1994-02, Vol.9 (2), p.328-335

1994

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Texture analysis of damascene-fabricated Cu lines by x-ray diffraction and electron backscatter diffraction and its impact on electromigration performance

Journal of applied physics, 1999-03, Vol.85 (5), p.2583-2590

1999

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The Influence of Capping Layer Type on Cobalt Salicide Formation in Films and Narrow Lines

MRS proceedings, 1998, Vol.514, Article 375

1998

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Understanding stress gradients in microelectronic metallization

Powder diffraction, 2012-06, Vol.27 (2), p.92-98

2012

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Ge effects on silicidation

Microelectronic engineering, 2005-12, Vol.82 (3), p.467-473

2005

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Electromigration Failure Distributions for Multi-Layer Interconnects as a Function of Line Width: Experiments and Simulation

MRS proceedings, 1996, Vol.427, Article 107

1996

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Plasticity-Amplified Diffusivity: Dislocation Cores as Fast Diffusion Paths in CU Interconnects

2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual, 2007, p.122-127

2007

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Microstructure characterization of metal interconnects and barrier layers: status and future

Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407), 2000, p.233-235

2000

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Texture Evolution in Thin Cu Films and Lines

Materials science forum, 2005-01, Vol.495-497, p.1323-1332

2005

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Analysis of grain-boundary structure in Al–Cu interconnects

Journal of applied physics, 1997-09, Vol.82 (5), p.2383-2392

1997

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Modeling and Measurement of Stress and Strain Evolution in Cu Interconnects

AIP conference proceedings, 2004, Vol.741 (1)

2004

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Modelling microstructure development in trench-interconnect structures

Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102), 1998, p.247-249

1998

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Effect of film thickness on the evolution of annealing texture in sputtered copper films : Microstructures and textures of films and coatings and refractory metals in electronic applications

Journal of electronic materials, 2005, Vol.34 (12), p.1500-1508

2005

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Finite‐Element Modeling and X‐Ray Measurement of Strain in Passivated Al Lines during Thermal Cycling

Journal of the Electrochemical Society, 1993-06, Vol.140 (6), p.1769-1772

1993

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Silicides for the 65 nm Technology Node

MRS proceedings, 2003, Vol.766, Article E10.1

2003

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Electromigration-Induced Plastic Deformation in Cu Interconnects: Effects on Current Density Exponent, n, and Implications for EM Reliability Assessment

Electromigration-Induced Plasticity: Texture Correlation and Implications for Reliability Assessment

Effect of film thickness on the evolution of annealing texture in sputtered copper films

Stress modeling of Cu/low-k BEoL - application to stress migration

Microstructural characterization of inlaid copper interconnect lines

Electromigration-induced Plasticity and Texture in Cu Interconnects

An x-ray method for direct determination of the strain state and strain relaxation in micron-scale passivated metallization lines during thermal cycling

The Effect of Cluster Interactions on Electromigration Induced Stress Evolution in Confined Metal Lines

Structure Evolution in Plated Cu Films

Scalp, basal epidural and intravascular far-field recordings after median nerve stimulation: evidence for a separate N18a potential

Elastic strain gradients and x-ray line broadening effects as a function of temperature in aluminum thin films on silicon

Texture analysis of damascene-fabricated Cu lines by x-ray diffraction and electron backscatter diffraction and its impact on electromigration performance

The Influence of Capping Layer Type on Cobalt Salicide Formation in Films and Narrow Lines

Understanding stress gradients in microelectronic metallization

Ge effects on silicidation

Electromigration Failure Distributions for Multi-Layer Interconnects as a Function of Line Width: Experiments and Simulation

Plasticity-Amplified Diffusivity: Dislocation Cores as Fast Diffusion Paths in CU Interconnects

Microstructure characterization of metal interconnects and barrier layers: status and future

Texture Evolution in Thin Cu Films and Lines

Analysis of grain-boundary structure in Al–Cu interconnects

Modeling and Measurement of Stress and Strain Evolution in Cu Interconnects

Modelling microstructure development in trench-interconnect structures

Effect of film thickness on the evolution of annealing texture in sputtered copper films : Microstructures and textures of films and coatings and refractory metals in electronic applications

Finite‐Element Modeling and X‐Ray Measurement of Strain in Passivated Al Lines during Thermal Cycling

Silicides for the 65 nm Technology Node

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