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Thermal conductance at Sn-0.5mass%Al solder alloy/substrate interface as a factor for tailoring cellular/dendritic growth

Journal of thermal analysis and calorimetry, 2022-04, Vol.147 (8), p.4945-4958

2022

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An alternative thermal approach to evaluate the wettability of solder alloys

Applied thermal engineering, 2016-08, Vol.107, p.431-440

2016

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Inward solidification of cylinders: Reversal in the growth rate and microstructure evolution

Applied thermal engineering, 2013-11, Vol.61 (2), p.577-582

2013

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Metal/mold thermal conductance affecting ultrafine scale microstructures in aluminum eutectic alloys

Case studies in thermal engineering, 2021-08, Vol.26, p.101144, Article 101144

2021

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Inward and outward solidification of cylindrical castings: The role of the metal/mold heat transfer coefficient

Materials chemistry and physics, 2012-10, Vol.136 (2-3), p.545-554

2012

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Microstructure, tensile properties and wear resistance correlations on directionally solidified Al-Sn-(Cu; Si) alloys

Journal of alloys and compounds, 2017-02, Vol.695, p.3621-3631

2017

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Nature inspired algorithms for the solution of inverse heat transfer problems applied to distinct unsteady heat flux orientations in cylindrical castings

Journal of intelligent manufacturing, 2023-06, Vol.34 (5), p.2407-2430

2023

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Progression of plastic strain on heavy-haul railway rail under random pure rolling and its influence on crack initiation

Advances in engineering software (1992), 2018-10, Vol.124, p.10-21

2018

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Cellular growth of single-phase Zn–Ag alloys unidirectionally solidified

Materials chemistry and physics, 2014-02, Vol.143 (3), p.895-899

2014

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Microstructural development of hypoeutectic Zn–(10–40)wt%Sn solder alloys and impacts of interphase spacing and macrosegregation pattern on hardness

Journal of alloys and compounds, 2015-10, Vol.647, p.989-996

2015

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Interfacial heat transfer and microstructural analyses of a Bi- 5% Sb lead-free alloy solidified against Cu, Ni and low-C steel substrates

Journal of alloys and compounds, 2021-04, Vol.860, p.158553, Article 158553

2021

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Characterization of Dendritic Microstructure, Intermetallic Phases, and Hardness of Directionally Solidified Al-Mg and Al-Mg-Si Alloys

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2015-08, Vol.46 (8), p.3342-3355

2015

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Cooling thermal parameters, microstructure, segregation and hardness in directionally solidified Al–Sn-(Si;Cu) alloys

Materials & Design, 2015-05, Vol.72, p.31-42

2015

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Temperature-Induced Chemical Changes in Lubricant Automotive Oils Evaluated Using Raman Spectroscopy

Applied spectroscopy, 2021-02, Vol.75 (2), p.145-155

2021

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The effect of the growth rate on microsegregation: Experimental investigation in hypoeutectic Al–Fe and Al–Cu alloys directionally solidified

Journal of alloys and compounds, 2013-06, Vol.561, p.193-200

2013

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The application of an analytical model to solve an inverse heat conduction problem: Transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates

Journal of manufacturing processes, 2019-12, Vol.48, p.164-173

2019

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Effect of plastic accumulation on the nucleation of cracks in railroad rails due to bidirectional loaded traffic

International journal of fatigue, 2018-12, Vol.117, p.196-205

2018

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Solidification paths of Al-Cu-Sn alloys: Comparison of thermodynamic analyses and solidification experiments using in situ X-radiography

Materials today communications, 2024-08, Vol.40, p.109545, Article 109545

2024

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Modelagem numérica da transferência de calor do processo de lingotamento contínuo de tarugo oco de cobre em uma planta industrial

Tecnologia em metalurgia, materiais e mineração, 2021, Vol.18, p.e2402

2021

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Desenvolvimento de um mecanismo de bombeamento automático integrado a um reanimador pulmonar manual / Development of an automatic pumping mechanism integrated with a manual lung resuscitator

Brazilian Journal of Development, 2021-12, Vol.7 (12), p.113621-113638

2021

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Numerical and experimental modelling of two-dimensional unsteady heat transfer during inward solidification of square billets

Applied thermal engineering, 2016-03, Vol.96, p.454-462

2016

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The effect of the growth rate on microsegregation: Experimental investigation in hypoeutectic AlaFe and AlaCu alloys directionally solidified

Journal of alloys and compounds, 2013-06, Vol.561, p.193-200

2013

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Evaluation of thermophysical properties of Al–Sn–Si alloys based on computational thermodynamics and validation by numerical and experimental simulation of solidification

The Journal of chemical thermodynamics, 2016-07, Vol.98, p.9-20

2016

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An Effective Inverse Heat Transfer Procedure Based on Evolutionary Algorithms to Determine Cooling Conditions of a Steel Continuous Casting Machine

Materials and manufacturing processes, 2015-04, Vol.30 (4), p.414-424

2015

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Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys

Journal of materials science. Materials in electronics, 2016-02, Vol.27 (2), p.1994-2003

2016

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Thermal conductance at Sn-0.5mass%Al solder alloy/substrate interface as a factor for tailoring cellular/dendritic growth

An alternative thermal approach to evaluate the wettability of solder alloys

Inward solidification of cylinders: Reversal in the growth rate and microstructure evolution

Metal/mold thermal conductance affecting ultrafine scale microstructures in aluminum eutectic alloys

Inward and outward solidification of cylindrical castings: The role of the metal/mold heat transfer coefficient

Microstructure, tensile properties and wear resistance correlations on directionally solidified Al-Sn-(Cu; Si) alloys

Nature inspired algorithms for the solution of inverse heat transfer problems applied to distinct unsteady heat flux orientations in cylindrical castings

Progression of plastic strain on heavy-haul railway rail under random pure rolling and its influence on crack initiation

Cellular growth of single-phase Zn–Ag alloys unidirectionally solidified

Microstructural development of hypoeutectic Zn–(10–40)wt%Sn solder alloys and impacts of interphase spacing and macrosegregation pattern on hardness

Interfacial heat transfer and microstructural analyses of a Bi- 5% Sb lead-free alloy solidified against Cu, Ni and low-C steel substrates

Characterization of Dendritic Microstructure, Intermetallic Phases, and Hardness of Directionally Solidified Al-Mg and Al-Mg-Si Alloys

Cooling thermal parameters, microstructure, segregation and hardness in directionally solidified Al–Sn-(Si;Cu) alloys

Temperature-Induced Chemical Changes in Lubricant Automotive Oils Evaluated Using Raman Spectroscopy

The effect of the growth rate on microsegregation: Experimental investigation in hypoeutectic Al–Fe and Al–Cu alloys directionally solidified

The application of an analytical model to solve an inverse heat conduction problem: Transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates

Effect of plastic accumulation on the nucleation of cracks in railroad rails due to bidirectional loaded traffic

Solidification paths of Al-Cu-Sn alloys: Comparison of thermodynamic analyses and solidification experiments using in situ X-radiography

Modelagem numérica da transferência de calor do processo de lingotamento contínuo de tarugo oco de cobre em uma planta industrial

Desenvolvimento de um mecanismo de bombeamento automático integrado a um reanimador pulmonar manual / Development of an automatic pumping mechanism integrated with a manual lung resuscitator

Numerical and experimental modelling of two-dimensional unsteady heat transfer during inward solidification of square billets

The effect of the growth rate on microsegregation: Experimental investigation in hypoeutectic AlaFe and AlaCu alloys directionally solidified

Evaluation of thermophysical properties of Al–Sn–Si alloys based on computational thermodynamics and validation by numerical and experimental simulation of solidification

An Effective Inverse Heat Transfer Procedure Based on Evolutionary Algorithms to Determine Cooling Conditions of a Steel Continuous Casting Machine

Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys

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