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Study of alternate hardmasks for extreme ultraviolet patterning

Journal of vacuum science and technology. B, Nanotechnology & microelectronics, 2016-11, Vol.34 (6)

2016

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A new technique for evaluating stacked nanosheet inner spacer TDDB reliability

2020 IEEE International Reliability Physics Symposium (IRPS), 2020, p.1-5

2020

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Highly Selective SiGe Dry Etch Process for the Enablement of Stacked Nanosheet Gate-All-Around Transistors

ECS transactions, 2021-10, Vol.104 (4), p.217-227

2021

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Heteroepitaxy of Hafnium Diboride on a Hafnium(0001) Single Crystal Surface

Chemistry of materials, 1997-02, Vol.9 (2), p.403-405

1997

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Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1175-1180

2023

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Backside Power Distribution for Nanosheet Technologies Beyond 2nm

2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2024, p.1-2

2024

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Characterization of wafer geometry and overlay error on silicon wafers with nonuniform stress

Journal of micro/nanolithography, MEMS, and MOEMS, 2013-10, Vol.12 (4), p.43002

2013

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Stress Liner Effects for 32-nm SOI MOSFETs With HKMG

IEEE transactions on electron devices, 2010-07, Vol.57 (7), p.1706-1709

2010

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Self-Allancd Gate Contact (SAGC) for CMOS technology scaling beyond 7nm

2019 Symposium on VLSI Technology, 2019, p.T148-T149

2019

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Atomic Layer Deposition of Sidewall Spacers: Process, Equipment and Integration Challenges in State-of-the-Art Logic Technologies

ECS transactions, 2014, Vol.61 (3), p.39-45

2014

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Chapter 8 - Thin Film Deposition for Front End of Line: The Effect of the Semiconductor Scaling, Strain Engineering and Pattern Effects

Handbook of Thin Film Deposition, 2018, p.231-268

Belyansky, Michael

Fourth Edition, 2018

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Blanket SMT With In Situ N2 Plasma Treatment on the (100) Wafer for the Low-Cost Low-Power Technology Application

IEEE electron device letters, 2009-09, Vol.30 (9), p.916-918

2009

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Structure of Heteroepitaxial Thin Films of Hafnium Diboride Grown on a Hf(0001) Surface As Determined by Scanning Tunneling Microscopy

The journal of physical chemistry. B, 2000-12, Vol.104 (50), p.11833-11836

2000

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Comparison of the surface chemical reactivity of hafnium diboride and hafnium

Inorganica Chimica Acta, 1999-06, Vol.289 (1), p.191-197

1999

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Surface Energy Characterization for Die-Level Cu Hybrid Bonding

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.312-316

2022

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Thin Film Deposition for Front End of Line: The Effect of the Semiconductor Scaling, Strain Engineering and Pattern Effects

Handbook of Thin Film Deposition, 2018, p.1-1

4th Edition, 2018

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Plasma Activated Low-temperature Die-level Direct Bonding with Advanced Wafer Dicing Technologies for 3D Heterogeneous Integration

2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.408-414

2021

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5 - Thin-Film Strain Engineering and Pattern Effects in Dielectrics CVD

Handbook of Thin Film Deposition, 2012, p.89-125

Belyansky, Michael

Third Edition, 2012

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Reflection adsorption infrared spectroscopy of the oxidation of thin films of boron and hafnium diboride grown on Hf(0001)

Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 1997-11, Vol.15 (6), p.3065-3068

1997

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Highly Selective SiGe Dry Etch Process for the Enablement of Stacked Nanosheet Gate-All-Around Transistors

Meeting abstracts (Electrochemical Society), 2021-10, Vol.MA2021-02 (30), p.943-943

2021

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Thin-Film Strain Engineering and Pattern Effects in Dielectrics CVD

Handbook of Thin Film Deposition - Techniques, Processes, and Technologies, 2012, p.1-1

Seshan Krishna

3rd Edition, 2012

Volltextzugriff (PDF)

Atomic Layer Deposition of Sidewall Spacers: Process, Equipment and Integration Challenges in State-of-the-Art Logic Technologies

Meeting abstracts (Electrochemical Society), 2014-04, Vol.MA2014-01 (39), p.1443-1443

2014

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Heteroepitaxy of hafnium diboride on a hafnium(0001) single crystal surface

Belyansky, Michael P

1998

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Raman Spectroscopy Study of Silicon Strain in Shallow Trench Isolation

Meeting abstracts (Electrochemical Society), 2008-08, Vol.MA2008-02 (23), p.1842-1842

2008

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Strain characterization: techniques and applications

Solid state technology, 2009-02, Vol.52 (2), p.26

2009

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Study of alternate hardmasks for extreme ultraviolet patterning

A new technique for evaluating stacked nanosheet inner spacer TDDB reliability

Highly Selective SiGe Dry Etch Process for the Enablement of Stacked Nanosheet Gate-All-Around Transistors

Heteroepitaxy of Hafnium Diboride on a Hafnium(0001) Single Crystal Surface

Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications

Backside Power Distribution for Nanosheet Technologies Beyond 2nm

Characterization of wafer geometry and overlay error on silicon wafers with nonuniform stress

Stress Liner Effects for 32-nm SOI MOSFETs With HKMG

Self-Allancd Gate Contact (SAGC) for CMOS technology scaling beyond 7nm

Atomic Layer Deposition of Sidewall Spacers: Process, Equipment and Integration Challenges in State-of-the-Art Logic Technologies

Chapter 8 - Thin Film Deposition for Front End of Line: The Effect of the Semiconductor Scaling, Strain Engineering and Pattern Effects

Blanket SMT With In Situ N2 Plasma Treatment on the (100) Wafer for the Low-Cost Low-Power Technology Application

Structure of Heteroepitaxial Thin Films of Hafnium Diboride Grown on a Hf(0001) Surface As Determined by Scanning Tunneling Microscopy

Comparison of the surface chemical reactivity of hafnium diboride and hafnium

Surface Energy Characterization for Die-Level Cu Hybrid Bonding

Thin Film Deposition for Front End of Line: The Effect of the Semiconductor Scaling, Strain Engineering and Pattern Effects

Plasma Activated Low-temperature Die-level Direct Bonding with Advanced Wafer Dicing Technologies for 3D Heterogeneous Integration

5 - Thin-Film Strain Engineering and Pattern Effects in Dielectrics CVD

Reflection adsorption infrared spectroscopy of the oxidation of thin films of boron and hafnium diboride grown on Hf(0001)

Highly Selective SiGe Dry Etch Process for the Enablement of Stacked Nanosheet Gate-All-Around Transistors

Thin-Film Strain Engineering and Pattern Effects in Dielectrics CVD

Atomic Layer Deposition of Sidewall Spacers: Process, Equipment and Integration Challenges in State-of-the-Art Logic Technologies

Heteroepitaxy of hafnium diboride on a hafnium(0001) single crystal surface

Raman Spectroscopy Study of Silicon Strain in Shallow Trench Isolation

Strain characterization: techniques and applications

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