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Fast, facile and thermal damage free nanowelding of Ag nanowire for flexible transparent conductive film by pressure-assisted microwave irradiation

Scientific reports, 2023-09, Vol.13 (1), p.14354-14354, Article 14354

2023

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Effects of CO2 laser pretreatment conditions on adhesion properties of Cu/Ti films and polyimide substrates

Journal of materials science. Materials in electronics, 2021-06, Vol.32 (11), p.14740-14748

2021

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Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate

Microelectronics and reliability, 2019-08, Vol.99, p.62-73

2019

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Enhanced Thermo-Mechanical Reliability of Ultralow-K Dielectrics with Self-Organized Molecular Pores

Materials, 2021-04, Vol.14 (9), p.2284

2021

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Interfacial Reactions and Mechanical Properties of Sn-58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

Materials, 2021-01, Vol.14 (2), p.335

2021

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Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate

Materials, 2021-05, Vol.14 (9), p.2367

2021

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Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition

Metals (Basel ), 2018-08, Vol.8 (8), p.586

2018

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Effect of Bimodal Cu Paste on Interfacial Properties and Mechanical Strength of Sintered Joints

Journal of electronic materials, 2022-12, Vol.51 (12), p.7326-7336

2022

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Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates

Journal of alloys and compounds, 2017-04, Vol.701, p.533-541

2017

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Amorphous‐Crystalline Interfaces on Hollow Nanocubes Derived from Ir‐Doped Ni–Fe–Zn Prussian Blue Analog Enables High Capability of Alkaline/Acidic/Saline Water Oxidations

Small (Weinheim an der Bergstrasse, Germany), 2023-12, Vol.19 (49), p.e2303912-n/a

2023

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Amorphous‐Crystalline Interfaces on Hollow Nanocubes Derived from Ir‐Doped Ni–Fe–Zn Prussian Blue Analog Enables High Capability of Alkaline/Acidic/Saline Water Oxidations (Small 49/2023)

Small (Weinheim an der Bergstrasse, Germany), 2023-12, Vol.19 (49), p.n/a

2023

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Effect of Cu/Fe addition on the microstructures and electrical performances of Ni–Co–Mn oxides

Journal of alloys and compounds, 2021-04, Vol.859, p.157769, Article 157769

2021

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Thermal reliability of Cu sintering joints for high-temperature die attach

Microelectronics and reliability, 2023-08, Vol.147, p.115002, Article 115002

2023

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Improving mechanical stability of Al/Cu ultrasonic bonded joint for battery tab by adopting electroplated Ni interlayer

Journal of materials science. Materials in electronics, 2024-02, Vol.35 (4), p.308, Article 308

2024

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Mechanical properties of TiC reinforced MgO–ZrO2 composites via spark plasma sintering

Ceramics international, 2023-06, Vol.49 (11), p.17255-17260

2023

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Effects of solvents, activators, and additives on sintering properties of Cu paste for die attach

Journal of materials science. Materials in electronics, 2023-07, Vol.34 (19), p.1459, Article 1459

2023

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Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

Materials characterization, 2017-02, Vol.124, p.250-259

2017

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Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint

Journal of alloys and compounds, 2017-12, Vol.728, p.992-1001

2017

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Low-iridium doped single-crystalline hydrogenated titanates (H2Ti3O7) with large exposed {100} facets for enhanced oxygen evolution reaction under acidic conditions

Journal of alloys and compounds, 2023-06, Vol.946, p.169466, Article 169466

2023

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Corrigendum to: “Low-iridium doped single-crystalline hydrogenated titanates (H2Ti3O7) with large exposed {100} facets for enhanced oxygen evolution reaction under acidic conditions”

Journal of alloys and compounds, 2023-06, Vol.947, p.169627, Article 169627

2023

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Effective (Pd,Ni)Sn4 diffusion barrier to suppress brittle fracture at Sn-58Bi-xAg solder joint with Ni(P)/Pd(P)/Au metallization pad

Microelectronics and reliability, 2022-02, Vol.129, p.114472, Article 114472

2022

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Zn-doped nickel iron (oxy)hydroxide nanocubes passivated by polyanions with high catalytic activity and corrosion resistance for seawater oxidation

Journal of energy chemistry, 2023-06, Vol.81, p.82-92

2023

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Highly increased hydrovoltaic power generation via surfactant optimization of carbon black solution for cellulose microfiber cylindrical generator

Surfaces and interfaces, 2023-06, Vol.38, p.102853, Article 102853

2023

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Bonding copper ribbons on crystalline photovoltaic modules using various lead-free solders

Journal of materials science. Materials in electronics, 2015-12, Vol.26 (12), p.9721-9726

2015

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Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate

Journal of electronic materials, 2015-07, Vol.44 (7), p.2458-2466

2015

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Fast, facile and thermal damage free nanowelding of Ag nanowire for flexible transparent conductive film by pressure-assisted microwave irradiation

Effects of CO2 laser pretreatment conditions on adhesion properties of Cu/Ti films and polyimide substrates

Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate

Enhanced Thermo-Mechanical Reliability of Ultralow-K Dielectrics with Self-Organized Molecular Pores

Interfacial Reactions and Mechanical Properties of Sn-58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate

Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition

Effect of Bimodal Cu Paste on Interfacial Properties and Mechanical Strength of Sintered Joints

Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates

Amorphous‐Crystalline Interfaces on Hollow Nanocubes Derived from Ir‐Doped Ni–Fe–Zn Prussian Blue Analog Enables High Capability of Alkaline/Acidic/Saline Water Oxidations

Amorphous‐Crystalline Interfaces on Hollow Nanocubes Derived from Ir‐Doped Ni–Fe–Zn Prussian Blue Analog Enables High Capability of Alkaline/Acidic/Saline Water Oxidations (Small 49/2023)

Effect of Cu/Fe addition on the microstructures and electrical performances of Ni–Co–Mn oxides

Thermal reliability of Cu sintering joints for high-temperature die attach

Improving mechanical stability of Al/Cu ultrasonic bonded joint for battery tab by adopting electroplated Ni interlayer

Mechanical properties of TiC reinforced MgO–ZrO2 composites via spark plasma sintering

Effects of solvents, activators, and additives on sintering properties of Cu paste for die attach

Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint

Low-iridium doped single-crystalline hydrogenated titanates (H2Ti3O7) with large exposed {100} facets for enhanced oxygen evolution reaction under acidic conditions

Corrigendum to: “Low-iridium doped single-crystalline hydrogenated titanates (H2Ti3O7) with large exposed {100} facets for enhanced oxygen evolution reaction under acidic conditions”

Effective (Pd,Ni)Sn4 diffusion barrier to suppress brittle fracture at Sn-58Bi-xAg solder joint with Ni(P)/Pd(P)/Au metallization pad

Zn-doped nickel iron (oxy)hydroxide nanocubes passivated by polyanions with high catalytic activity and corrosion resistance for seawater oxidation

Highly increased hydrovoltaic power generation via surfactant optimization of carbon black solution for cellulose microfiber cylindrical generator

Bonding copper ribbons on crystalline photovoltaic modules using various lead-free solders

Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate

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