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Adhesion mechanisms of nanoparticle silver to substrate materials: identification

Nanotechnology, 2010-02, Vol.21 (5), p.055204-055204

2010

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Effect of the pressure drop rate on cell nucleation in continuous processing of microcellular polymers

Polymer engineering and science, 1995-03, Vol.35 (5), p.432-440

1995

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Heterogeneous Void Nucleation Study in Flip Chip Assembly Process Using No-Flow Underfill

Journal of electronic packaging, 2014-03, Vol.136 (1)

2014

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A microcellular processing study of poly(ethylene terephthalate) in the amorphous and semicrystalline states. Part II: Cell growth and process design

Polymer engineering and science, 1996-05, Vol.36 (11), p.1446-1453

1996

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Novel approach to fabricate porous sponges of poly(d,l-lactic-co-glycolic acid) without the use of organic solvents

Biomaterials, 1996-07, Vol.17 (14), p.1417-1422

1996

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An extrusion system for the processing of microcellular polymer sheets: Shaping and cell growth control

Polymer engineering and science, 1996-05, Vol.36 (10), p.1425-1435

1996

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Translation Solder Self-Alignment Mechanics Modeling for a Flip Chip in the Presence of a Viscous Fluid

Journal of electronic packaging, 2010-12, Vol.132 (4)

2010

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A numerical study of void nucleation and growth in a flip chip assembly process

Modelling and simulation in materials science and engineering, 2010-09, Vol.18 (6), p.065005-065005

2010

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Microcellular sheet extrusion system process design models for shaping and cell growth control

Polymer engineering and science, 1998-04, Vol.38 (4), p.674-688

1998

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Experimental evaluation of wetting dynamics models for Sn63Pb37 and SnAg4.0Cu0.5 solder materials

Journal of applied physics, 2008-08, Vol.104 (3)

2008

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Comprehensive Study of Lead-Free Reflow Process for a 3-D Flip Chip on Silicon Package

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-11, Vol.1 (11), p.1856-1863

2011

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Advanced Package Prototyping Using Nano-Particle Silver Printed Interconnects

IEEE transactions on electronics packaging manufacturing, 2010-04, Vol.33 (2), p.129-134

2010

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Rotational solder self-alignment mechanics modeling for a flip chip in the presence of a viscous fluid

Microelectronics and reliability, 2016-10, Vol.65, p.217-224

2016

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In process stress analysis of flip-chip assemblies during underfill cure

Microelectronics and reliability, 2000-07, Vol.40 (7), p.1181-1190

2000

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Void Formation Study of Flip Chip in Package Using No-Flow Underfill

IEEE transactions on electronics packaging manufacturing, 2008-10, Vol.31 (4), p.297-305

2008

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Near Void-Free Assembly Development of Flip Chip Using No-Flow Underfill

IEEE transactions on electronics packaging manufacturing, 2009-04, Vol.32 (2), p.106-114

2009

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A microcellular processing study of poly(ethylene terephthalate) in the amorphous and semicrystalline states. Part I: Microcell nucleation

Polymer engineering and science, 1996-05, Vol.36 (11), p.1437-1445

1996

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A theoretical yield model for assembly process of area array solder interconnect packages with experimental verification

IEEE transactions on electronics packaging manufacturing, 2005-10, Vol.28 (4), p.344-354

2005

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The Role of Gas Dissolution and Induced Crystallization During Microcellular Polymer Processing: A Study of Poly (Ethylene Terephthalate) and Carbon Dioxide Systems

Journal of engineering materials and technology, 1995-01, Vol.117 (1), p.62-74

1995

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Displacement Theory for Fixturing Design of Thin Flexible Circuit Board Assembly

Journal of electronic packaging, 2001-12, Vol.123 (4), p.388-393

2001

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No-flow underfill process modeling and analysis for low cost, high throughput flip chip assembly

IEEE transactions on electronics packaging manufacturing, 2003-04, Vol.26 (2), p.156-165

2003

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Effects of substrate design on underfill voiding using the low cost, high throughput flip chip assembly process and no-flow underfill materials

IEEE transactions on electronics packaging manufacturing, 2002-04, Vol.25 (2), p.107-112

2002

Volltextzugriff (PDF)

Experimental evaluation of wetting dynamics models for Sn 63 Pb 37 and SnAg 4.0 Cu 0.5 solder materials

Journal of applied physics, 2008-08, Vol.104 (3), p.033537-033537-13

2008

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Analysis of Adhesion and Fracture Energy of Nano-Particle Silver in Electronics Packaging Applications

IEEE transactions on advanced packaging, 2010-02, Vol.33 (1), p.48-57

2010

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Performance of Silver Nano Particles as an Electronics Packaging Interconnects Material

2007 Proceedings 57th Electronic Components and Technology Conference, 2007, p.219-226

2007

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Adhesion mechanisms of nanoparticle silver to substrate materials: identification

Effect of the pressure drop rate on cell nucleation in continuous processing of microcellular polymers

Heterogeneous Void Nucleation Study in Flip Chip Assembly Process Using No-Flow Underfill

A microcellular processing study of poly(ethylene terephthalate) in the amorphous and semicrystalline states. Part II: Cell growth and process design

Novel approach to fabricate porous sponges of poly(d,l-lactic-co-glycolic acid) without the use of organic solvents

An extrusion system for the processing of microcellular polymer sheets: Shaping and cell growth control

Translation Solder Self-Alignment Mechanics Modeling for a Flip Chip in the Presence of a Viscous Fluid

A numerical study of void nucleation and growth in a flip chip assembly process

Microcellular sheet extrusion system process design models for shaping and cell growth control

Experimental evaluation of wetting dynamics models for Sn63Pb37 and SnAg4.0Cu0.5 solder materials

Comprehensive Study of Lead-Free Reflow Process for a 3-D Flip Chip on Silicon Package

Advanced Package Prototyping Using Nano-Particle Silver Printed Interconnects

Rotational solder self-alignment mechanics modeling for a flip chip in the presence of a viscous fluid

In process stress analysis of flip-chip assemblies during underfill cure

Void Formation Study of Flip Chip in Package Using No-Flow Underfill

Near Void-Free Assembly Development of Flip Chip Using No-Flow Underfill

A microcellular processing study of poly(ethylene terephthalate) in the amorphous and semicrystalline states. Part I: Microcell nucleation

A theoretical yield model for assembly process of area array solder interconnect packages with experimental verification

The Role of Gas Dissolution and Induced Crystallization During Microcellular Polymer Processing: A Study of Poly (Ethylene Terephthalate) and Carbon Dioxide Systems

Displacement Theory for Fixturing Design of Thin Flexible Circuit Board Assembly

No-flow underfill process modeling and analysis for low cost, high throughput flip chip assembly

Effects of substrate design on underfill voiding using the low cost, high throughput flip chip assembly process and no-flow underfill materials

Experimental evaluation of wetting dynamics models for Sn 63 Pb 37 and SnAg 4.0 Cu 0.5 solder materials

Analysis of Adhesion and Fracture Energy of Nano-Particle Silver in Electronics Packaging Applications

Performance of Silver Nano Particles as an Electronics Packaging Interconnects Material

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