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Effect of Sintering Conditions on the Mechanical Strength of Cu-Sintered Joints for High-Power Applications

Materials, 2018-10, Vol.11 (11), p.2105

2018

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Comparative study of normal and thin Au/Pd/Ni(P) surface finishes with Sn–3.0Ag–0.5Cu solder joints under isothermal aging

Journal of materials science. Materials in electronics, 2021-10, Vol.32 (20), p.24790-24800

2021

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Metallurgically and mechanically reliable microsilver-sintered joints for automotive power module applications

Journal of materials science. Materials in electronics, 2022, Vol.33 (3), p.1724-1737

2022

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Effect of surface finish metallization on mechanical strength of Ag sintered joint

Microelectronic engineering, 2018-10, Vol.198, p.15-21

2018

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Sequential interfacial reactions of SAC305 solder joints with thin ENEPIG surface finishes

Surface and interface analysis, 2018-11, Vol.50 (11), p.1046-1050

2018

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Comparative study of ENEPIG and thin ENEPIG as surface finishes for SAC305 solder joints

Journal of materials science. Materials in electronics, 2018-03, Vol.29 (6), p.4724-4731

2018

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Interfacial reactions and mechanical properties of Sn–3.0Ag–0.5Cu solder with pure Pd or Pd(P) layers containing thin-Au/Pd/Ni(P) surface-finished PCBs during aging

Journal of materials science. Materials in electronics, 2020-03, Vol.31 (5), p.4027-4039

2020

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Effects of Ni layer thickness of thin-ENEPIG surface finishes on the interfacial reactions and shear strength of Sn-3.0Ag–0.5Cu solder joints during aging

Journal of materials science. Materials in electronics, 2019-07, Vol.30 (14), p.12911-12923

2019

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Effect of Sintering Conditions on Microstructure and Mechanical Strength of Cu Micro-Particle Sintered Joints for High-Power Semiconductor Module Applications

Journal of Welding and Joining, 2019-04, Vol.37 (2), p.26-34

2019

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Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints

Journal of Welding and Joining, 2018-10, Vol.36 (5), p.52-60

2018

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Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint

Journal of Welding and Joining, 2017-12, Vol.35 (6), p.51-58

2017

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Achieving Thickness‐Insensitive Morphology of the Photoactive Layer for Printable Organic Photovoltaic Cells via Side Chain Engineering in Nonfullerene Acceptors

Advanced energy materials, 2019-04, Vol.9 (14), p.n/a

2019

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Solderability of thin ENEPIG plating Layer for Fine Pitch Package application

Journal of the Microelectronics and Packaging Society, 2017-03, Vol.24 (1), p.83-90

2017

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A series connection architecture for large-area organic photovoltaic modules with a 7.5% module efficiency

Nature communications, 2016-01, Vol.7 (1), p.10279-10279, Article 10279

2016

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High-Performance Integrated Perovskite and Organic Solar Cells with Enhanced Fill Factors and Near-Infrared Harvesting

Advanced materials (Weinheim), 2016-04, Vol.28 (16), p.3159-3165

2016

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DA-9801 Promotes Neurite Outgrowth via ERK1/2-CREB Pathway in PC12 Cells

Biological and Pharmaceutical Bulletin, 2015/02/01, Vol.38(2), pp.169-178

2015

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A Novel Therapeutic Effect of a New Variant of CTLA4-Ig with Four Antennas That Are Terminally Capped with Sialic Acid in the CTLA4 Region

Biomolecules & therapeutics, 2022-11, Vol.30 (6), p.529-539

2022

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Solution‐Processed and Transparent Graphene Oxide/TiOx Gas Barrier via an Interfacial Photocatalytic Reduction

Advanced materials interfaces, 2020-04, Vol.7 (8), p.n/a

2020

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High-efficiency large-area perovskite photovoltaic modules achieved via electrochemically assembled metal-filamentary nanoelectrodes

Science advances, 2018-08, Vol.4 (8), p.eaat3604-eaat3604

2018

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Nanotopographical regulation of pancreatic islet-like cluster formation from human pluripotent stem cells using a gradient-pattern chip

Acta biomaterialia, 2019-09, Vol.95, p.337-347

2019

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Dopamine transporter trafficking is regulated by neutral sphingomyelinase 2/ceramide kinase

Cellular signalling, 2018-04, Vol.44, p.171-187

2018

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Development of a Label-Free LC-MS/MS-Based Glucosylceramide Synthase Assay and Its Application to Inhibitors Screening for Ceramide-Related Diseases

Biomolecules & therapeutics, 2019-03, Vol.27 (2), p.193-200

2019

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Electrically-driven hydrogel actuators in microfluidic channels: fabrication, characterization, and biological application

Lab on a chip, 2010-01, Vol.10 (12), p.1604-1610

2010

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A study for production simulation model generation system based on data model at a shipyard

International Journal of Naval Architecture and Ocean Engineering, 2016, 8(5), , pp.496-510

2016

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Identification of Heat Shock Protein 60 as a Regulator of Neutral Sphingomyelinase 2 and Its Role in Dopamine Uptake

PloS one, 2013-06, Vol.8 (6), p.e67216

2013

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Effect of Sintering Conditions on the Mechanical Strength of Cu-Sintered Joints for High-Power Applications

Comparative study of normal and thin Au/Pd/Ni(P) surface finishes with Sn–3.0Ag–0.5Cu solder joints under isothermal aging

Metallurgically and mechanically reliable microsilver-sintered joints for automotive power module applications

Effect of surface finish metallization on mechanical strength of Ag sintered joint

Sequential interfacial reactions of SAC305 solder joints with thin ENEPIG surface finishes

Comparative study of ENEPIG and thin ENEPIG as surface finishes for SAC305 solder joints

Interfacial reactions and mechanical properties of Sn–3.0Ag–0.5Cu solder with pure Pd or Pd(P) layers containing thin-Au/Pd/Ni(P) surface-finished PCBs during aging

Effects of Ni layer thickness of thin-ENEPIG surface finishes on the interfacial reactions and shear strength of Sn-3.0Ag–0.5Cu solder joints during aging

Effect of Sintering Conditions on Microstructure and Mechanical Strength of Cu Micro-Particle Sintered Joints for High-Power Semiconductor Module Applications

Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints

Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint

Achieving Thickness‐Insensitive Morphology of the Photoactive Layer for Printable Organic Photovoltaic Cells via Side Chain Engineering in Nonfullerene Acceptors

Solderability of thin ENEPIG plating Layer for Fine Pitch Package application

A series connection architecture for large-area organic photovoltaic modules with a 7.5% module efficiency

High-Performance Integrated Perovskite and Organic Solar Cells with Enhanced Fill Factors and Near-Infrared Harvesting

DA-9801 Promotes Neurite Outgrowth via ERK1/2-CREB Pathway in PC12 Cells

A Novel Therapeutic Effect of a New Variant of CTLA4-Ig with Four Antennas That Are Terminally Capped with Sialic Acid in the CTLA4 Region

Solution‐Processed and Transparent Graphene Oxide/TiOx Gas Barrier via an Interfacial Photocatalytic Reduction

High-efficiency large-area perovskite photovoltaic modules achieved via electrochemically assembled metal-filamentary nanoelectrodes

Nanotopographical regulation of pancreatic islet-like cluster formation from human pluripotent stem cells using a gradient-pattern chip

Dopamine transporter trafficking is regulated by neutral sphingomyelinase 2/ceramide kinase

Development of a Label-Free LC-MS/MS-Based Glucosylceramide Synthase Assay and Its Application to Inhibitors Screening for Ceramide-Related Diseases

Electrically-driven hydrogel actuators in microfluidic channels: fabrication, characterization, and biological application

A study for production simulation model generation system based on data model at a shipyard

Identification of Heat Shock Protein 60 as a Regulator of Neutral Sphingomyelinase 2 and Its Role in Dopamine Uptake

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