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SnOx high-efficiency EUV interference lithography gratings towards the ultimate resolution in photolithography

Microelectronic engineering, 2016-04, Vol.155, p.44-49

2016

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Patterning of nanodot-arrays using EUV achromatic Talbot lithography at the Swiss Light Source and Shanghai Synchrotron Radiation Facility

Microelectronic engineering, 2016-04, Vol.155, p.55-60

2016

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The top-down fabrication of a 3D-integrated, fully CMOS-compatible FET biosensor based on vertically stacked SiNWs and FinFETs

Sensors and actuators. B, Chemical, 2014-03, Vol.193, p.400-412

2014

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Novel High Sensitivity EUV Photoresist for Sub-7 nm Node

Journal of Photopolymer Science and Technology, 2016/06/21, Vol.29(3), pp.475-478

2016

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Long-term electrical stability of next generation LV Trench IGBT at Hitachi ABB Power Grids

Microelectronics and reliability, 2021-11, Vol.126, p.114300, Article 114300

2021

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Sensing with Advanced Computing Technology: Fin Field-Effect Transistors with High‑k Gate Stack on Bulk Silicon

ACS nano, 2015-05, Vol.9 (5), p.4872-4881

2015

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RF MEMS Shunt Capacitive Switches Using AlN Compared to Si3N4 Dielectric

Journal of microelectromechanical systems, 2012-10, Vol.21 (5), p.1229-1240

2012

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Pattern collapse mitigation in inorganic resists via a polymer freeze technique

Microelectronic engineering, 2016-04, Vol.155, p.39-43

2016

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Detection of ultra-low protein concentrations with the simplest possible field effect transistor

Nanotechnology, 2019-08, Vol.30 (32), p.324001

2019

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Experimental Demonstration of Point-Injection Trench IGBT Concept

2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD), 2023, p.179-182

2023

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Soft-punch-through buffer concept for 600–1200 V IGBTs

IET power electronics, 2019-12, Vol.12 (15), p.3874-3881

2019

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Junctionless silicon nanowire transistors for the tunable operation of a highly sensitive, low power sensor

Sensors and actuators. B, Chemical, 2013-07, Vol.183, p.1-10

2013

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Electrical characterization of high performance, liquid gated vertically stacked SiNW-based 3D FET biosensors

Sensors and actuators. B, Chemical, 2014-08, Vol.199, p.291-300

2014

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Carbon nanotube gas sensor array for multiplex analyte discrimination

Sensors and actuators. B, Chemical, 2015-02, Vol.207, p.833-842

2015

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Pushing the Limits of the Maximum Punch-Through Design with an Advanced Buffer for Thin Wafer IGBTs

2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD), 2020, p.509-512

2020

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High-yield, in-situ fabrication and integration of horizontal carbon nanotube arrays at the wafer scale for robust ammonia sensors

Carbon (New York), 2014-11, Vol.78, p.326-338

2014

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Sensitivity enhancement of chemically amplified resists and performance study using extreme ultraviolet interference lithography

Journal of micro/nanolithography, MEMS, and MOEMS, 2016-07, Vol.15 (3), p.33502

2016

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A Critical View of IGBT Buffer Designs for 200 °C Operation

2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD), 2019, p.47-50

2019

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RF MEMS Shunt Capacitive Switches Using AlN Compared to [Formula Omitted] Dielectric

Journal of microelectromechanical systems, 2012-10, Vol.21 (5), p.1229-1240

2012

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Nanoparticle Synthesis and Growth in a Continuous Plasma Reactor from Organosilicon Precursors

Plasma processes and polymers, 2012-02, Vol.9 (2), p.119-134

2012

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An advanced soft punch through buffer design for thin wafer IGBTs targeting lower losses and higher operating temperatures up to 200 °C

2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD), 2018, p.499-502

2018

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RF MEMS Shunt Capacitive Switches Using AlN Compared to \hbox\hbox Dielectric

Journal of microelectromechanical systems, 2012-10, Vol.21 (5), p.1229-1240

2012

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Vertically stacked Si nanostructures for biosensing applications

Microelectronic engineering, 2012-09, Vol.97, p.345-348

2012

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Low-line edge roughness extreme ultraviolet photoresists of organotin carboxylates

Journal of micro/nanolithography, MEMS, and MOEMS, 2015-11, Vol.14 (4), p.43506

2015

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Plasma Process. Polym. 2/2012

Plasma processes and polymers, 2012-02, Vol.9 (2), p.n/a

2012

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SnOx high-efficiency EUV interference lithography gratings towards the ultimate resolution in photolithography

Patterning of nanodot-arrays using EUV achromatic Talbot lithography at the Swiss Light Source and Shanghai Synchrotron Radiation Facility

The top-down fabrication of a 3D-integrated, fully CMOS-compatible FET biosensor based on vertically stacked SiNWs and FinFETs

Novel High Sensitivity EUV Photoresist for Sub-7 nm Node

Long-term electrical stability of next generation LV Trench IGBT at Hitachi ABB Power Grids

Sensing with Advanced Computing Technology: Fin Field-Effect Transistors with High‑k Gate Stack on Bulk Silicon

RF MEMS Shunt Capacitive Switches Using AlN Compared to Si3N4 Dielectric

Pattern collapse mitigation in inorganic resists via a polymer freeze technique

Detection of ultra-low protein concentrations with the simplest possible field effect transistor

Experimental Demonstration of Point-Injection Trench IGBT Concept

Soft-punch-through buffer concept for 600–1200 V IGBTs

Junctionless silicon nanowire transistors for the tunable operation of a highly sensitive, low power sensor

Electrical characterization of high performance, liquid gated vertically stacked SiNW-based 3D FET biosensors

Carbon nanotube gas sensor array for multiplex analyte discrimination

Pushing the Limits of the Maximum Punch-Through Design with an Advanced Buffer for Thin Wafer IGBTs

High-yield, in-situ fabrication and integration of horizontal carbon nanotube arrays at the wafer scale for robust ammonia sensors

Sensitivity enhancement of chemically amplified resists and performance study using extreme ultraviolet interference lithography

A Critical View of IGBT Buffer Designs for 200 °C Operation

RF MEMS Shunt Capacitive Switches Using AlN Compared to [Formula Omitted] Dielectric

Nanoparticle Synthesis and Growth in a Continuous Plasma Reactor from Organosilicon Precursors

An advanced soft punch through buffer design for thin wafer IGBTs targeting lower losses and higher operating temperatures up to 200 °C

RF MEMS Shunt Capacitive Switches Using AlN Compared to \hbox\hbox Dielectric

Vertically stacked Si nanostructures for biosensing applications

Low-line edge roughness extreme ultraviolet photoresists of organotin carboxylates

Plasma Process. Polym. 2/2012

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