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Contact cleaning opportunities on single wafer tool

Microelectronic engineering, 2018-05, Vol.192, p.8-13

2018

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Electrochemical behavior of copper and cobalt in post-etch cleaning solutions

Microelectronic engineering, 2009-10, Vol.86 (10), p.2038-2044

2009

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ToF-SIMS spectra multivariate analyses for the chemical characterization of microelectronic low-k materials

Surface and interface analysis, 2014-11, Vol.46 (S1), p.213-216

2014

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Aluminum Cleaning on Single Wafer Tool: A Case Study with Diluted HF

Solid state phenomena, 2018-08, Vol.282, p.226-231

Broussous, Lucile

2018

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Mechanical properties of a plasma-modified porous low- k material

Microelectronic engineering, 2010-03, Vol.87 (3), p.466-469

2010

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Depth-resolved impact of integration process on porosity and solvent diffusion in a SiOCH low-k material

Journal of porous materials, 2014-08, Vol.21 (4), p.475-484

2014

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Porosity and structure evolution of a SiOCH low k material during post-etch cleaning process

Microelectronic engineering, 2007-11, Vol.84 (11), p.2600-2605

2007

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Characterization of the impact of plasma treatments and wet cleaning on a porous low k material

Microelectronic engineering, 2006-11, Vol.83 (11), p.2314-2318

2006

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SAXS Study of Formation and Growth of Tin Oxide Nanoparticles in the Presence of Complexing Ligands

The journal of physical chemistry. B, 2002-03, Vol.106 (11), p.2855-2860

2002

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Study of solvent penetration inside a porous low k material by neutron reflectometry – Influence of material surface modifications and of solvent properties

Microelectronic engineering, 2008-10, Vol.85 (10), p.2089-2093

2008

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Impact of solvent and low k material surface characteristics on pore sealing efficiency and porosity measurement

Journal of physics. Conference series, 2009-03, Vol.152 (1), p.012002

2009

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Selective catalytic reduction of nitrogen monoxide by decane on copper-exchanged beta zeolites

Applied catalysis. B, Environmental, 1997-05, Vol.12 (1), p.49-59

1997

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Microfiltration of beer yeast suspensions through stamped ceramic membranes

Separation and purification technology, 2001-10, Vol.25 (1), p.535-543

2001

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Study of the post-etch cleaning compatibility with dense and porous ULK materials – characterization of the process impact

Microelectronic engineering, 2006-11, Vol.83 (11), p.2319-2323

2006

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Electrochemical Behavior of Cobalt in Post-Via Etch Cleaning Solutions

Diffusion and defect data, 2009, Vol.145-146, p.343-346

2009

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Integrated monitoring of ULK dielectrics out-gassing and measurement of pore sealing efficiency by residual gas analysis technique

Microelectronic engineering, 2007-11, Vol.84 (11), p.2719-2722

2007

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An experimental study of helically stamped ceramic microfiltration membranes using bentonite suspensions

Separation and purification technology, 2001-06, Vol.24 (1), p.205-221

2001

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Nearly Anhydrous Undissociated HF for the Removal of Hf / Ta / Zr Based Polymers after Plasma Etch, Selectively to Aluminum

ECS transactions, 2017, Vol.80 (2), p.199-209

2017

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Hydrodynamic aspects of filtration antifouling by helically corrugated membranes

Chemical engineering science, 2000-11, Vol.55 (21), p.5049-5057

2000

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Integration of Cu/SiOC in Cu dual damascene interconnect for 0.1-μm technology

Microelectronic engineering, 2002-10, Vol.64 (1), p.35-42

2002

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Customized Chemical Compositions Adaptable for Cleaning Virtually all Post-Etch Residues

Solid state phenomena, 2018-08, Vol.282, p.121-125

2018

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Post-Etch Cleaning Chemistries Evaluation for Low k-Copper Integration

Solid state phenomena, 2003-01, Vol.92, p.263-266

2003

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Structure of SnO2 alcosols and films prepared by sol-gel dip coating

Journal of non-crystalline solids, 2001-05, Vol.284 (1-3), p.61-67

2001

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A multi-wavelength 3D-compatible silicon photonics platform on 300mm SOI wafers for 25Gb/s applications

2013 IEEE International Electron Devices Meeting, 2013, p.13.3.1-13.3.4

2013

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Single Backside Cleaning on Silicon, Silicon Nitride and Silicon Oxide

Solid state phenomena, 2005-04, Vol.103-104, p.249-254

2005

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Contact cleaning opportunities on single wafer tool

Electrochemical behavior of copper and cobalt in post-etch cleaning solutions

ToF-SIMS spectra multivariate analyses for the chemical characterization of microelectronic low-k materials

Aluminum Cleaning on Single Wafer Tool: A Case Study with Diluted HF

Mechanical properties of a plasma-modified porous low- k material

Depth-resolved impact of integration process on porosity and solvent diffusion in a SiOCH low-k material

Porosity and structure evolution of a SiOCH low k material during post-etch cleaning process

Characterization of the impact of plasma treatments and wet cleaning on a porous low k material

SAXS Study of Formation and Growth of Tin Oxide Nanoparticles in the Presence of Complexing Ligands

Study of solvent penetration inside a porous low k material by neutron reflectometry – Influence of material surface modifications and of solvent properties

Impact of solvent and low k material surface characteristics on pore sealing efficiency and porosity measurement

Selective catalytic reduction of nitrogen monoxide by decane on copper-exchanged beta zeolites

Microfiltration of beer yeast suspensions through stamped ceramic membranes

Study of the post-etch cleaning compatibility with dense and porous ULK materials – characterization of the process impact

Electrochemical Behavior of Cobalt in Post-Via Etch Cleaning Solutions

Integrated monitoring of ULK dielectrics out-gassing and measurement of pore sealing efficiency by residual gas analysis technique

An experimental study of helically stamped ceramic microfiltration membranes using bentonite suspensions

Nearly Anhydrous Undissociated HF for the Removal of Hf / Ta / Zr Based Polymers after Plasma Etch, Selectively to Aluminum

Hydrodynamic aspects of filtration antifouling by helically corrugated membranes

Integration of Cu/SiOC in Cu dual damascene interconnect for 0.1-μm technology

Customized Chemical Compositions Adaptable for Cleaning Virtually all Post-Etch Residues

Post-Etch Cleaning Chemistries Evaluation for Low k-Copper Integration

Structure of SnO2 alcosols and films prepared by sol-gel dip coating

A multi-wavelength 3D-compatible silicon photonics platform on 300mm SOI wafers for 25Gb/s applications

Single Backside Cleaning on Silicon, Silicon Nitride and Silicon Oxide

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