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Next-generation optical access seamless evolution: concluding results of the European FP7 Project OASE

Journal of optical communications and networking, 2015-02, Vol.7 (2), p.109-123

2015

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Präparation einer TEM-Probe aus einem metallographischen Schliff

Praktische Metallographie, 2022-03, Vol.43 (6), p.306-318

2022

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Architectural options and challenges for next generation optical access

36th European Conference and Exhibition on Optical Communication, 2010, p.1-5

2010

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Technologies for convergence of fixed and mobile access: An operator's perspective [invited]

Journal of optical communications and networking, 2018-01, Vol.10 (1), p.A37-A42

2018

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Fixed and mobile convergence: which role for optical networks?

Journal of optical communications and networking, 2015-11, Vol.7 (11), p.1075-1083

2015

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37.5 km urban field trial of OFDMA-PON using colorless ONUs with dynamic bandwidth allocation and TCM [invited]

Journal of optical communications and networking, 2015-01, Vol.7 (1), p.A153-A161

2015

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Next-generation 100-gigabit metro ethernet (100 GbME) using multiwavelength optical rings

Journal of lightwave technology, 2004-11, Vol.22 (11), p.2420-2434

2004

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Mechanical reliability assessment of 28nm Back End of Line (BEoL) stack using finite element analysis and validation

2015 IEEE International Reliability Physics Symposium, 2015, p.CP.1.1-CP.1.7

2015

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Performance analysis of wavelength converters based on cross-gain modulation in semiconductor-optical amplifiers

Journal of lightwave technology, 1998-01, Vol.16 (1), p.78-85

1998

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Evolution of Terrestrial Optical System and Core Network Architecture

Proceedings of the IEEE, 2006-05, Vol.94 (5), p.869-891

2006

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Präparation einer TEM-Probe aus einem metallographischen Schliff

Praktische Metallographie, 2006-06, Vol.43 (6), p.306-315

2006

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Understanding the Fundamentals for Package Induced Failure in BEOL Interconnect at 20nm Node

MRS proceedings, 2013, Vol.1559 (1), Article mrss13-1559-aa08-01

2013

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Numerical Study on the Influence of Polyimide Thickness and Curing Temperature on Wafer Bow in Wafer Level Packaging

IMAPSource Proceedings, 2024-03, Vol.2023 (EMPC)

2024

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In-building and home networks in the FTTH context - a network operator's perspective

Journal of the Chinese Institute of Engineers, 2010-07, Vol.33 (5), p.697-705

2010

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Open Line Controller Architecture in Partially Disaggregated Optical Networks

2023 International Conference on Photonics in Switching and Computing (PSC), 2023, p.1-3

2023

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Experimental analyses of the mechanical reliability of advanced BEOL/fBEOL stacks regarding CPI loading

2013 IEEE International Reliability Physics Symposium (IRPS), 2013, p.5C.1.1-5C.1.10

2013

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Chip Package Interaction (CPI) Stress Modeling

2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020, p.1-4

2020

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CPI challenges to BEOL at 28nm node and beyond

2012 IEEE International Reliability Physics Symposium (IRPS), 2012, p.2E.1.1-2E.1.6

2012

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Quasi-Analytic Synthesis of Nonrecursive Optical Delay Line Filters for Reliable Compensation of Dispersion Effects

Journal of lightwave technology, 2006-11, Vol.24 (11), p.4403-4410

2006

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Numerical Study on the Influence of Polyimide Thickness and Curing Temperature on Wafer Bow in Wafer Level Packaging

2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC), 2023, p.1-6

2023

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Finite Element Model for Prediction of Back-End-of-Line Process Induced Wafer Bow for Patterned Wafer

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023, p.1-10

2023

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Technologies for convergence of fixed and mobile access: An operator's perspective

2017 Optical Fiber Communications Conference and Exhibition (OFC), 2017, p.1-3

2017

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Influence of Annealing on Microstructure of Electroplated Copper Trenches in Back-End-Of-Line

2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), 2023, p.1-3

2023

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BEoL Damage Evaluation Utilizing Sub-Critical Cu-Pillar Shear Tests, Acoustic Emission, nXCT, and SEM/FIB Analysis

2021 IEEE International Interconnect Technology Conference (IITC), 2021, p.1-3

2021

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Testing TIP Open Source Solutions in Deployed Optical Networks

2021 Optical Fiber Communications Conference and Exhibition (OFC), 2021, p.1-3

2021

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Next-generation optical access seamless evolution: concluding results of the European FP7 Project OASE

Präparation einer TEM-Probe aus einem metallographischen Schliff

Architectural options and challenges for next generation optical access

Technologies for convergence of fixed and mobile access: An operator's perspective [invited]

Fixed and mobile convergence: which role for optical networks?

37.5 km urban field trial of OFDMA-PON using colorless ONUs with dynamic bandwidth allocation and TCM [invited]

Next-generation 100-gigabit metro ethernet (100 GbME) using multiwavelength optical rings

Mechanical reliability assessment of 28nm Back End of Line (BEoL) stack using finite element analysis and validation

Performance analysis of wavelength converters based on cross-gain modulation in semiconductor-optical amplifiers

Evolution of Terrestrial Optical System and Core Network Architecture

Präparation einer TEM-Probe aus einem metallographischen Schliff

Understanding the Fundamentals for Package Induced Failure in BEOL Interconnect at 20nm Node

Numerical Study on the Influence of Polyimide Thickness and Curing Temperature on Wafer Bow in Wafer Level Packaging

In-building and home networks in the FTTH context - a network operator's perspective

Open Line Controller Architecture in Partially Disaggregated Optical Networks

Experimental analyses of the mechanical reliability of advanced BEOL/fBEOL stacks regarding CPI loading

Chip Package Interaction (CPI) Stress Modeling

CPI challenges to BEOL at 28nm node and beyond

Quasi-Analytic Synthesis of Nonrecursive Optical Delay Line Filters for Reliable Compensation of Dispersion Effects

Numerical Study on the Influence of Polyimide Thickness and Curing Temperature on Wafer Bow in Wafer Level Packaging

Finite Element Model for Prediction of Back-End-of-Line Process Induced Wafer Bow for Patterned Wafer

Technologies for convergence of fixed and mobile access: An operator's perspective

Influence of Annealing on Microstructure of Electroplated Copper Trenches in Back-End-Of-Line

BEoL Damage Evaluation Utilizing Sub-Critical Cu-Pillar Shear Tests, Acoustic Emission, nXCT, and SEM/FIB Analysis

Testing TIP Open Source Solutions in Deployed Optical Networks

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