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2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2019, p.1-7

2019

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An Improved Design for 2D Arrays of Capacitive Micromachined Ultrasound Transducers: Modeling, Fabrication, and Characterization

2018 IEEE International Ultrasonics Symposium (IUS), 2018, p.1-4

2018

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Mechanical characterization of sintered nanoparticles for advanced electrical and thermal joints: σ-ε-transformation in micro bending tests

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2015, p.1-8

2015

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Nanoparticle assembly and sintering towards all-copper flip chip interconnects

2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, p.1115-1121

2015

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IEEE_Xplore

Temporary wafer bonding - key technology for MEMS devices

2017 Pan Pacific Microelectronics Symposium (Pan Pacific), 2017, p.1-7

2017

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IEEE_Xplore

3D integration technologies for MEMS

2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT), 2016, p.334-337

2016

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Implantable hemodynamic controlling system with a highly miniaturized two axis acceleration sensor

2017 Pan Pacific Microelectronics Symposium (Pan Pacific), 2017, p.1-8

2017

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IEEE_Xplore

Harmonic Analysis of Microbeams with PZT On-Chip Actuating and Sensing

Integrated ferroelectrics, 2004-01, Vol.63 (1), p.9-13

2004

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Addiction and Engagement: An Explorative Study Toward Classification Criteria for Internet Gaming Disorder

Investigation of biocompatible Parylene as triboelectric layer for wearable energy harvesting

Towards classification criteria for internet gaming disorder: Debunking differences between addiction and high engagement in a German sample of World of Warcraft players

Investigation of Surface Pre-Treatment Methods for Wafer-Level Cu-Cu Thermo-Compression Bonding

Aluminum–germanium wafer bonding of (AlGaIn)N thin-film light-emitting diodes

Low-Temperature Wafer Bonding Using Solid-Liquid Inter-Diffusion Mechanism

Bridging the gap: Perspectives of nanofabrication technologies for application-oriented research

Aerosol Jet Printing of Nano Particle Based Electrical Chip Interconnects

Sealing of glass with titanium by glass pressing at the softening point

Implantable multi-sensor system for hemodynamic controlling

Aluminum―germanium wafer bonding of (AlGaIn)N thin-film light-emitting diodes : WaferBond'11, International Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration

Inductive Sintering Module for Improved Multi-Die Attach in the Field of Power Packaging

Technologies for Power Device Packaging by Using Solid Liquid Interdiffusion Bonding - SLID

Laser soldered wire bonding on liquid printed and sputtered contact structures on thin-flexes and injection molded devices

Parylene as a Dielectric Material for Electronic Applications in Space

Silver sintering technology based on induction heating for chip level bonding

Deposition of Parylene C and characterization of its hermeticity for the encapsulation of MEMS and medical devices

Micro Bending Test on Double Cantilever Beams: A specimen-centred approach to accurate determination of the visco-plastic properties of Sintered Silver for Power Electronics applications

An Improved Design for 2D Arrays of Capacitive Micromachined Ultrasound Transducers: Modeling, Fabrication, and Characterization

Mechanical characterization of sintered nanoparticles for advanced electrical and thermal joints: σ-ε-transformation in micro bending tests

Nanoparticle assembly and sintering towards all-copper flip chip interconnects

Temporary wafer bonding - key technology for MEMS devices

3D integration technologies for MEMS

Implantable hemodynamic controlling system with a highly miniaturized two axis acceleration sensor

Harmonic Analysis of Microbeams with PZT On-Chip Actuating and Sensing

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