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Plasma-enhanced chemical vapor deposition of amorphous Si on graphene

Applied physics letters, 2016-05, Vol.108 (19)

2016

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Method to determine the sticking coefficient of precursor molecules in atomic layer deposition

Applied surface science, 2009-04, Vol.255 (13), p.6620-6623

2009

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Water uptake of a low-κ dielectric film: Combining capacitance and gravimetric measurements

Microelectronic engineering, 2013-06, Vol.106, p.177-181

2013

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Electrical Evaluation of Ru–W(-N), Ru–Ta(-N) and Ru–Mn films as Cu diffusion barriers

Microelectronic engineering, 2012-04, Vol.92, p.71-75

2012

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Microstructure of electroplated Cu(Ag) alloy thin films

Thin solid films, 2011-03, Vol.519 (11), p.3522-3529

2011

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Characterization of Ru–Mn composites for ULSI interconnects

Microelectronic engineering, 2013-12, Vol.112, p.103-109

2013

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Electroplating of Cu(Ag) thin films for interconnect applications

Microelectronic engineering, 2010-02, Vol.87 (2), p.180-186

2010

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Productivity potential of an inline deposition system for amorphous and microcrystalline silicon solar cells

Solar energy materials and solar cells, 2009-09, Vol.93 (9), p.1598-1607

2009

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Electrical characterisation of HfYO MIM-structures deposited by ALD

Thin solid films, 2010-06, Vol.518 (16), p.4680-4683

2010

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Deposition of intrinsic hydrogenated amorphous silicon for thin-film solar cells - a comparative study for layers grown statically by RF-PECVD and dynamically by VHF-PECVD

Progress in photovoltaics, 2014-02, Vol.22 (2), p.198-207

2014

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Structure and thermal stability of graded Ta-TaN diffusion barriers between Cu and SiO2

Thin solid films, 2003-08, Vol.437 (1-2), p.248-256

2003

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Electromigration in electroplated Cu(Ag) alloy thin films investigated by means of single damascene Blech structures

Microelectronic engineering, 2009-12, Vol.86 (12), p.2396-2403

2009

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Top injection reactor tool with in situ spectroscopic ellipsometry for growth and characterization of ALD thin films

Microelectronic engineering, 2008-03, Vol.85 (3), p.527-533

2008

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Comparison of PVD, PECVD & PEALD Ru(-C) films as Cu diffusion barriers by means of bias temperature stress measurements

Microelectronic engineering, 2011-05, Vol.88 (5), p.641-645

2011

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Demonstration of a graphene-base heterojunction transistor with saturated output current

Journal of applied physics, 2019-06, Vol.125 (23)

2019

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Towards high frequency heterojunction transistors: Electrical characterization of N-doped amorphous silicon-graphene diodes

Journal of applied physics, 2017-06, Vol.121 (24)

2017

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Temperature dependence of the sticking coefficient in atomic layer deposition

Applied surface science, 2010-04, Vol.256 (12), p.3778-3782

2010

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Effect of wet chemical substrate pretreatment on the growth behavior of Ta(N) films deposited by thermal ALD

Microelectronic engineering, 2008-10, Vol.85 (10), p.2064-2067

2008

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Electrical properties of electroplated Cu(Ag) thin films

Thin solid films, 2009-04, Vol.517 (11), p.3320-3325

2009

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Remote plasma etching of titanium nitride using NF3/argon and chlorine mixtures for chamber clean applications

Microelectronic engineering, 2007, Vol.84 (1), p.37-41

2007

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Alternative etching gases to SF6 for plasma enhanced chamber cleaning in silicon deposition systems

Surface & coatings technology, 2005-10, Vol.200 (1-4), p.552-555

2005

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Thin tantalum–silicon–oxygen/tantalum–silicon–nitrogen films as high-efficiency humidity diffusion barriers for solar cell encapsulation

Thin solid films, 2006-12, Vol.515 (4), p.1612-1617

2006

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Hard x-ray nanofocusing by refractive lenses of constant thickness

Applied physics letters, 2014-09, Vol.105 (13)

2014

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Crystallization behavior of thin ALD-Al2O3 films

Thin solid films, 2003-02, Vol.425 (1-2), p.216-220

2003

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Analysis of the energy input during wire coating from a cylindrical magnetron source

Thin solid films, 2012-08, Vol.520 (20), p.6404-6408

2012

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Plasma-enhanced chemical vapor deposition of amorphous Si on graphene

Method to determine the sticking coefficient of precursor molecules in atomic layer deposition

Water uptake of a low-κ dielectric film: Combining capacitance and gravimetric measurements

Electrical Evaluation of Ru–W(-N), Ru–Ta(-N) and Ru–Mn films as Cu diffusion barriers

Microstructure of electroplated Cu(Ag) alloy thin films

Characterization of Ru–Mn composites for ULSI interconnects

Electroplating of Cu(Ag) thin films for interconnect applications

Productivity potential of an inline deposition system for amorphous and microcrystalline silicon solar cells

Electrical characterisation of HfYO MIM-structures deposited by ALD

Deposition of intrinsic hydrogenated amorphous silicon for thin-film solar cells - a comparative study for layers grown statically by RF-PECVD and dynamically by VHF-PECVD

Structure and thermal stability of graded Ta-TaN diffusion barriers between Cu and SiO2

Electromigration in electroplated Cu(Ag) alloy thin films investigated by means of single damascene Blech structures

Top injection reactor tool with in situ spectroscopic ellipsometry for growth and characterization of ALD thin films

Comparison of PVD, PECVD & PEALD Ru(-C) films as Cu diffusion barriers by means of bias temperature stress measurements

Demonstration of a graphene-base heterojunction transistor with saturated output current

Towards high frequency heterojunction transistors: Electrical characterization of N-doped amorphous silicon-graphene diodes

Temperature dependence of the sticking coefficient in atomic layer deposition

Effect of wet chemical substrate pretreatment on the growth behavior of Ta(N) films deposited by thermal ALD

Electrical properties of electroplated Cu(Ag) thin films

Remote plasma etching of titanium nitride using NF3/argon and chlorine mixtures for chamber clean applications

Alternative etching gases to SF6 for plasma enhanced chamber cleaning in silicon deposition systems

Thin tantalum–silicon–oxygen/tantalum–silicon–nitrogen films as high-efficiency humidity diffusion barriers for solar cell encapsulation

Hard x-ray nanofocusing by refractive lenses of constant thickness

Crystallization behavior of thin ALD-Al2O3 films

Analysis of the energy input during wire coating from a cylindrical magnetron source

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