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Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...Applied surface science, 2015-12, Vol.358, p.634-640
2015
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IOP conference series. Materials Science and Engineering, 2020-01, Vol.724 (1), p.12036
2020
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IOP conference series. Materials Science and Engineering, 2020-01, Vol.724 (1), p.12060
2020
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Journal of composite materials, 2014-01, Vol.48 (2), p.235-243
2014
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IOP conference series. Materials Science and Engineering, 2020-01, Vol.724 (1), p.12062
2020
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Analysis of humidity influence on adhesion and tribological properties of niobium nitride thin films
2019
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IOP conference series. Materials Science and Engineering, 2019-04, Vol.499 (1), p.12005
2019
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IOP conference series. Materials Science and Engineering, 2018-11, Vol.444 (3), p.32003
2018
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IOP conference series. Materials Science and Engineering, 2016-08, Vol.147 (1), p.12019
2016
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IOP conference series. Materials Science and Engineering, 2020-01, Vol.724 (1), p.12052
2020
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IOP conference series. Materials Science and Engineering, 2020-01, Vol.724 (1), p.12017
2020
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2020 International Semiconductor Conference (CAS), 2020, p.101-104
2020
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IOP conference series. Materials Science and Engineering, 2019-04, Vol.499 (1), p.12004
2019
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IOP conference series. Materials Science and Engineering, 2020-01, Vol.724 (1), p.12053
2020
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IOP conference series. Materials Science and Engineering, 2017-02, Vol.174 (1), p.12028
2017
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IOP conference series. Materials Science and Engineering, 2016-08, Vol.147 (1), p.12021
2016
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IOP conference series. Materials Science and Engineering, 2017-02, Vol.174 (1), p.12029
2017
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IOP conference series. Materials Science and Engineering, 2014, Vol.64 (1), p.12025
2014
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IOP conference series. Materials Science and Engineering, 2016-08, Vol.147 (1), p.12022
2016
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2017 International Semiconductor Conference (CAS), 2017, p.213-216
2017
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2016 International Semiconductor Conference (CAS), 2016, p.95-100
2016
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6th International Conference on Advancements of Medicine and Health Care Through Technology; 17-20 October 2018, Cluj-Napoca, Romania, 2019, Vol.71, p.321-327
2019
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2016 International Semiconductor Conference (CAS), 2016, p.89-92
2016
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2018 International Semiconductor Conference (CAS), 2018, p.83-86
2018
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2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013, p.1-6
2013
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