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Editorial

Heat transfer engineering, 2001-01, Vol.22 (1), p.1-2

Azar, Kaveh

2001

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Editorial

Heat transfer engineering, 2001-01, Vol.22 (1), p.1-2

Azar, Kaveh

2001

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Power consumption and generation in the electronics industry. A perspective

Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068), 2000, p.201-212

Azar, K.

2000

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The formation and properties of single nuclei

Electrochimica acta, 1983-07, Vol.28 (7), p.891-898

1983

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Enhanced cooling of electronic components by flow oscillation

Journal of thermophysics and heat transfer, 1992-10, Vol.6 (4), p.700-706

Azar, Kaveh

1992

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Effect of Pin Fin Density of the Thermal Performance of Unshrouded Pin Fin Heat Sinks

Journal of electronic packaging, 1994-12, Vol.116 (4), p.306-309

1994

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Experimental study on a hybrid liquid/air cooling system

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium, 2006, p.10-15

2006

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THE EFFECT OF DIVERGENCE ON THE INVISCID SPATIAL STABILITY OF AN AXISYMMETRIC JET, WITH OR WITHOUT SWIRL

AZAR, KAVEH

1984

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Cooling High-power Packages

Advanced packaging, 2008-08, Vol.17 (6), p.24-26

Azar, Kaveh

2008

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High capacity, compact hybrid air cooling system

Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006, 2006, p.5 pp.-790

2006

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How well can we assess thermally driven reliability issues in electronic systems today? Summary of panel held at the Therminic 2002

Microelectronics, 2003-12, Vol.34 (12), p.1195-1201

2003

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Achieving accurate thermal characterization using a CFD code: a case study of PLCC packages

Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 1995, p.55-64

1995

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Problem solving techniques in electronic cooling

Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium, 1989, p.37-43

Azar, K.

1989

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Achieving accurate thermal characterization using a CFD code-case study of plastic packages

IEEE transactions on components, packaging, and manufacturing technology. Part A, 1995-12, Vol.18 (4), p.732-738

1995

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Physical properties of human lips: Experimental and theoretical analysis

Journal of biomechanics, 1982, Vol.15 (11), p.859-866

1982

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Using a thermal simulation model to interpret test data (air cooling of circuit boards)

[1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 1992, p.4-10

1992

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Liquid crystal imaging for temperature measurement of electronic devices

1991 Proceedings, Seventh IEEE Semiconductor Thermal Measurement and Management Symposium, 1991, p.23-33

1991

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Using a thermal simulation model to interpret test data

IEEE transactions on components, hybrids, and manufacturing technology, 1992-10, Vol.15 (5), p.632-639

1992

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The Thermal Resistance of in-Situ Urea Formaldehyde Foam Insulation

Journal of thermal insulation, 1982-10, Vol.6 (2), p.63-74

1982

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Sensitivity of simulated circuit pack thermal performance to geometric arrangement variation

Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium, 1989, p.112-120

1989

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Sensitivity of circuit pack thermal performance to convective and geometric variation

IEEE transactions on components, hybrids, and manufacturing technology, 1989-12, Vol.12 (4), p.732-740

1989

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Optimal design of large-scale frames with an advanced charged system search algorithm using box-shaped sections

Engineering with computers, 2021-10, Vol.37 (4), p.2521-2541

2021

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S2163 Hepatitis C-Induced Duodenal Hemangioma Leading to Anemia via Slow Gastrointestinal Bleed

The American journal of gastroenterology, 2020-10, Vol.115 (1), p.S1142-S1143

2020

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Performance-based seismic design of steel frames using ant colony optimization

Journal of constructional steel research, 2010-04, Vol.66 (4), p.566-574

2010

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1823 Esophagitis in Immunocompromised Patient From Strongyloides Reactivation

The American journal of gastroenterology, 2019-10, Vol.114 (1), p.S1023-S1024

2019

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Editorial

Editorial

Power consumption and generation in the electronics industry. A perspective

The formation and properties of single nuclei

Enhanced cooling of electronic components by flow oscillation

Effect of Pin Fin Density of the Thermal Performance of Unshrouded Pin Fin Heat Sinks

Experimental study on a hybrid liquid/air cooling system

THE EFFECT OF DIVERGENCE ON THE INVISCID SPATIAL STABILITY OF AN AXISYMMETRIC JET, WITH OR WITHOUT SWIRL

Cooling High-power Packages

High capacity, compact hybrid air cooling system

How well can we assess thermally driven reliability issues in electronic systems today? Summary of panel held at the Therminic 2002

Achieving accurate thermal characterization using a CFD code: a case study of PLCC packages

Problem solving techniques in electronic cooling

Achieving accurate thermal characterization using a CFD code-case study of plastic packages

Physical properties of human lips: Experimental and theoretical analysis

Using a thermal simulation model to interpret test data (air cooling of circuit boards)

Liquid crystal imaging for temperature measurement of electronic devices

Using a thermal simulation model to interpret test data

The Thermal Resistance of in-Situ Urea Formaldehyde Foam Insulation

Sensitivity of simulated circuit pack thermal performance to geometric arrangement variation

Sensitivity of circuit pack thermal performance to convective and geometric variation

Optimal design of large-scale frames with an advanced charged system search algorithm using box-shaped sections

S2163 Hepatitis C-Induced Duodenal Hemangioma Leading to Anemia via Slow Gastrointestinal Bleed

Performance-based seismic design of steel frames using ant colony optimization

1823 Esophagitis in Immunocompromised Patient From Strongyloides Reactivation

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