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Evaluation of Lead- Free Solder Joints in Electronic Assemblies

Journal of electronic materials, 1994-08, Vol.23 (8), p.757-764

1994

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Study of polymerization processes in acid and base catalyzed silica sol-gels

Journal of non-crystalline solids, 1986-05, Vol.81 (3), p.365-379

1986

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Solvent effects on the condensation stage of the sol-gel process

Journal of non-crystalline solids, 1986-05, Vol.81 (3), p.381-395

1986

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Ni-Au surface finish effects on RF performance

1999 IEEE MTT-S International Microwave Symposium Digest (Cat. No.99CH36282), 1999, Vol.4, p.1909-1912 vol.4

1999

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Pressure effect on the coupling between rotational and translational motions of supercooled viscous fluids

The Journal of chemical physics, 1985-04, Vol.82 (7), p.3360-3370

1985

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Effect of formamide additive on the chemistry of silica sol-gels II. Gel structure

Journal of non-crystalline solids, 1988, Vol.105 (3), p.223-231

1988

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Fine Pitch Surface Mount Technology Assembly with Lead-free, Low Residue Solder Paste

Soldering & surface mount technology, 1995-02, Vol.7 (2), p.27-32

1995

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NMR and Raman study of the hydrolysis reaction in sol-gel processes

Journal of physical chemistry (1952), 1985-09, Vol.89 (20), p.4399-4404

1985

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The influence of temperature and humidity on printed wiring board surface finishes: Immersion tin vs organic azoles

Journal of electronic materials, 1994-08, Vol.23 (8), p.779-785

1994

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Wave soldering with a low melting point Bi-Sn alloy : Effects of soldering temperatures and circuit board finishes

Journal of electronic materials, 1996-07, Vol.25 (7), p.1128-1131

1996

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Terpene Chemical Stability and Composition Monitoring

Circuit world, 1993-01, Vol.19 (2), p.28-31

1993

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Thermal degradation of rosin during high temperature solder reflow

Thermochimica acta, 1992-04, Vol.198 (1), p.7-20

1992

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N.M.R. study of the dynamic structure of isopropylbenzene

Molecular physics, 1985-07, Vol.55 (4), p.867-885

1985

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Solvent effects on hydrolysis stage of the sol-gel process

Materials letters, 1985-01, Vol.3 (12), p.493-496

1985

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Pressure effect on the polymerization kinetics of sol-gel process

Materials letters, 1984, Vol.2 (5), p.448-450

1984

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Corrosion Protection of Copper Using Organic Solderability Preservatives

Circuit world, 1993-02, Vol.19 (3), p.40-45

1993

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29Si NMR study of the initial stage of the sol-gel process under high pressure

Journal of non-crystalline solids, 1985-07, Vol.72 (2), p.391-402

1985

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Thermotropic ionic liquid crystals. 3. Sodium-23 nuclear magnetic resonance study of the ionic mesophase of sodium n-alkyl carboxylates

Journal of physical chemistry (1952), 1983-11, Vol.87 (24), p.4991-4995

1983

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Research trends in lead-free soldering in the US: NCMS Lead-Free Solder Project

Proceedings First International Symposium on Environmentally Conscious Design and Inverse Manufacturing, 1999, p.602-605

1999

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Nonionic Water Soluble Flux Residue Detection by XPS

Circuit world, 1991-01, Vol.17 (2), p.4-15

1991

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Non-ionic Water Soluble Flux Residue Detection by XPS

Circuit world, 1991-01, Vol.17 (2), p.4-15

1991

Volltextzugriff (PDF)

Polymerization processes in acid- and base-catalyzed silica sol-gels

Journal of non-crystalline solids, 1986-01, Vol.81 (3), p.365-379

1986

Volltextzugriff (PDF)

sup 2 sup 9 Si NMR study of the initial stage of the sol-gel process under high pressure

Journal of non-crystalline solids, 1985-01, Vol.72 (2-3), p.391-402

1985

Volltextzugriff (PDF)

Fine Pitch Surface Mount Technology Assembly with Leadfree, Low Residue Solder Paste

Soldering & surface mount technology, 1995-02, Vol.7 (2), p.27-32

1995

Volltextzugriff (PDF)

The influence of temperature and humidity on printed wiring board surface finishes : immersion tin vs organic azoles : Lead-free solder

Journal of electronic materials, 1994, Vol.23 (8), p.779-785

1994

Volltextzugriff (PDF)

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Evaluation of Lead- Free Solder Joints in Electronic Assemblies

Study of polymerization processes in acid and base catalyzed silica sol-gels

Solvent effects on the condensation stage of the sol-gel process

Ni-Au surface finish effects on RF performance

Pressure effect on the coupling between rotational and translational motions of supercooled viscous fluids

Effect of formamide additive on the chemistry of silica sol-gels II. Gel structure

Fine Pitch Surface Mount Technology Assembly with Lead-free, Low Residue Solder Paste

NMR and Raman study of the hydrolysis reaction in sol-gel processes

The influence of temperature and humidity on printed wiring board surface finishes: Immersion tin vs organic azoles

Wave soldering with a low melting point Bi-Sn alloy : Effects of soldering temperatures and circuit board finishes

Terpene Chemical Stability and Composition Monitoring

Thermal degradation of rosin during high temperature solder reflow

N.M.R. study of the dynamic structure of isopropylbenzene

Solvent effects on hydrolysis stage of the sol-gel process

Pressure effect on the polymerization kinetics of sol-gel process

Corrosion Protection of Copper Using Organic Solderability Preservatives

29Si NMR study of the initial stage of the sol-gel process under high pressure

Thermotropic ionic liquid crystals. 3. Sodium-23 nuclear magnetic resonance study of the ionic mesophase of sodium n-alkyl carboxylates

Research trends in lead-free soldering in the US: NCMS Lead-Free Solder Project

Nonionic Water Soluble Flux Residue Detection by XPS

Non-ionic Water Soluble Flux Residue Detection by XPS

Polymerization processes in acid- and base-catalyzed silica sol-gels

sup 2 sup 9 Si NMR study of the initial stage of the sol-gel process under high pressure

Fine Pitch Surface Mount Technology Assembly with Leadfree, Low Residue Solder Paste

The influence of temperature and humidity on printed wiring board surface finishes : immersion tin vs organic azoles : Lead-free solder

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