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Cu Electrodeposition on Resistive Substrates in Alkaline Chemistry: Effect of Current Density and Wafer RPM

Journal of the Electrochemical Society, 2011, Vol.158 (6), p.D390

Armini, S.

2011

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Enabling bottom-up nanoelectronics fabrication by selective sol–gel dielectric-on-dielectric deposition

Materials science & engineering. B, Solid-state materials for advanced technology, 2021-01, Vol.263, p.114808, Article 114808

2021

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Template-dependent hydrophobicity in mesoporous organosilica films

Microporous and mesoporous materials, 2018-03, Vol.259, p.111-115

2018

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Structural Phases of Alkanethiolate Self-Assembled Monolayers (C1–12) on Cu[100] by Density Functional Theory

Journal of physical chemistry. C, 2020-02, Vol.124 (6), p.3802-3811

2020

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Impact of organic linking and terminal groups on the mechanical properties of self-assembly based low-k dielectrics

Applied physics letters, 2017-10, Vol.111 (16)

2017

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Evidence of a suffocation alarm system within the periaqueductal gray matter of the rat

Neuroscience, 2012-01, Vol.200, p.59-73

2012

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Effect of the C-bridge length on the ultraviolet-resistance of oxycarbosilane low-k films

Applied physics letters, 2016-01, Vol.108 (1)

2016

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Application of Self-Assembled Monolayers to the Electroless Metallization of High Aspect Ratio Vias for Microelectronics

Journal of electronic materials, 2016-10, Vol.45 (10), p.5449-5455

2016

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Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-stacked IC integration

Microelectronic engineering, 2011-05, Vol.88 (5), p.745-748

2011

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Composite Polymer Core–Ceria Shell Abrasive Particles during Oxide CMP: A Defectivity Study

Journal of the Electrochemical Society, 2008, Vol.155 (9), p.H653

2008

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Prediction of scratch generation in chemical mechanical planarization

CIRP annals, 2008, Vol.57 (1), p.559-562

2008

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Copper plating for 3D interconnects

Microelectronic engineering, 2011-05, Vol.88 (5), p.701-704

2011

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Materials Engineering for Future Interconnects: “Catalyst-Free” Electroless Cu Deposition on Self-Assembled Monolayer Alternative Barriers

Journal of the Electrochemical Society, 2010, Vol.157 (1), p.D74

2010

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Void-Free Filling of HAR TSVs Using a Wet Alkaline Cu Seed on CVD Co as a Replacement for PVD Cu Seed

Journal of the Electrochemical Society, 2011, Vol.158 (2), p.H160

2011

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Direct Copper Electrochemical Deposition on Ru-Based Substrates for Advanced Interconnects Target 30 nm and ½ Pitch Lines: From Coupon to Full-Wafer Experiments

Journal of the Electrochemical Society, 2013, Vol.160 (3), p.D89-D94

2013

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Electrical properties of amino SAM layers studied with conductive AFM

European polymer journal, 2013-08, Vol.49 (8), p.1952-1956

2013

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Selective self-assembled monolayer coating to enable Cu-to-Cu connection in dual damascene vias

Microelectronic engineering, 2013-06, Vol.106, p.76-80

2013

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(Invited) Wafer Scale Copper Direct Plating on Thin PVD RuTa Layers: A Route to Enable Filling 30 nm Features and Below

ECS transactions, 2014-02, Vol.58 (17), p.3-15

2014

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The role of atomic oxygen in the decomposition of self-assembled monolayers during area-selective atomic layer deposition

Applied surface science, 2022-06, Vol.586, p.152679, Article 152679

2022

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On the use of (3-trimethoxysilylpropyl)diethylenetriamine self-assembled monolayers as seed layers for the growth of Mn based copper diffusion barrier layers

Applied surface science, 2018-01, Vol.427, p.260-266

2018

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Numerical analysis of zeptogram/Hz-level mass responsivity for in-plane resonant nano-electro-mechanical sensors

Microelectronic engineering, 2011-09, Vol.88 (9), p.2879-2884

2011

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Nucleation and adhesion of ultra-thin copper films on amino-terminated self-assembled monolayers

Applied surface science, 2018-12, Vol.462, p.38-47

2018

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Leucorrhoea in Young Women and Determinants of Preventive Behavior : A Literature Review

Pediomaternal Nursing Journal (Surabaya.Online), 2022-08, Vol.8 (2), p.102-110

Armini, S. Kp., M. Kes, Ni Ketut Alit

2022

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Metal barrier induced damage in self-assembly based organosilica low-k dielectrics and its reduction by organic template residues

Applied surface science, 2019-08, Vol.485, p.170-178

2019

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Area selective grafting of siloxane molecules on low-k dielectric with respect to copper surface

Applied surface science, 2019-05, Vol.476, p.317-324

2019

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Cu Electrodeposition on Resistive Substrates in Alkaline Chemistry: Effect of Current Density and Wafer RPM

Enabling bottom-up nanoelectronics fabrication by selective sol–gel dielectric-on-dielectric deposition

Template-dependent hydrophobicity in mesoporous organosilica films

Structural Phases of Alkanethiolate Self-Assembled Monolayers (C1–12) on Cu[100] by Density Functional Theory

Impact of organic linking and terminal groups on the mechanical properties of self-assembly based low-k dielectrics

Evidence of a suffocation alarm system within the periaqueductal gray matter of the rat

Effect of the C-bridge length on the ultraviolet-resistance of oxycarbosilane low-k films

Application of Self-Assembled Monolayers to the Electroless Metallization of High Aspect Ratio Vias for Microelectronics

Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-stacked IC integration

Composite Polymer Core–Ceria Shell Abrasive Particles during Oxide CMP: A Defectivity Study

Prediction of scratch generation in chemical mechanical planarization

Copper plating for 3D interconnects

Materials Engineering for Future Interconnects: “Catalyst-Free” Electroless Cu Deposition on Self-Assembled Monolayer Alternative Barriers

Void-Free Filling of HAR TSVs Using a Wet Alkaline Cu Seed on CVD Co as a Replacement for PVD Cu Seed

Direct Copper Electrochemical Deposition on Ru-Based Substrates for Advanced Interconnects Target 30 nm and ½ Pitch Lines: From Coupon to Full-Wafer Experiments

Electrical properties of amino SAM layers studied with conductive AFM

Selective self-assembled monolayer coating to enable Cu-to-Cu connection in dual damascene vias

(Invited) Wafer Scale Copper Direct Plating on Thin PVD RuTa Layers: A Route to Enable Filling 30 nm Features and Below

The role of atomic oxygen in the decomposition of self-assembled monolayers during area-selective atomic layer deposition

On the use of (3-trimethoxysilylpropyl)diethylenetriamine self-assembled monolayers as seed layers for the growth of Mn based copper diffusion barrier layers

Numerical analysis of zeptogram/Hz-level mass responsivity for in-plane resonant nano-electro-mechanical sensors

Nucleation and adhesion of ultra-thin copper films on amino-terminated self-assembled monolayers

Leucorrhoea in Young Women and Determinants of Preventive Behavior : A Literature Review

Metal barrier induced damage in self-assembly based organosilica low-k dielectrics and its reduction by organic template residues

Area selective grafting of siloxane molecules on low-k dielectric with respect to copper surface

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