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2D boron nitride nanosheets for polymer composite materials

NPJ 2D materials and applications, 2021-05, Vol.5 (1), p.1-18, Article 56

2021

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Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

JOM (1989), 2015-10, Vol.67 (10), p.2394-2415

2015

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Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue

Journal of electronic materials, 2012-02, Vol.41 (2), p.241-252

2012

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The Influence of Processing on Strengthening Mechanisms in Pb-Free Solder Joints

Journal of electronic materials, 2017-04, Vol.46 (4), p.2067-2079

2017

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Flexible Hybrid Electronics via Near‐Infrared Radiation‐Assisted Soldering of Surface Mount Devices on Screen Printed Circuits

Advanced electronic materials, 2023-04, Vol.9 (4), p.n/a

2023

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Correlations Between the Microstructure and Fatigue Life of Near-Eutectic Sn-Ag-Cu Pb-Free Solders

Journal of electronic materials, 2009-12, Vol.38 (12), p.2617-2627

2009

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Correction: Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

JOM (1989), 2023-11, Vol.75 (11), p.5003-5003

2023

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Increasing the Strength and Electrical Conductivity of AA6101 Aluminum by Nanostructuring

Light Metals 2019, p.1507-1513

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Lead-Free Solders: Focus on Fundamentals, Reliability, and Applications

JOM (1989), 2014-11, Vol.66 (11), p.2309-2310

Arfaei, Babak

2014

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Friction force reduction for electrical terminals using graphene coating

Nanotechnology, 2021-01, Vol.32 (3), p.35704-035704

2021

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Advanced Characterization of Pb-Free Interconnects

JOM (1989), 2016-11, Vol.68 (11), p.2869-2870

2016

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Hurst-Exponent-Based Detection of High-Impedance DC Arc Events for 48-V Systems in Vehicles

IEEE transactions on power electronics, 2021-04, Vol.36 (4), p.3803-3813

2021

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IEEE_Xplore

Emerging Interconnects and Pb-free Materials for Advanced Electronic Packaging

JOM (1989), 2015-10, Vol.67 (10), p.2381-2382

2015

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Polyethylene-BN nanosheets nanocomposites with enhanced thermal and mechanical properties

Composites science and technology, 2021-03, Vol.204, p.108631, Article 108631

2021

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Erratum to: Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

JOM (1989), 2017-07, Vol.69 (7), p.1244-1244

2017

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Improvement of the thermal conductivity and tribological properties of polyethylene by incorporating functionalized boron nitride nanosheets

Tribology international, 2022-01, Vol.165, p.107277, Article 107277

2022

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Influence of equal-channel angular pressing on the corrosion fatigue behaviour of an Al-Mg-Si aluminium alloy for automotive conductors

International journal of fatigue, 2020-11, Vol.140, p.105812, Article 105812

2020

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Pb-Free Solder Joint Thermo-Mechanical Modeling: State of the Art and Challenges

JOM (1989), 2019, Vol.71 (1), p.143-157

2019

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Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies

Journal of electronic materials, 2012, Vol.41 (2), p.241-252

2012

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The effects of nucleation and solidification mechanisms on the microstructure and thermomechanical response of tin silver copper solder joints

Arfaei, Babak

2010

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ProQuest

On-Line Detection of Dc Arc Faults Using Hurst Exponents for Hybrid-Electric Vehicles

2020 IEEE Energy Conversion Congress and Exposition (ECCE), 2020, p.6372-6378

2020

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IEEE_Xplore

Effect of variation in the reflow profile on the microstructure of near eutectic SnAgCu alloys

2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, p.1769-1775

2014

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IEEE_Xplore

Failure mechanism and microstructural evolution of Pb-free solder alloys in thermal cycling tests: Effect of solder composition and Sn grain morphology

2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, p.118-126

2015

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IEEE_Xplore

Effect of Processing Variables on the Mechanical Reliability of Copper Pillar SnAg Solder Joints

2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.423-428

2017

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IEEE_Xplore

Reliability and failure mechanism of solder joints in thermal cycling tests

2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.976-985

2013

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IEEE_Xplore

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2D boron nitride nanosheets for polymer composite materials

Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue

The Influence of Processing on Strengthening Mechanisms in Pb-Free Solder Joints

Flexible Hybrid Electronics via Near‐Infrared Radiation‐Assisted Soldering of Surface Mount Devices on Screen Printed Circuits

Correlations Between the Microstructure and Fatigue Life of Near-Eutectic Sn-Ag-Cu Pb-Free Solders

Correction: Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

Increasing the Strength and Electrical Conductivity of AA6101 Aluminum by Nanostructuring

Lead-Free Solders: Focus on Fundamentals, Reliability, and Applications

Friction force reduction for electrical terminals using graphene coating

Advanced Characterization of Pb-Free Interconnects

Hurst-Exponent-Based Detection of High-Impedance DC Arc Events for 48-V Systems in Vehicles

Emerging Interconnects and Pb-free Materials for Advanced Electronic Packaging

Polyethylene-BN nanosheets nanocomposites with enhanced thermal and mechanical properties

Erratum to: Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends

Improvement of the thermal conductivity and tribological properties of polyethylene by incorporating functionalized boron nitride nanosheets

Influence of equal-channel angular pressing on the corrosion fatigue behaviour of an Al-Mg-Si aluminium alloy for automotive conductors

Pb-Free Solder Joint Thermo-Mechanical Modeling: State of the Art and Challenges

Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies

The effects of nucleation and solidification mechanisms on the microstructure and thermomechanical response of tin silver copper solder joints

On-Line Detection of Dc Arc Faults Using Hurst Exponents for Hybrid-Electric Vehicles

Effect of variation in the reflow profile on the microstructure of near eutectic SnAgCu alloys

Failure mechanism and microstructural evolution of Pb-free solder alloys in thermal cycling tests: Effect of solder composition and Sn grain morphology

Effect of Processing Variables on the Mechanical Reliability of Copper Pillar SnAg Solder Joints

Reliability and failure mechanism of solder joints in thermal cycling tests

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