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Multichannel detection of ionic currents through two nanopores fabricated on integrated Si3N4 membranes

Lab on a chip, 2016-01, Vol.16 (17), p.3340-3350

2016

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Mathematics in a Japanese overseas school: Connecting classroom study and curriculum

Asian Journal for Mathematics Education, 2023-06, Vol.2 (2), p.204-219

Aoki, Mayu

2023

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Consideration of the Process of Lymph Node Metastasis in Invasive Breast Cancer With Squamous Cell Differentiation

International surgery, 2024-05, Vol.107-108, p.35-38

2024

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Treatment Result of Neoadjuvant Endocrine Therapy in Postmenopausal Patients with Hormone Receptor-Positive Breast Cancer in Our Hospital

Gan to kagaku ryoho, 2020-12, Vol.47 (13), p.2035

2020

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Demonstration of inter-chip data transmission in a three-dimensional stacked chip fabricated by chip-level TSV integration

2012 Symposium on VLSI Technology (VLSIT), 2012, p.175-176

2012

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Multichannel detection of ionic currents through two nanopores fabricated on integrated Si3N4 membranesElectronic supplementary information (ESI) available. See DOI: 10.1039/c6lc00639f

2016-08

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Multichannel detection of ionic currents through two nanopores fabricated on integrated Si 3 N 4 membranes

Lab on a chip, 2016, Vol.16 (17), p.3340-3350

2016

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Fabricating 3D integrated CMOS devices by using wafer stacking and via-last TSV technologies

2013 IEEE International Electron Devices Meeting, 2013, p.29.5.1-29.5.4

2013

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Scalable 3D-FPGA using wafer-to-wafer TSV interconnect of 15 Tbps/W, 3.3 Tbps/mm2

2013 Symposium on VLSI Technology, 2013, p.C24-C25

2013

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3D integration technology using hybrid wafer bonding and via-last TSV process

IEEE International Interconnect Technology Conference, 2014, p.211-214

2014

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300-Mm wafer 3D integration technology using hybrid wafer bonding

2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013, p.51-54

2013

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Didactic Transposition of Fraction Arithmetic in a Japanese Overseas School: Connecting a Classroom Episode to the Curriculum

Extended Abstracts 2022, p.625-631

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Fabrication and analysis of SiN nanopores for direct DNA sequencing

2015 IEEE International Electron Devices Meeting (IEDM), 2015, p.13.6.1-13.6.4

2015

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Wafer-level hybrid bonding technology with copper/polymer co-planarization

2010 IEEE International 3D Systems Integration Conference (3DIC), 2010, p.1-4

2010

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Scalable 3D-FPGA using wafer-to-wafer TSV interconnect of 15 Tbps/W, 3.3 Tbps/mm2

2013 Symposium on VLSI Circuits, 2013, p.C24-C25

2013

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Void reduction in wafer bonding by simultaneously formed ventilation channels

2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International, 2012, p.1-5

2012

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Three-dimensional integration scheme using hybrid wafer bonding and via-last TSV process

2012 2nd IEEE CPMT Symposium Japan, 2012, p.1-4

2012

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Chip-level TSV integration for rapid prototyping of 3D system LSIs

2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International, 2012, p.1-4

2012

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Adjuvant treatment of endometrial cancer today

Japanese journal of clinical oncology, 2020-07, Vol.50 (7), p.753-765

2020

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Association between transfusion volume and survival outcome following trauma: Insight into the limit of transfusion from an analysis of nationwide trauma registry in Japan

The journal of trauma and acute care surgery, 2024-05, Vol.96 (5), p.742

2024

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Room Temperature Anionic Episulfide Resin Adhesive UV-curable by a Thiol Initiator and Photobase Generator

Chemistry letters, 2023-10, Vol.52 (10), p.775-778

2023

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Prognosis and adjuvant chemotherapy for patients with positive peritoneal cytology in stage IA endometrial cancer

Scientific reports, 2022-01, Vol.12 (1), p.166-166, Article 166

2022

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Pembrolizumab plus chemotherapy in Japanese patients with persistent, recurrent or metastatic cervical cancer: Results from KEYNOTE‐826

Cancer science, 2022-11, Vol.113 (11), p.3877-3887

2022

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Cerebral air embolism caused by aspiration pneumonia: A case report

Journal of stroke and cerebrovascular diseases, 2024-10, Vol.33 (12), p.108079, Article 108079

2024

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A phase I study of combined trabectedin and pegylated liposomal doxorubicin therapy for advanced relapsed ovarian cancer

International journal of clinical oncology, 2021-10, Vol.26 (10), p.1977-1985

2021

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Multichannel detection of ionic currents through two nanopores fabricated on integrated Si3N4 membranes

Mathematics in a Japanese overseas school: Connecting classroom study and curriculum

Consideration of the Process of Lymph Node Metastasis in Invasive Breast Cancer With Squamous Cell Differentiation

Treatment Result of Neoadjuvant Endocrine Therapy in Postmenopausal Patients with Hormone Receptor-Positive Breast Cancer in Our Hospital

Demonstration of inter-chip data transmission in a three-dimensional stacked chip fabricated by chip-level TSV integration

Multichannel detection of ionic currents through two nanopores fabricated on integrated Si3N4 membranesElectronic supplementary information (ESI) available. See DOI: 10.1039/c6lc00639f

Multichannel detection of ionic currents through two nanopores fabricated on integrated Si 3 N 4 membranes

Fabricating 3D integrated CMOS devices by using wafer stacking and via-last TSV technologies

Scalable 3D-FPGA using wafer-to-wafer TSV interconnect of 15 Tbps/W, 3.3 Tbps/mm2

3D integration technology using hybrid wafer bonding and via-last TSV process

300-Mm wafer 3D integration technology using hybrid wafer bonding

Didactic Transposition of Fraction Arithmetic in a Japanese Overseas School: Connecting a Classroom Episode to the Curriculum

Fabrication and analysis of SiN nanopores for direct DNA sequencing

Wafer-level hybrid bonding technology with copper/polymer co-planarization

Scalable 3D-FPGA using wafer-to-wafer TSV interconnect of 15 Tbps/W, 3.3 Tbps/mm2

Void reduction in wafer bonding by simultaneously formed ventilation channels

Three-dimensional integration scheme using hybrid wafer bonding and via-last TSV process

Chip-level TSV integration for rapid prototyping of 3D system LSIs

Adjuvant treatment of endometrial cancer today

Association between transfusion volume and survival outcome following trauma: Insight into the limit of transfusion from an analysis of nationwide trauma registry in Japan

Room Temperature Anionic Episulfide Resin Adhesive UV-curable by a Thiol Initiator and Photobase Generator

Prognosis and adjuvant chemotherapy for patients with positive peritoneal cytology in stage IA endometrial cancer

Pembrolizumab plus chemotherapy in Japanese patients with persistent, recurrent or metastatic cervical cancer: Results from KEYNOTE‐826

Cerebral air embolism caused by aspiration pneumonia: A case report

A phase I study of combined trabectedin and pegylated liposomal doxorubicin therapy for advanced relapsed ovarian cancer

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