UB Paderborn / Katalog / Suche / in CDI

Sortiert nach

Einfacher Volltextzugriff von (fast) überall

Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...

Application of AI in in Multilevel Pain Assessment Using Facial Images: Systematic Review and Meta-Analysis

Journal of medical Internet research, 2024-04, Vol.26 (9), p.e51250-e51250

2024

Volltextzugriff (PDF)

Correction: Application of AI in Multilevel Pain Assessment Using Facial Images: Systematic Review and Meta-Analysis

Journal of medical Internet research, 2024-04, Vol.26, p.e59628-e59628

2024

Volltextzugriff (PDF)

Super-hydrophilicity to super-hydrophobicity transition of a surface with Ni micro–nano cones array

Applied surface science, 2012-12, Vol.263, p.821-824

2012

Volltextzugriff (PDF)

Effect of Co-W and Co-Fe-W Diffusion Barriers on the Reliability of the Solder/Cu Interface during Reflow Conditions

Electronic Materials Letters, 2024, 20(5), , pp.517-524

2024

Volltextzugriff (PDF)

Electrodeposited Palladium Coating on Co Micro-Nano Cones Array for Low-Temperature Solid-State Bonding

Electronic Materials Letters, 2024, 20(3), , pp.326-336

2024

Volltextzugriff (PDF)

Super-hydrophobic nickel films with micro-nano hierarchical structure prepared by electrodeposition

Applied surface science, 2010-02, Vol.256 (8), p.2400-2404

2010

Volltextzugriff (PDF)

Competitive Effect of Leveler's Electrochemical Behavior and Impurity on Electrical Resistance of Electroplated Copper

Journal of the Electrochemical Society, 2019, Vol.166 (13), p.D577-D582

2019

Volltextzugriff (PDF)

A facile process for preparing superhydrophobic nickel films with stearic acid

Surface & coatings technology, 2013-09, Vol.231, p.88-92

2013

Volltextzugriff (PDF)

Mitigation and Mechanism of Tin Whisker on Micro-bumps by Hard and Soft Underfills

Electronic materials letters, 2022-11, Vol.18 (6), p.547-558

2022

Volltextzugriff (PDF)

Effects of W contents on the solid-state interfacial reactions of Sn/Co-W

Journal of materials science, 2022, Vol.57 (2), p.1403-1415

2022

Volltextzugriff (PDF)

Inhibiting effects of the Ni barrier layer on the growth of porous Cu3Sn in 10-μm microbumps

Journal of materials science. Materials in electronics, 2021-07, Vol.32 (13), p.17655-17661

2021

Volltextzugriff (PDF)

Study on the properties of Sn–9Zn– xCr lead-free solder

Journal of alloys and compounds, 2008-07, Vol.460 (1), p.478-484

2008

Volltextzugriff (PDF)

Electrodeposited nanostructured cobalt film and its dual modulation of both superhydrophobic property and adhesiveness

Applied surface science, 2015-01, Vol.324, p.319-323

2015

Volltextzugriff (PDF)

Study on melt properties, microstructure, tensile properties of low Ag content Sn–Ag–Zn Lead-free solders

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2012-10, Vol.556, p.885-890

2012

Volltextzugriff (PDF)

Facile synthesis of petal-like nanocrystalline Co3O4 film using direct high-temperature oxidation

Journal of materials science, 2019-05, Vol.54 (10), p.7922-7930

2019

Volltextzugriff (PDF)

Effect of Sn surface diffusion on growth behaviors of intermetallic compounds in cu/Ni/SnAg microbumps

Materials characterization, 2020-01, Vol.159, p.110030, Article 110030

2020

Volltextzugriff (PDF)

Low-Temperature Insertion Bonding using Electroless Cu-Co-P Micro-Cones Array with Controllable Morphology

Electronic Materials Letters, 2021, 17(6), , pp.459-470

2021

Volltextzugriff (PDF)

Preparation and characterization of a titanium-substituted hydroxyapatite photocatalyst

Journal of molecular catalysis. A, Chemical, 2007-04, Vol.267 (1), p.79-85

2007

Volltextzugriff (PDF)

Sub-surface Damage of Ultra-Thin Monocrystalline Silicon Wafer Induced by Dry Polishing

Electronic Materials Letters, 2020, 16(4), , pp.355-362

2020

Volltextzugriff (PDF)

Superhydrophobic nickel films fabricated by electro and electroless deposition

Applied surface science, 2012-02, Vol.258 (8), p.3643-3646

2012

Volltextzugriff (PDF)

Effects of Sn grain size on intermetallic compounds formation in 5 µm diameter Cu/Sn pillar bumps

Journal of materials science. Materials in electronics, 2018-11, Vol.29 (22), p.19484-19490

2018

Volltextzugriff (PDF)

Low-temperature solid state bonding method based on surface Cu–Ni alloying microcones

Applied surface science, 2013-03, Vol.268, p.368-372

2013

Volltextzugriff (PDF)

Adhesion improvement of Cu-based substrate and epoxy molding compound interface by hierarchical structure preparation

Microelectronics and reliability, 2012-06, Vol.52 (6), p.1157-1164

2012

Volltextzugriff (PDF)

Electrochemical Corrosion Behaviors of Sn-9Zn-3Bi-xCr Solder in 3.5% NaCl Solution

Journal of electronic materials, 2011-07, Vol.40 (7), p.1556-1562

2011

Volltextzugriff (PDF)

Structural control of a cobalt nanocone array grown by directional electrodeposition

CrystEngComm, 2010-01, Vol.12 (1), p.2799-282

2010

Volltextzugriff (PDF)

1 – 25 von 378

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(294)
Mit Volltextzugriff
(318)

Publikationsform

Sprache

Erscheinungsjahr

n.n

Thema

Science & Technology
(258)
Technology
(154)
Physical Sciences
(151)
Materials Science
(117)
Materials Science, Multidisciplinary
(84)
Physics
(71)
Chemistry
(67)
Physics, Applied
(60)
Copper
(54)
Engineering
(53)
Chemistry, Physical
(43)
Exact Sciences And Technology
(43)
Tin
(40)
Engineering, Electrical & Electronic
(37)
Life Sciences & Biomedicine
(32)
Meteorology & Atmospheric Sciences
(32)
Intermetallic Compounds
(31)
Nickel
(30)
Physics, Condensed Matter
(30)
Science & Technology - Other Topics
(30)

15 weitere anzeigen...

Weniger anzeigen...

Neu hinzugefügt

... seit 30 Tagen
(1)
... seit 90 Tagen
(12)

Menü

Weitere Dienste

Einstellungen

Application of AI in in Multilevel Pain Assessment Using Facial Images: Systematic Review and Meta-Analysis

Correction: Application of AI in Multilevel Pain Assessment Using Facial Images: Systematic Review and Meta-Analysis

Super-hydrophilicity to super-hydrophobicity transition of a surface with Ni micro–nano cones array

Effect of Co-W and Co-Fe-W Diffusion Barriers on the Reliability of the Solder/Cu Interface during Reflow Conditions

Electrodeposited Palladium Coating on Co Micro-Nano Cones Array for Low-Temperature Solid-State Bonding

Super-hydrophobic nickel films with micro-nano hierarchical structure prepared by electrodeposition

Competitive Effect of Leveler's Electrochemical Behavior and Impurity on Electrical Resistance of Electroplated Copper

A facile process for preparing superhydrophobic nickel films with stearic acid

Mitigation and Mechanism of Tin Whisker on Micro-bumps by Hard and Soft Underfills

Effects of W contents on the solid-state interfacial reactions of Sn/Co-W

Inhibiting effects of the Ni barrier layer on the growth of porous Cu3Sn in 10-μm microbumps

Study on the properties of Sn–9Zn– xCr lead-free solder

Electrodeposited nanostructured cobalt film and its dual modulation of both superhydrophobic property and adhesiveness

Study on melt properties, microstructure, tensile properties of low Ag content Sn–Ag–Zn Lead-free solders

Facile synthesis of petal-like nanocrystalline Co3O4 film using direct high-temperature oxidation

Effect of Sn surface diffusion on growth behaviors of intermetallic compounds in cu/Ni/SnAg microbumps

Low-Temperature Insertion Bonding using Electroless Cu-Co-P Micro-Cones Array with Controllable Morphology

Preparation and characterization of a titanium-substituted hydroxyapatite photocatalyst

Sub-surface Damage of Ultra-Thin Monocrystalline Silicon Wafer Induced by Dry Polishing

Superhydrophobic nickel films fabricated by electro and electroless deposition

Effects of Sn grain size on intermetallic compounds formation in 5 µm diameter Cu/Sn pillar bumps

Low-temperature solid state bonding method based on surface Cu–Ni alloying microcones

Adhesion improvement of Cu-based substrate and epoxy molding compound interface by hierarchical structure preparation

Electrochemical Corrosion Behaviors of Sn-9Zn-3Bi-xCr Solder in 3.5% NaCl Solution

Structural control of a cobalt nanocone array grown by directional electrodeposition

Suchergebnisse filtern