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A review on microwave-assisted production of biodiesel

Renewable & sustainable energy reviews, 2012-09, Vol.16 (7), p.4719-4733

2012

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A review on two-phase ejector as an expansion device in vapor compression refrigeration cycle

Renewable & sustainable energy reviews, 2012-09, Vol.16 (7), p.4927-4937

2012

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The influence of Fe2O3 nano-reinforced SAC lead-free solder in the ultra-fine electronics assembly

International journal of advanced manufacturing technology, 2018-04, Vol.96 (1-4), p.717-733

2018

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Fluoride content of commercial drinking water and carbonated soft drinks available in Southeastern Nigeria: dental and public health implications

Nigerian journal of clinical practice, 2020-01, Vol.23 (1), p.65-70

2020

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Anaesthesiology and perioperative medicine around the world: different names, same goals

British journal of anaesthesia : BJA, 2015-01, Vol.114 (1), p.8-9

2015

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Consumption of fruits and vegetables among adolescents: a multi-national comparison of eleven countries in the Eastern Mediterranean Region

British journal of nutrition, 2016-03, Vol.115 (6), p.1092-1099

2016

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CFD modeling of pin shape effects on capillary flow during wave soldering

International journal of heat and mass transfer, 2014-05, Vol.72, p.400-410

2014

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Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering

Microelectronics and reliability, 2017-12, Vol.79, p.69-78

2017

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Detection of the Level of Interleukin-8 in the Serum of Burn Patients by ELISA Technique

Archives of Razi Institute, 2023-06, Vol.78 (3), p.1087

2023

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Hydrophobicity performance of polyethylene terephthalate (PET) and thermoplastic polyurethane (TPU) with thermal effect

Materials research express, 2018-09, Vol.5 (9), p.96304

2018

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Thermal stability evaluation of palm oil as energy transport media

Energy conversion and management, 2005-08, Vol.46 (13), p.2198-2215

2005

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Finite volume-based simulation of the wave soldering process: Influence of the conveyor angle on pin-through-hole capillary flow

Numerical heat transfer. Part A, Applications, 2016-02, Vol.69 (3), p.295-310

2016

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Prevalence of physically active and sedentary adolescents in 10 Eastern Mediterranean countries and its relation with age, sex, and body mass index

Journal of physical activity & health, 2015-02, Vol.12 (2), p.257-265

2015

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A comparison of Al-Fe pillared Iraqi clays for Catalytic wet air oxidation

IOP conference series. Materials Science and Engineering, 2019-08, Vol.579 (1), p.12045

2019

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Influence of pin offset in PCB through-hole during wave soldering process: CFD modeling approach

International communications in heat and mass transfer, 2013-11, Vol.48, p.116-123

2013

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Consumption of fruits and vegetables among adolescents: a multi-national comparison of eleven countries in the Eastern Mediterranean Region

British journal of nutrition, 2016-11, Vol.116 (10), p.1799-1806

2016

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Lattice Boltzmann method study of bga bump arrangements on void formation

Microelectronics and reliability, 2016-01, Vol.56, p.170-181

2016

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Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings

Microelectronics and reliability, 2017-05, Vol.72, p.45-64

2017

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Effect of ILU dispensing types for different solder bump arrangements on CUF encapsulation process

Microelectronic engineering, 2016-09, Vol.163, p.83-97

2016

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Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method

Microelectronics and reliability, 2012-06, Vol.52 (6), p.1143-1152

2012

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Study on the fluid/structure interaction at different inlet pressures in molded packaging

Microelectronic engineering, 2011-10, Vol.88 (10), p.3182-3194

2011

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Discrete phase method particle simulation of ultra-fine package assembly with SAC305-TiO2 nano-reinforced lead free solder at different weighted percentages

Microelectronics and reliability, 2017-12, Vol.79, p.336-351

2017

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Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process

Soldering & surface mount technology, 2012-01, Vol.24 (2), p.77-91

2012

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FVM based numerical study on the effect of solder bump arrangement on capillary driven flip chip underfill process

International communications in heat and mass transfer, 2010-03, Vol.37 (3), p.281-286

2010

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Rheology of bio-edible oils according to several rheological models and its potential as hydraulic fluid

Industrial crops and products, 2005-11, Vol.22 (3), p.249-255

2005

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A review on microwave-assisted production of biodiesel

A review on two-phase ejector as an expansion device in vapor compression refrigeration cycle

The influence of Fe2O3 nano-reinforced SAC lead-free solder in the ultra-fine electronics assembly

Fluoride content of commercial drinking water and carbonated soft drinks available in Southeastern Nigeria: dental and public health implications

Anaesthesiology and perioperative medicine around the world: different names, same goals

Consumption of fruits and vegetables among adolescents: a multi-national comparison of eleven countries in the Eastern Mediterranean Region

CFD modeling of pin shape effects on capillary flow during wave soldering

Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering

Detection of the Level of Interleukin-8 in the Serum of Burn Patients by ELISA Technique

Hydrophobicity performance of polyethylene terephthalate (PET) and thermoplastic polyurethane (TPU) with thermal effect

Thermal stability evaluation of palm oil as energy transport media

Finite volume-based simulation of the wave soldering process: Influence of the conveyor angle on pin-through-hole capillary flow

Prevalence of physically active and sedentary adolescents in 10 Eastern Mediterranean countries and its relation with age, sex, and body mass index

A comparison of Al-Fe pillared Iraqi clays for Catalytic wet air oxidation

Influence of pin offset in PCB through-hole during wave soldering process: CFD modeling approach

Consumption of fruits and vegetables among adolescents: a multi-national comparison of eleven countries in the Eastern Mediterranean Region

Lattice Boltzmann method study of bga bump arrangements on void formation

Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings

Effect of ILU dispensing types for different solder bump arrangements on CUF encapsulation process

Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method

Study on the fluid/structure interaction at different inlet pressures in molded packaging

Discrete phase method particle simulation of ultra-fine package assembly with SAC305-TiO2 nano-reinforced lead free solder at different weighted percentages

Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process

FVM based numerical study on the effect of solder bump arrangement on capillary driven flip chip underfill process

Rheology of bio-edible oils according to several rheological models and its potential as hydraulic fluid

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