UB Paderborn / Katalog / Suche / in CDI

Sortiert nach

Einfacher Volltextzugriff von (fast) überall

Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...

Fabrication and characterization of robust through-silicon vias for silicon-carrier applications

IBM journal of research and development, 2008-11, Vol.52 (6), p.571-581

2008

Volltextzugriff (PDF)

Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection

IBM journal of research and development, 2005-07, Vol.49 (4.5), p.725-753

2005

Volltextzugriff (PDF)

Three-dimensional silicon integration

IBM journal of research and development, 2008-11, Vol.52 (6), p.553-569

2008

Volltextzugriff (PDF)

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections

IBM journal of research and development, 2008-11, Vol.52 (6), p.611-622

2008

Volltextzugriff (PDF)

3D chip stacking with C4 technology

IBM journal of research and development, 2008-11, Vol.52 (6), p.599-609

2008

Volltextzugriff (PDF)

Dry Vertical Alignment Method for Multi-domain Homeotropic Thin-Film-Transistor Liquid Crystal Displays

Japanese Journal of Applied Physics, 2001-12, Vol.40 (12R), p.6913

2001

Volltextzugriff (PDF)

Epitaxial film thickness in the low-temperature growth of Si(100) by plasma enhanced chemical vapor deposition

Applied physics letters, 1996-01, Vol.68 (3), p.349-351

1996

Volltextzugriff (PDF)

Comparison of diamond-like carbon film deposition by electron cyclotron resonance with benzene and methane

Journal of materials research, 1996-01, Vol.11 (1), p.221-228

1996

Volltextzugriff (PDF)

Low-temperature homoepitaxial growth of Si by electron cyclotron resonance plasma enhanced chemical vapor deposition

Applied physics letters, 1995-08, Vol.67 (7), p.971-973

1995

Volltextzugriff (PDF)

Erbium-doped silicon films grown by plasma-enhanced chemical-vapor deposition

Journal of applied physics, 1995-11, Vol.78 (10), p.6241-6248

1995

Volltextzugriff (PDF)

3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias

IEEE journal of solid-state circuits, 2006-08, Vol.41 (8), p.1718-1725

2006

Volltextzugriff (PDF)

An 8x 10-Gb/s Source-Synchronous I/O System Based on High-Density Silicon Carrier Interconnects

IEEE journal of solid-state circuits, 2012-04, Vol.47 (4), p.884-896

2012

Volltextzugriff (PDF)

2.5D and 3D technology challenges and test vehicle demonstrations

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.1068-1076

2012

Volltextzugriff (PDF)

Atomic-beam alignment of inorganic materials for liquid-crystal displays

Nature (London), 2001-05, Vol.411 (6833), p.56-59

2001

Volltextzugriff (PDF)

IMC bonding for 3D interconnection

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), 2010, p.864-871

2010

Volltextzugriff (PDF)

The Role of Working Capital Utilisation and Profit Margin Control on Net Income at PT Perkebunan Nusantara III (Persero)

IJEDR: Indonesian Journal of Education and Development Research, 2024-07, Vol.2 (2), p.888-893

2024

Volltextzugriff (PDF)

Computer Vision and Robotics: Proceedings of CVR 2022

1, 2023

Volltextzugriff (PDF)

Growth of Er-doped silicon using metalorganics by plasma-enhanced chemical vapor deposition

Journal of applied physics, 1996-07, Vol.80 (1), p.551-558

1996

Volltextzugriff (PDF)

Computer Vision and Robotics: Proceedings of CVR 2021

1, 2022

Volltextzugriff (PDF)

Advances in Nature and Biologically Inspired Computing: Proceedings of the 7th World Congress on Nature and Biologically Inspired Computing (NaBIC2015) in Pietermaritzburg, South Africa, Held December 01-03 2015

1st ed. 2016, 2015

Volltextzugriff (PDF)

Investigations of Cu bond structures and demonstration of a wafer-level 3D integration scheme with W TSVs

Proceedings of 2010 International Symposium on VLSI Technology, System and Application, 2010, p.162-163

2010

Volltextzugriff (PDF)

Modeling Insurance Fraud Detection Using Imbalanced Data Classification

Advances in Nature and Biologically Inspired Computing, 2015, Vol.419, p.117-127

2015

Volltextzugriff (PDF)

A Variable Neighbourhood Search for the Workforce Scheduling and Routing Problem

Advances in Nature and Biologically Inspired Computing, 2015, Vol.419, p.247-259

2015

Volltextzugriff (PDF)

3D silicon integration

2008 58th Electronic Components and Technology Conference, 2008, p.538-543

2008

Volltextzugriff (PDF)

A Priority Rate-Based Routing Protocol for Wireless Multimedia Sensor Networks

Advances in Nature and Biologically Inspired Computing, 2015, Vol.419, p.347-358

2015

Volltextzugriff (PDF)

1 – 25 von 644

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(358)
Mit Volltextzugriff
(553)

Publikationsform

1 weiteren anzeigen...

Weniger anzeigen...

Sprache

1 weiteren anzeigen...

Weniger anzeigen...

Erscheinungsjahr

n.n

Thema

Science & Technology
(342)
Technology
(216)
Computer Science
(185)
Computer Science, Artificial Intelligence
(164)
Computer Science, Theory & Methods
(161)
Humans
(120)
Life Sciences & Biomedicine
(111)
Engineering
(85)
Engineering, Electrical & Electronic
(72)
Female
(68)
Artificial Intelligence
(62)
Male
(60)
Biological And Medical Sciences
(58)
Medical Sciences
(53)
Middle Aged
(51)
Adult
(43)
Aged
(38)
Silicon
(23)
Physical Sciences
(22)
Physics
(20)

15 weitere anzeigen...

Weniger anzeigen...

Neu hinzugefügt

... seit 90 Tagen
(1)

Menü

Weitere Dienste

Einstellungen

Fabrication and characterization of robust through-silicon vias for silicon-carrier applications

Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection

Three-dimensional silicon integration

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections

3D chip stacking with C4 technology

Dry Vertical Alignment Method for Multi-domain Homeotropic Thin-Film-Transistor Liquid Crystal Displays

Epitaxial film thickness in the low-temperature growth of Si(100) by plasma enhanced chemical vapor deposition

Comparison of diamond-like carbon film deposition by electron cyclotron resonance with benzene and methane

Low-temperature homoepitaxial growth of Si by electron cyclotron resonance plasma enhanced chemical vapor deposition

Erbium-doped silicon films grown by plasma-enhanced chemical-vapor deposition

3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias

An 8x 10-Gb/s Source-Synchronous I/O System Based on High-Density Silicon Carrier Interconnects

2.5D and 3D technology challenges and test vehicle demonstrations

Atomic-beam alignment of inorganic materials for liquid-crystal displays

IMC bonding for 3D interconnection

The Role of Working Capital Utilisation and Profit Margin Control on Net Income at PT Perkebunan Nusantara III (Persero)

Computer Vision and Robotics: Proceedings of CVR 2022

Growth of Er-doped silicon using metalorganics by plasma-enhanced chemical vapor deposition

Computer Vision and Robotics: Proceedings of CVR 2021

Advances in Nature and Biologically Inspired Computing: Proceedings of the 7th World Congress on Nature and Biologically Inspired Computing (NaBIC2015) in Pietermaritzburg, South Africa, Held December 01-03 2015

Investigations of Cu bond structures and demonstration of a wafer-level 3D integration scheme with W TSVs

Modeling Insurance Fraud Detection Using Imbalanced Data Classification

A Variable Neighbourhood Search for the Workforce Scheduling and Routing Problem

3D silicon integration

A Priority Rate-Based Routing Protocol for Wireless Multimedia Sensor Networks

Suchergebnisse filtern