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Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges

Microelectronics and reliability, 2011-12, Vol.51 (12), p.2031-2043

2011

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Investigations on microhardness of Sn–Zn based lead-free solder alloys as replacement of Sn–Pb solder

Journal of alloys and compounds, 2005-04, Vol.392 (1), p.149-158

2005

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Electrochemical corrosion study of Pb-free solders

Journal of materials research, 2006-01, Vol.21 (1), p.62-70

2006

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Adhesion strength and contact resistance of flip chip on flex packages––effect of curing degree of anisotropic conductive film

Microelectronics and reliability, 2004-03, Vol.44 (3), p.505-514

2004

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Effect of multiple reflow processes on the reliability of ball grid array (BGA) solder joints

Journal of alloys and compounds, 2006-04, Vol.414 (1), p.123-130

2006

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Reliability study of the electroless Ni–P layer against solder alloy

Microelectronics and reliability, 2002-07, Vol.42 (7), p.1065-1073

2002

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Elimination of Au-embrittlement in solder joints on Au/Ni metallization

Journal of materials research, 2004-05, Vol.19 (5), p.1303-1306

2004

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Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni–P by the molten Sn3.5Ag0.5Cu solder alloy

Microelectronics and reliability, 2003-12, Vol.43 (12), p.2031-2037

2003

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The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications

Microelectronics and reliability, 2003-04, Vol.43 (4), p.625-633

2003

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Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages

Microelectronics and reliability, 2004-02, Vol.44 (2), p.295-302

2004

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Contact resistance and adhesion performance of ACF interconnections to aluminum metallization

Microelectronics and reliability, 2003-08, Vol.43 (8), p.1303-1310

2003

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Effect of 0.5 wt% Cu in Sn-3.5%Ag Solder to Retard Interfacial Reactions With the Electroless Ni-P Metallization for BGA Solder Joints Application

IEEE transactions on components and packaging technologies, 2008-06, Vol.31 (2), p.431-438

2008

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Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device

Microelectronics and reliability, 2012-07, Vol.52 (7), p.1409-1419

2012

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Modelling methodology for thermal analysis of hot solder dip process

Microelectronics and reliability, 2013-08, Vol.53 (8), p.1055-1067

2013

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The effect of thermal cycling on the contact resistance of anisotropic conductive joints

Soldering & surface mount technology, 2005-01, Vol.17 (3), p.20-31

2005

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High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints

Acta materialia, 2006-02, Vol.54 (3), p.613-621

2006

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Solid-state growth kinetics of Ni{sub 3}Sn{sub 4} at the Sn-3.5Ag solder/Ni interface

Journal of applied physics, 2005-12, Vol.98 (12)

2005

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Fracture mechanics analysis of solder joint intermetallic compounds in shear test

Computational materials science, 2009-04, Vol.45 (2), p.576-583

2009

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Advanced Adhesives in Electronics: Materials, Properties and Applications

1, 2011

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Joule Heating Enhanced Phase Coarsening in Sn37Pb and Sn3.5Ag0.5Cu Solder Joints during Current Stressing

Journal of electronic materials, 2008-04, Vol.37 (4), p.469-476

2008

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Shearing tests of solder joints on tape ball grid array substrates

Journal of materials research, 2006-09, Vol.21 (9), p.2224-2231

2006

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Solid state growth kinetics of complex intermetallics in the Pb-free ball grid array (BGA) solder joint for MEMS packaging

2006 8th Electronics Packaging Technology Conference, 2006, p.211-213

2006

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Reliability of anisotropic conductive joints for bumpless flip-chip on flex packages under thermal stresses

Journal of microelectronics and electronic packaging, 2005-10, Vol.2 (4), p.269-280

2005

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Phycoremediation of arsenic by Chlorella sp. CB4

Environmental Arsenic in a Changing World, 2019, p.597-598

1, 2019

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Effects of intermetallic compounds on properties of Sn-Cu lead-free soldered joints

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC, 2005, p.185-191

2005

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Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges

Investigations on microhardness of Sn–Zn based lead-free solder alloys as replacement of Sn–Pb solder

Electrochemical corrosion study of Pb-free solders

Adhesion strength and contact resistance of flip chip on flex packages––effect of curing degree of anisotropic conductive film

Effect of multiple reflow processes on the reliability of ball grid array (BGA) solder joints

Reliability study of the electroless Ni–P layer against solder alloy

Elimination of Au-embrittlement in solder joints on Au/Ni metallization

Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni–P by the molten Sn3.5Ag0.5Cu solder alloy

The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications

Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages

Contact resistance and adhesion performance of ACF interconnections to aluminum metallization

Effect of 0.5 wt% Cu in Sn-3.5%Ag Solder to Retard Interfacial Reactions With the Electroless Ni-P Metallization for BGA Solder Joints Application

Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device

Modelling methodology for thermal analysis of hot solder dip process

The effect of thermal cycling on the contact resistance of anisotropic conductive joints

High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints

Solid-state growth kinetics of Ni{sub 3}Sn{sub 4} at the Sn-3.5Ag solder/Ni interface

Fracture mechanics analysis of solder joint intermetallic compounds in shear test

Advanced Adhesives in Electronics: Materials, Properties and Applications

Joule Heating Enhanced Phase Coarsening in Sn37Pb and Sn3.5Ag0.5Cu Solder Joints during Current Stressing

Shearing tests of solder joints on tape ball grid array substrates

Solid state growth kinetics of complex intermetallics in the Pb-free ball grid array (BGA) solder joint for MEMS packaging

Reliability of anisotropic conductive joints for bumpless flip-chip on flex packages under thermal stresses

Phycoremediation of arsenic by Chlorella sp. CB4

Effects of intermetallic compounds on properties of Sn-Cu lead-free soldered joints

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